Taconic TLX-6 DK2.65 High Performance PTFE Fiberglass Reinforced Microwave Substrate
Product Overview
Taconic TLX-6 is a high-performance PTFE fiberglass reinforced microwave substrate engineered by AGC, standing as a robust solution for demanding RF and microwave applications that require a 2.65 dielectric constant (Dk) at 10 GHz—the highest Dk value in the TLX product line. Crafted with woven fiberglass reinforcement and optimized PTFE laminates, it delivers exceptional mechanical rigidity, thermal stability, and environmental resilience, making it a premier choice for low layer count microwave designs where a higher fixed Dk is critical for component performance.
This TLX-6 substrate excels in extreme operating conditions, with inherent resistance to creep, high temperatures, radiation, and harsh marine/aviation environments. Its tightly controlled dielectric properties, ultra-low dissipation factor, and superior PIM performance (≤-160 dBc) ensure reliable signal transmission, while the optimized surface finish maximizes copper cladding adhesion for consistent PCB fabrication. TLX-6 DK2.65 PTFE laminate is NASA-qualified for low outgassing, boasting a proven space heritage, and is UL 94 V-0 rated for flame resistance, further expanding its applicability across aerospace, defense, telecommunications, and industrial microwave systems.
Core Advantages
Industry-leading 2.65 Dk @10 GHz (±0.04 tolerance) with tight thermal stability (±2% Dk variation from -55°C to 125°C)
1)Exceptional PIM performance (measured < -160 dBc at 800/1800 MHz, 20W per channel)
2)NASA-qualified low outgassing properties for aerospace/space applications
3)UL 94 V-0 flame rating & excellent resistance to extreme environments (vibration, radiation, high temp, marine)
4)Tightly controlled dielectric properties (low Df) & minimal moisture absorption (0.02%)
5)Superior mechanical strength (flexural/tensile) for rigid PCB designs
6)Optimized surface for high copper cladding adhesion (compatible with all AGC copper claddings)
7)Dimensionally stable across temperature cycles & fabrication processes
8)Available in thin laminate options for coupler-type RF component designs
Key Application Scenarios
TLX-6 laminate is tailored for RF/microwave designs requiring a 2.65 Dk and robust environmental performance, including:
Aerospace radar systems & satellite communication components
Warship marine antennas & maritime microwave transmission devices
Engine module high-temperature microwave sensors
RF couplers, splitters, combiners & high-power amplifiers
Microwave test equipment & industrial RF transceivers
Altimeter substrates for aviation/aircraft systems
Passive RF components for mobile communications infrastructure
TLX-6 Key Electrical & Thermal Typical Values
|
Property
|
Test Method
|
Test Condition
|
Typical Value
|
|
Dielectric Constant (Dk)
|
IPC-650 2.5.5.3
|
@10 GHz
|
2.65
|
|
Dissipation Factor (Df)
|
IPC-650 2.5.5.5.1
|
@1.9 GHz
|
0.0016
|
|
Dissipation Factor (Df)
|
IPC-650 2.5.5.5.1
|
@10 GHz
|
0.0022
|
|
Dielectric Breakdown
|
IPC-650 2.5.6
|
-
|
>45 kV
|
|
Moisture Absorption
|
IPC-650 2.6.2.1
|
-
|
0.02%
|
|
Thermal Conductivity
|
ASTM F433/ASTM 1530-06
|
-
|
0.19 W/M*K
|
|
CTE (X axis)
|
IPC-650 2.4.41/ASTM D 3386
|
25-260°C
|
21 ppm/°C
|
|
CTE (Y axis)
|
IPC-650 2.4.41/ASTM D 3386
|
25-260°C
|
23 ppm/°C
|
|
CTE (Z axis)
|
IPC-650 2.4.41/ASTM D 3386
|
25-260°C
|
215 ppm/°C
|
|
Td (2% Weight Loss)
|
IPC-650 2.4.24.6 (TGA)
|
-
|
535 °C
|
|
Td (5% Weight Loss)
|
IPC-650 2.4.24.6 (TGA)
|
-
|
553 °C
|
|
Surface Resistivity (Elevated Temp.)
|
IPC-650 2.5.17.1 Sec 5.2.1
|
Elevated Temp.
|
6.605 x 10⁸ Mohm
|
|
Surface Resistivity (Humidity Cond.)
|
IPC-650 2.5.17.1 Sec 5.2.1
|
Humidity Cond.
|
3.550 x 10⁶ Mohm
|
|
Volume Resistivity (Elevated Temp.)
|
IPC-650 2.5.17.1 Sec 5.2.1
|
Elevated Temp.
|
1.110 x 10¹⁰ Mohm/cm
|
|
Volume Resistivity (Humidity Cond.)
|
IPC-650 2.5.17.1 Sec 5.2.1
|
Humidity Cond.
|
1.046 x 10¹⁰ Mohm/cm
|
|
Flammability Rating
|
UL 94
|
-
|
V-0
|
TLX-6 Outgassing Properties (NASA Qualified)
|
Property
|
Test Method
|
Test Condition
|
Unit
|
Typical Value
|
|
Total Mass Loss (TML)
|
ASTM E 595
|
24H @257°F, ≤5 x 10⁻⁵ Torr
|
%
|
0.09
|
|
Collected Volatile Condensable Materials (CVCM)
|
ASTM E 595
|
24H @257°F, ≤5 x 10⁻⁵ Torr
|
%
|
<0.01
|
|
Water Vapor Regained (WVR)
|
ASTM E 595
|
24H @257°F, ≤5 x 10⁻⁵ Torr
|
%
|
0.06
|
TLX-6 Mechanical Typical Values
|
Property
|
Test Method
|
Direction
|
Typical Value (psi)
|
Typical Value (N/mm²)
|
|
Flexural Strength
|
ASTM D 790
|
MD (Machine)
|
28,900
|
199
|
|
Flexural Strength
|
ASTM D 790
|
CD (Cross)
|
20,600
|
142
|
|
Tensile Strength
|
ASTM D 902
|
MD (Machine)
|
35,600
|
245
|
|
Tensile Strength
|
ASTM D 902
|
CD (Cross)
|
27,500
|
190
|
|
Elongation at Break
|
ASTM D 902
|
MD (Machine)
|
3.94%
|
3.94%
|
|
Elongation at Break
|
ASTM D 902
|
CD (Cross)
|
3.92%
|
3.92%
|
|
Young’s Modulus
|
ASTM D 902
|
MD (Machine)
|
980 kpsi
|
6757
|
|
Young’s Modulus
|
ASTM D 902
|
CD (Cross)
|
1,200 kpsi
|
8274
|
|
Young’s Modulus
|
ASTM D 3039
|
MD (Machine)
|
1,630 kpsi
|
11,238
|
|
Poisson’s Ratio
|
ASTM D 3039
|
-
|
0.135
|
0.135
|
|
Density (Specific Gravity)
|
ASTM D 792
|
-
|
2.25 g/cm³
|
2.25 g/cm³
|
TLX-6 Peel Strength (Copper Adhesion)
|
Property
|
Test Method
|
Copper Specification
|
Typical Value (lbs/in)
|
Typical Value (N/mm)
|
|
Peel Strength
|
IPC-650 2.4.8 Sec 5.2.2 (Thermal Stress)
|
1 oz. ED
|
15
|
2.63
|
|
Peel Strength
|
IPC-650 2.4.8 Sec 5.2.2 (Thermal Stress)
|
1 oz. RTF
|
17
|
2.98
|
|
Peel Strength
|
IPC-650 2.4.8.3 (Elevated Temp.)
|
½ oz. ED
|
14
|
2.45
|
|
Peel Strength
|
IPC-650 2.4.8 Sec 5.2.2 (Thermal Stress)
|
½ oz. ED
|
11
|
1.93
|
|
Peel Strength
|
IPC-650 2.4.8 Sec 5.2.2 (Thermal Stress)
|
1 oz. rolled
|
13
|
2.28
|
TLX-6 Dimensional Stability
|
Property
|
Test Method
|
Condition
|
Direction
|
Typical Value (mils/in)
|
Typical Value (mm/M)
|
|
Dimensional Stability
|
IPC-650 2.4.39 Sec 5.4
|
After Bake
|
MD (Machine)
|
0.06
|
0.06
|
|
Dimensional Stability
|
IPC-650 2.4.39 Sec 5.4
|
After Bake
|
CD (Cross)
|
0.08
|
0.08
|
|
Dimensional Stability
|
IPC-650 2.4.39 Sec 5.5
|
Thermal Stress
|
MD (Machine)
|
0.09
|
0.09
|
|
Dimensional Stability
|
IPC-650 2.4.39 Sec 5.5
|
Thermal Stress
|
CD (Cross)
|
0.1
|
0.1
|
TLX-6 Product Specifications
|
Designation
|
Dk (±0.04)
|
Dielectric Thickness (Inches)
|
Dielectric Thickness (mm)
|
|
TLX-6
|
2.65
|
0.0035 - 0.250
|
0.089 - 6.35
|
Available Sheet Sizes
|
Inches
|
Millimeters (mm)
|
|
12 x 18
|
304 x 457
|
|
16 x 18
|
406 x 457
|
|
18 x 24
|
457 x 610
|
|
16 x 36
|
406 x 914
|
|
24 x 36
|
610 x 914
|
|
18 x 48
|
457 x 1220
|
|
36 x 48
|
914 x 1220
|
Part Number Example
TLX-6-0310-CH/CH - 18" x 24" (457 mm x 610 mm)
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