F4BME245 Wangling DK2.45 F4BME Series Reversed RTF Copper Foil Substrate

F4BME245 Wangling DK2.45 F4BME Series Reversed RTFCopper Foil Substrate

Overview

Engineered for high-frequency RF applications demanding stringent PIM performance, F4BME245 is a premium PTFE-based copper clad laminate manufactured by Taizhou Wangling Insulation Material Factory. Crafted from high-purity PTFE resin, high-performance glass fiber cloth and PTFE film via precision compounding and high-pressure hot pressing, this laminate is paired exclusively withreversed RTF copper foil—a tailored material combination that delivers exceptional passive intermodulation characteristics, ultra-precise circuit patterning and minimized conductor loss, setting it apart from standard high-frequency substrates.

By fine-tuning the PTFE-to-glass fiber ratio, Wangling F4BME245 achieves a precisely controlled dielectric constant of 2.45 (10GHz), alongside enhanced dimensional stability, low thermal expansion and consistent electrical performance across extreme temperatures. It outperforms traditional F4B series PCB materials in dielectric loss and insulation resistance, and is a cost-effective alternative to imported high-frequency laminates, with full commercial mass production capacity to support large-scale PCB manufacturing needs.

Key Advantages

✅Optimized with reversed RTF copper foil, boasting superior PIM performance (≤-159dBc) for high-precision RF systems

✅Precise dielectric constant (2.45@10GHz) with tight tolerance (±0.05) for stable high-frequency signal transmission

✅Ultra-low dielectric loss (0.0012@10GHz, 0.0017@20GHz) to reduce signal attenuation in RF circuits

✅Reliable copper foil adhesion (>1.6N/mm for 1OZ) with no delamination under extreme thermal stress

✅Excellent temperature stability of dielectric properties (-120PPM/℃, -55℃~150℃) for harsh environment operation

✅Superior electrical insulation (volume resistivity≥6×10⁶MΩ.cm) and high breakdown strength

✅UL-94 V-0 flame retardant, anti-radiation and low outgassing, compliant with aerospace/communication material specs

✅Flexible customization of size and thickness, with short lead times for both standard and custom orders

Target Applications

F4BME245 laminate is the ideal substrate for high-precision RF/microwave components requiring strict PIM control, including:

• Phased array antennas, satellite communication and aerospace RF feed networks
• High-performance base station antennas, power dividers, couplers and combiners
• Microwave/radar systems and RF front-end passive devices (phase shifters, filters)
• 5G/6G high-frequency communication equipment and precision RF test instruments
• High-power RF modules with electromagnetic shielding and heat dissipation requirements

F4BME245 Technical Specifications

Test Standard Remarks

• Dielectric constant is tested on the material's Z-direction, following GB/T 12636-1990 or IPC-TM650 2.5.5.5 strip line method;
• All other properties are tested in accordance with or referenced to IPC-TM-650 or GBT4722-2017 
• Data shown are typical measured values for material selection only, not a guarantee of performance in specific applications. Customers shall verify suitability for their intended use.

Copper Foil Options

F4B DK2.45 laminate is dedicatedly paired with reversed RTF copper foil, with standard available thicknesses as below (no other copper foil types for this model):

Dimensional Customization

Standard Panel Sizes

Mass supply for regular dimensions; non-standard sizes available via factory consultation:

460×610mm | 500×600mm | 850×1200mm | 914×1220mm | 1000×1200mm

Critical Note: For panels with dielectric/copper-clad total thickness≥4.0mm or≤0.2mm, maximum panel size is limited to 500×610mm to ensure machining performance.

Thickness & Tolerance

Customization available for dielectric-only thickness or total copper-clad thickness—please specify the type clearly when ordering. Conventional specs are as follows:

 Thickness Highlight: With Dk≤2.65, F4BME245 offers a minimum dielectric-only thickness of 0.1mm, ideal for thin-layer, high-density high-frequency PCB design.

Metal-Based Composite Laminates

F4BME245 PCB substrate can be customized into aluminum-based/copper-based laminates (models: F4BME245-AL / F4BME245-CU), featuring reversed RTF copper foil on one side and aluminum/copper base on the other of the PTFE dielectric layer. This structure integrates electromagnetic shielding and high-efficiency heat dissipation, perfectly suited for high-power, PIM-constrained RF PCB manufacturing.