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Home Copper Clad Laminates Taconic TLX-8 DK2.55 High-Volume Fiberglass Reinforced RF Microwave Substrate

Taconic TLX-8 DK2.55 High-Volume Fiberglass Reinforced RF Microwave Substrate

Taconic TLX-8 is a high-performancefiberglass reinforced microwave substrate engineered for high-volume RF/microwave applications.

  • Item NO.:

    BIC-521-v606.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Taconic TLX-8 DK2.55 High-Volume Fiberglass Reinforced RF Microwave Substrate

 

Taconic TLX-8 is a high-performancefiberglass reinforced microwave substrate engineered for high-volume RF/microwave applications, boasting a PTFE-based fiberglass laminate structure that delivers exceptional reliability across diverse operating conditions. This Taconic substrate is optimized for low-layer count microwave circuit designs, with a dielectric constant (Dk) range of 2.45-2.65 that is tightly controlled and exhibits minimal variation across temperature extremes.

 

What sets TLX-8 laminate apart is its industry-leading performance in passive intermodulation (PIM), mechanical robustness, thermal stability, and environmental resistance—making it a staple material for critical RF components and systems that demand consistent performance in harsh operating environments.

 

With a proven track record in space applications and a NASA-qualified low-outgassing profile, TLX-8 PCB substrate excels in scenarios where substrates face severe stress, including high vibration, extreme temperatures, radiation exposure, and marine conditions. Its low moisture absorption, dimensional stability, and UL 94 V-0 flammability rating further enhance its suitability for aerospace, defense, mobile communications, and test equipment applications. For designs requiring even higher temperature stability of dielectric properties, TSM-DS3 is recommended as a complementary material option.

 

 

Core Advantages


  • Ultra-low PIM performance for PCBs (measured at less than -160 dBc*)
  • Superior mechanical strength and thermal stability for harsh environments
  • Low, stable, and tightly controlled dielectric constant (Dk)
  • Exceptional dimensional stability under thermal and mechanical stress
  • Negligible moisture absorption to prevent performance degradation
  • Low dissipation factor (DF) for minimal signal loss
  • UL 94 V-0 flammability rating for fire safety compliance
  • Tailored for low-layer count microwave circuit designs


 *Test conditions: Manufactured PCB coupon with 20 watts per channel at 800 and 1800 MHz.

 

 TLX-8 PCB substrate


Key Application Areas

 

TLX-8 DK2.55 Taconic substrate’s versatility and performance make it ideal for a broad range of RF/microwave components and systems, including:


  • RF Antennas (including warship, aerospace, and mobile communication antennas)
  • Microwave passive components: Mixers, splitters, filters, and combiners
  • Couplers, amplifiers, and custom passive RF assemblies
  • Radar systems, microwave test equipment, and transmission devices
  • Aerospace/space components (altimeter substrates, launch vehicle PWBs)
  • Engine module RF components (high-temperature exposure)
  • Marine defense RF systems (extreme sea environments)


 

Material Performance Specifications

All test data listed are typical values (not specification tolerances). For critical application tolerance requirements, contact AGC directly for official specifications.

 

Properties

Conditions

Typical Value

Unit

Test Method

Electrical Properties

Dielectric Constant

@ 10 GHz

2.55 ± 0.04

 

IPC-650 2.5.5.3

Dissipation Factor

@ 10 GHz

0.0018

 

IPC-650 2.5.5.5.1

Outgassing

% TML

0.03

4 H 257 °F @

ASTM E 595

% CVCM

0

≤5 x 10-5 Torr

% WVR

0.01

 

Surface Resistivity

-

6.605 x 108

Mohm

IPC-650 2.5.17.1 Sec. 5.2.1 (Elevated Temp.)

-

3.550 x 106

Mohm

IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.)

Volume Resistivity

-

1.110 x 1010

Mohm/cm

IPC-650 2.5.17.1 Sec. 5.2.1 (Elevated Temp.)

-

1.046 x 1010

Mohm/cm

IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.)

Dimensional Stability

MD

0.06

mm/M (mils/in)

IPC-650 2.4.39 Sec. 5.4 (After Bake)

CD

0.08

mm/M (mils/in)

MD

0.09

mm/M (mils/in)

IPC-650 2.4.39 Sec. 5.5 (Thermal Stress)

CD

0.1

mm/M (mils/in)

Thermal Properties

Thermal Conductivity

 

0.19

W/M*K

ASTM F433/ASTM 1530-06

CTE (25-260 °C)

X

21

ppm/°C

IPC-650 2.4 .41/ASTM D 3386

Y

23

Z

215

Td

2% Weight Loss

535

°C

IPC-650 2.4.24.6 (TGA)

5% Weight Loss

553

°C

Mechanical Properties

Peel Strength

1 oz. ED

2.63 (15)

N/mm (Ibs/in)

IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress)

1 oz. RTF

2.98 (17)

N/mm2 (kpsi)

½ oz. ED

2.45 (14)

N/mm2 (kpsi)

IPC-650 2.4.8.3 (Elevated Temp.)

½ oz. ED

1.93 (11)

N/mm2 (kpsi)

IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress)

1 oz. rolled

2.28 (13)

N/mm2 (kpsi)

Young’s Modulus

MD

6,757 (980)

N/mm2 (psi)

ASTM D 902

CD

8,274 (1,200)

N/mm2 (psi)

MD

11,238 (1,630)

N/mm2 (psi)

ASTM D 3039

Chemical / Physical Properties

Moisture Absorption

-

0.02

%

IPC-650 2.6.2.1

Dielectric Breakdown

-

> 45

Kv

IPC-650 2.5.6

Flammability Rating

-

V-0

 

UL-94

 

 

Available Product Configurations

Dielectric Thickness

 

Available Sheet Sizes

Inches

mm

Inches

mm

12 x 18

305 x 457

24 x 36

610 x 914

16 x 18

406 x 457

18 x 48

457 x 1,220

18 x 24

457 x 610

36 x 48

914 x 1,220

16 x 36

406 x 914

 

 

 

 

Standard & Custom Sheet Sizes

 

Dielectric Thickness

Inches

mm

0.0025 - 0.250

0.064 - 6.35

 

*For custom thicknesses, sheet sizes, or copper cladding options, contact AGC directly for availability.

 

 

Additional Notes


  • TLX-8 high frequency laminate features a Dk variation of only±2% across a wide temperature range (-55°C to 125°C).
  • The material’s fiberglass reinforcement provides excellent creep resistance—critical for PWBs bolted to housings in high-vibration environments (e.g., space launches).
  • NASA-qualified low outgassing profile (see NASA’s low outgassing materials website for details).


 





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