Wangling F4BTMS255 PTFE Ultra-Thin Ultra-Fine Glass Fiber Cloth Ceramic Filled Substrate

Wangling F4BTMS255 PTFE Ultra-Thin Ultra-Fine Glass Fiber Cloth Ceramic Filled Substrate

Product Brief

Wangling F4BTMS255 is a high-performanceaerospace-grade PTFE ceramic filled substrate, an upgraded variant of the F4BTM PCB series with optimized material formulation and manufacturing craft. It is reinforced by ultra-thin and ultra-fine glass fiber cloth, combined with a large amount of uniformly dispersed special nano-ceramics and PTFE resin matrix. This unique material combination minimizes the glass fiber effect during electromagnetic wave propagation, drastically reduces dielectric loss, and significantly enhances dimensional stability.

The F4BTMS255 substrate features low anisotropy in X/Y/Z directions, an extended operating frequency range, improved electrical strength and thermal conductivity, as well as an excellent low thermal expansion coefficient and stable dielectric temperature characteristics. Equipped with standard RTF low-profile copper foil, it achieves low conductor loss while ensuring superior peel strength, and is compatible with copper or aluminum substrates for diversified application needs.

F4BTMS255 high frequency laminate boasts outstanding processability, suitable for standard PTFE sheet processing technologies, and performs excellently in dense hole and fine circuit fabrication, making it an ideal choice for multi-layer, high-layer and backplane manufacturing in high-frequency and high-reliability

Core Product Features

1. Tight dielectric constant tolerance with excellent batch-to-batch consistency
2. Ultra-low dielectric loss for high-frequency signal transmission efficiency
3. Stable dielectric constant and low loss value at frequencies up to 40GHz, perfectly suited for phase-sensitive applications
4. Excellent temperature coefficient of dielectric constant and loss, maintaining superior frequency and phase stability in the range of -55℃to 150℃
5. High radiation resistance, retaining stable dielectric and physical properties after radiation exposure
6. Low outgassing performance, complying with aerospace vacuum outgassing requirements tested by standard methods
7. Small thermal expansion coefficient in X/Y/Z directions, ensuring dimensional thermal stability and via copper reliability
8. Enhanced thermal conductivity, adaptable to medium and high power application scenarios
9. Excellent dimensional stability and low water absorption, ensuring long-term performance reliability in harsh environments

Typical Application Fields

• Aerospace on-board and cabin interior electronic equipment
• Microwave and RF communication systems
• Military radar and high-precision detection equipment
• Feed network of high-frequency communication devices
• Phase-sensitive antennas and phased array antennas
• Satellite communication and space-based electronic systems

Technical Parameters of F4BTMS255

Optional Copper Foil Specifications

• Copper Foil Thickness: 0.5OZ (0.018mm), 1OZ (0.035mm); other thicknesses are available for custom made
• Copper Foil Type: Standard RTF low-roughness copper foil; optional 50Ωembedded resistance copper foil, aluminum base, copper base
• 50Ω Embedded Resistance Copper Foil Details: The resistance film is composed of nickel-phosphorus alloy with a thickness of 0.2 microns, and the sheet resistance is 50±5Ω per square centimeter

Available Substrate Sizes

Standard sizes (custom special sizes are available upon contact):

• 305×460mm (12×18in)
• 460×610mm (18×24in)
• 610×920mm (24×36in)

Dielectric Layer Thickness & Tolerance

• Minimum thickness ofF4BTMS255 dielectric layer: 0.127mm
• Available thickness: multiple of 0.127mm (custom special thicknesses are available upon contact) 

Standard thickness and corresponding tolerance (mm/mil)

 Electrical Performance Characteristics

F4B DK2.55 PCB substrate has excellent frequency and temperature stability of electrical performance, and the change law of its dielectric constant and loss with frequency and temperature is as follows:

• 1)Frequency stability: The dielectric constant and loss of the material remain stable in the frequency range of 0.5～40GHz, maintaining a low loss value to meet the design requirements of different high-frequency application scenarios
• 2)Temperature stability: The temperature coefficient of dielectric constant (TCDK) is about -92PPM/℃in the range of -55～150℃, providing reliable reference data for product design under different temperature conditions. The actual continuous operating temperature of the material is as high as +260℃, far exceeding this test range, with strong environmental adaptability.