Taconic TLX-7 DK2.6 Fiberglass Reinforced PTFE Microwave High Frequency Substrate
Taconic TLX-7 is a high-performance PTFE fiberglass reinforced microwave substrate engineered by AGC, tailored for low layer count RF and microwave circuit designs. Boasting a precisely controlled dielectric constant (Dk) of 2.60 at 10 GHz, this substrate delivers exceptional electrical and mechanical stability across harsh operating conditions, making it a reliable solution for critical RF applications that demand consistent performance and structural resilience.
Crafted with woven fiberglass reinforcement and PTFE as the core dielectric,TLX-7 Taconic laminate excels in environments with extreme vibration, wide temperature fluctuations, high radiation, and marine exposure—addressing the rigorous requirements of aerospace, defense, maritime, and commercial mobile communication systems. Its low dissipation factor (Df) minimizes signal loss at both mid and high microwave frequencies, while superior mechanical reinforcement resists creep and dimensional shift, even in bolted PCB assemblies subject to intense mechanical stress (e.g., space launch vibration). Additionally, TLX-7 substrate features NASA-qualified low outgassing properties, a UL 94 V-0 flammability rating, and negligible moisture absorption, further enhancing its suitability for space, avionics, and high-reliability industrial applications.
This Taconic high frequency substrate is optimized for copper adhesion, compatible with all AGC copper cladding options, and available in a range of precise dielectric thicknesses—including thin gauges ideal for coupler, splitter, and combiner designs. It also delivers industry-leading passive intermodulation (PIM) performance (≤-160 dBc), ensuring minimal signal interference in high-power RF systems. For designers seeking a balance of a 2.60 Dk value, low signal loss, and robust environmental resistance, TLX-7DK2.6 Fiberglass Reinforced PTFE is the engineered choice for low layer count microwave PCBs in radar, test equipment, transmission devices, and RF passive/active components.
Core Key Benefits of TLX-7
-
Ultra-low PIM performance (≤-160 dBc measured at 20W/channel @ 800/1800 MHz) for high-power RF systems
-
Precisely controlled Dk (2.60±0.04) with±2% stability from -55°C to 125°C
-
Exceptionally low Df for minimal high-frequency signal loss
-
Superior mechanical & thermal properties for harsh environment operation
-
NASA-qualified low outgassing (ASTM E 595)–ideal for space/aerospace applications
-
UL 94 V-0 flammability rating for fire safety compliance
-
Negligible moisture absorption (<0.02%) for long-term electrical stability
-
Dimensional stability with minimal creep/resistance to mechanical stress
-
Optimized surface for strong copper cladding adhesion
-
Versatile thickness options for low layer count microwave designs
Primary Applications of TLX-7
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Radar system RF PCBs
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Mobile communication base station components
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Microwave test & measurement equipment
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Microwave transmission devices
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RF couplers, splitters, filters & combiners
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Avionics altimeter substrates
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Warship maritime communication antennas
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Space/aerospace low layer count microwave PCBs
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RF passive/active amplifier components
TLX-7 Key Electrical & Outgassing Typical Values
Dielectric Constant & Dissipation Factor (Qualified Test Methods)
|
Property
|
Test Method
|
Typical Value
|
Test Frequency
|
|
Dk
|
IPC-650 2.5.5.3
|
2.6
|
10 GHz
|
|
Df
|
IPC-650 2.5.5.5.1
|
0.0014
|
1.9 GHz
|
|
Df
|
IPC-650 2.5.5.5.1
|
0.002
|
10 GHz
|
|
Dk Variation
|
-
|
±2%
|
-55°C to 125°C
|
Outgassing Properties (ASTM E 595 | 24H @ 257°F /≤5×10⁻⁵Torr | NASA Reported)
|
Property
|
Test Method
|
Unit
|
Typical Value
|
|
% TML (Total Mass Loss)
|
ASTM E 595
|
%
|
0.02
|
|
% CVCM (Collected Volatile Condensable Materials)
|
ASTM E 595
|
%
|
0
|
|
% WVR (Water Vapor Regain)
|
ASTM E 595
|
%
|
0.01
|
TLX-7 Physical & Mechanical Specifications
|
Property
|
Test Method
|
Unit
|
Typical Value
|
|
Dielectric Thickness Range
|
-
|
Inches
|
0.0035 - 0.250
|
|
Dielectric Thickness Range
|
-
|
mm
|
0.089 - 6.35
|
|
Dielectric Breakdown
|
IPC-650 2.5.6
|
kV
|
>45
|
|
Moisture Absorption
|
IPC-650 2.6.2.1
|
%
|
0.02
|
|
Flexural Strength (MD)
|
ASTM D 790
|
psi
|
28,900
|
|
Flexural Strength (MD)
|
ASTM D 790
|
N/mm²
|
199
|
|
Flexural Strength (CD)
|
ASTM D 790
|
psi
|
20,600
|
|
Flexural Strength (CD)
|
ASTM D 790
|
N/mm²
|
142
|
|
Tensile Strength (MD)
|
ASTM D 902
|
psi
|
35,600
|
|
Tensile Strength (MD)
|
ASTM D 902
|
N/mm²
|
245
|
|
Tensile Strength (CD)
|
ASTM D 902
|
psi
|
27,500
|
|
Tensile Strength (CD)
|
ASTM D 902
|
N/mm²
|
190
|
|
Elongation at Break (MD)
|
ASTM D 902
|
%
|
3.94
|
|
Elongation at Break (CD)
|
ASTM D 902
|
%
|
3.92
|
|
Young’s Modulus (MD)
|
ASTM D 902
|
kpsi
|
980
|
|
Young’s Modulus (MD)
|
ASTM D 902
|
N/mm²
|
6757
|
|
Young’s Modulus (CD)
|
ASTM D 902
|
kpsi
|
1,200
|
|
Young’s Modulus (CD)
|
ASTM D 902
|
N/mm²
|
8274
|
|
Young’s Modulus (MD)
|
ASTM D 3039
|
kpsi
|
1,630
|
|
Young’s Modulus (MD)
|
ASTM D 3039
|
N/mm²
|
11,238
|
|
Poisson’s Ratio
|
ASTM D 3039
|
-
|
0.135
|
|
Thermal Conductivity
|
ASTM F433/ASTM 1530-06
|
W/M*K
|
0.19
|
|
CTE (X axis) (25-260°C)
|
IPC-650 2.4.41/ASTM D 3386
|
ppm/°C
|
21
|
|
CTE (Y axis) (25-260°C)
|
IPC-650 2.4.41/ASTM D 3386
|
ppm/°C
|
23
|
|
CTE (Z axis) (25-260°C)
|
IPC-650 2.4.41/ASTM D 3386
|
ppm/°C
|
215
|
|
Density (Specific Gravity)
|
ASTM D 792
|
g/cm³
|
2.25
|
|
Td (2% Weight Loss)
|
IPC-650 2.4.24.6 (TGA)
|
°C
|
535
|
|
Td (5% Weight Loss)
|
IPC-650 2.4.24.6 (TGA)
|
°C
|
553
|
|
Flammability Rating
|
UL 94
|
-
|
V-0
|
Peel Strength (Copper Cladding)
|
Copper Cladding Spec
|
Test Method
|
Unit (lbs/in)
|
Unit (N/mm)
|
|
1 oz. ED (Thermal Stress)
|
IPC-650 2.4.8 Sec 5.2.2
|
15
|
2.63
|
|
1 oz. RTF (Thermal Stress)
|
IPC-650 2.4.8 Sec 5.2.2
|
17
|
2.98
|
|
½ oz. ED (Elevated Temp.)
|
IPC-650 2.4.8.3
|
14
|
2.45
|
|
½ oz. ED (Thermal Stress)
|
IPC-650 2.4.8 Sec 5.2.2
|
11
|
1.93
|
|
1 oz. Rolled (Thermal Stress)
|
IPC-650 2.4.8 Sec 5.2.2
|
13
|
2.28
|
Dimensional Stability
|
Test Condition
|
Direction
|
Test Method
|
Unit (mils/in)
|
Unit (mm/M)
|
|
After Bake
|
MD
|
IPC-650 2.4.39 Sec 5.4
|
0.06
|
0.06
|
|
After Bake
|
CD
|
IPC-650 2.4.39 Sec 5.4
|
0.08
|
0.08
|
|
Thermal Stress
|
MD
|
IPC-650 2.4.39 Sec 5.5
|
0.09
|
0.09
|
|
Thermal Stress
|
CD
|
IPC-650 2.4.39 Sec 5.5
|
0.1
|
0.1
|
Electrical Resistivity
|
Test Condition
|
Property
|
Test Method
|
Value
|
Unit
|
|
Elevated Temperature
|
Surface Resistivity
|
IPC-650 2.5.17.1 Sec 5.2.1
|
6.605×10⁸
|
Mohm
|
|
Humidity Condition
|
Surface Resistivity
|
IPC-650 2.5.17.1 Sec 5.2.1
|
3.550×10⁶
|
Mohm
|
|
Elevated Temperature
|
Volume Resistivity
|
IPC-650 2.5.17.1 Sec 5.2.1
|
1.110×10¹⁰
|
Mohm/cm
|
|
Humidity Condition
|
Volume Resistivity
|
IPC-650 2.5.17.1 Sec 5.2.1
|
1.046×10¹⁰
|
Mohm/cm
|
TLX-7 Available Form Factors
Standard Sheet Sizes
|
Inches
|
mm
|
|
12 x 18
|
304 x 457
|
|
16 x 18
|
406 x 457
|
|
18 x 24
|
457 x 610
|
|
16 x 36
|
406 x 914
|
|
24 x 36
|
610 x 914
|
|
18 x 48
|
457 x 1220
|
|
36 x 48
|
914 x 1220
|
Part Number Example for TLX-7
TLX-7-0310-CH/CH - 18" x 24" (457 mm x 610 mm)
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