RO4725JXR Rogers RO4700 Series Antenna Grade High Frequency Laminate
Product Overview
RO4725JXR belongs to Rogers RO4700 series antenna grade laminates, engineered with a specially formulated thermoset resin system and unique closed microsphere filler. This RO4725JXR raw material configuration endows it with low dielectric loss, ultra-low PIM (Passive Intermodulation) performance, and a lightweight design (30% lighter than PTFE/Glass laminates), perfectly meeting the core design requirements of antenna designers for high gain and minimal signal loss.
It is compatible with conventional epoxy processing and high-temperature lead-free solder processes, eliminating the need for special surface treatment for plated through hole (PTH) preparation—a key pain point of traditional PTFE laminates. Lamination can be completed with RO4400 bondply series at 175°C, and its glass transition temperature (Tg) exceeds 280°C, leading to a low Z-axis coefficient of thermal expansion (CTE), outstanding PTH reliability, and stable performance in lead-free soldering operations.
In terms of environmental compliance, Rogers RO4725JXR fully meets RoHS standards, adapting to the global electronics industry's environmental protection and low-carbon production requirements, and is suitable for automated assembly lines, greatly improving the efficiency of mass production of antenna PCBs.
Core Features & Benefits
1)Superior electrical performance: A dielectric constant (Dk) of 2.55 (10GHz/23°C) with low loss tangent (Df=0.0022 at 2.5GHz, LoPro® Reverse Treated EDC Foil), ensuring low insertion loss and high antenna gain
2)Ultra-low PIM performance: PIM value better than -160 dBc (43dBm, 1900MHz signal), effectively avoiding passive intermodulation interference in communication systems
3)Lightweight & low density: Unique closed microsphere filler, 30% lighter than PTFE/Glass laminates, reducing the overall weight of antenna products
4)Excellent thermal stability: Tg >280°C, Z-axis CTE <30ppm/°C, low TCDk (+34 ppm/°C), maintaining consistent circuit performance in the temperature range of -50°C to 150°C
5)Easy fabrication & assembly: No special PTH treatment required, compatible with RO4400™bondply lamination, adapted to automated assembly lines; lead-free solder process compatible
6)High dimensional stability: X/Y dimensional change <0.4 mm/m after etching and high-temperature treatment, ensuring precise circuit manufacturing
7)Environmental compliance: RoHS compliant, meeting international environmental protection standards for electronic materials
Typical Application
The RO4725JXR substrate is specially optimized for Cellular Base Station Antennas, and its low loss, low PIM, and high thermal stability make it the ideal core material for 5G/4G cellular base station antenna PCBs, effectively improving the signal transmission efficiency and stability of base station equipment.
Key Performance Parameters of RO4725JXR
|
Property
|
Direction
|
Units
|
Test Condition
|
Test Method
|
Typical Value
|
|
Dielectric Constant, εr (Process)
|
Z
|
-
|
10 GHz/23°C
|
IPC-TM-650, 2.5.5.5
|
2.55 ± 0.05
|
|
Dielectric Constant, εr (Design)
|
Z
|
-
|
1.7 GHz - 5 GHz
|
Differential Phase Length Method
|
2.64
|
|
Dissipation Factor (Df)
|
Z
|
-
|
2.5 GHz (LoPro Reverse Treated EDC Foil)
|
-
|
0.0022
|
|
Dissipation Factor (Df)
|
Z
|
-
|
10 GHz/23°C
|
IPC-TM-650, 2.5.5.5
|
0.0026
|
|
Thermal Coefficient of εr (TCDk)
|
Z
|
ppm/°C
|
-50°C to 150°C
|
IPC-TM-650, 2.5.5.5
|
34
|
|
Volume Resistivity (0.030")
|
-
|
MΩ•cm
|
COND A
|
IPC-TM-650, 2.5.17.1
|
2.16 × 10⁸
|
|
Surface Resistivity (0.030")
|
-
|
MΩ
|
COND A
|
IPC-TM-650, 2.5.17.1
|
4.8 × 10⁷
|
|
PIM
|
-
|
dBc
|
50 ohm, 0.060”, 43dBm, 1900MHz
|
Rogers’ internal test method
|
-166
|
|
Electrical Strength (0.030”)
|
Z
|
V/mil
|
-
|
IPC-TM-650, 2.5.6.2
|
630
|
|
Flexural Strength (MD)
|
-
|
MPa (kpsi)
|
RT
|
ASTM D790
|
121 (17.5)
|
|
Flexural Strength (CMD)
|
-
|
MPa (kpsi)
|
RT
|
ASTM D790
|
92 (13.3)
|
|
Dimensional Stability
|
X,Y
|
mm/m
|
After etch + E2/150°C
|
IPC-TM-650, 2.4.39A
|
<0.4
|
|
Coefficient of Thermal Expansion (CTE)
|
X
|
ppm/°C
|
-55 TO 288°C
|
IPC-TM-650, 2.1.24
|
13.9
|
|
Coefficient of Thermal Expansion (CTE)
|
Y
|
ppm/°C
|
-55 TO 288°C
|
IPC-TM-650, 2.1.24
|
19
|
|
Coefficient of Thermal Expansion (CTE)
|
Z
|
ppm/°C
|
-55 TO 288°C
|
IPC-TM-650, 2.1.24
|
25.6
|
|
Thermal Conductivity
|
Z
|
W/mK°
|
50°C
|
ASTM D5470
|
0.38
|
|
Moisture Absorption
|
-
|
%
|
48/50
|
IPC-TM-650 2.6.2.1 / ASTM D570
|
0.24%
|
|
Glass Transition Temperature (Tg)
|
-
|
°C
|
-
|
IPC-TM-650 2.4.24
|
>280
|
|
Decomposition Temperature (Td)
|
-
|
°C
|
-
|
ASTM D3850
|
439
|
|
Density
|
-
|
gm/cm³
|
-
|
ASTM D792
|
1.27
|
|
Copper Peel Strength
|
-
|
pli
|
1 oz LoPro EDC
|
IPC-TM-650 2.4.8
|
8.5
|
|
Lead-Free Process Compatible
|
-
|
-
|
-
|
-
|
YES
|
Standard Product Specifications
Standard Thicknesses (LoPro)
|
Thickness (inch)
|
Tolerance (inch)
|
Corresponding Thickness (mm)
|
Tolerance (mm)
|
|
0.0307”
|
±0.0020”
|
0.780 mm
|
±0.0508 mm
|
|
0.0607”
|
±0.0040”
|
1.542 mm
|
±0.1016 mm
|
Standard Panel Sizes
-
24”X 18”(610 X 457 mm)
-
24”X 21”(610 X 533 mm)
-
24”X 36”(610 X 915 mm)
-
48”X 36”(1219 X 915 mm)
Custom panel sizes are available upon request
Standard Cladding (Electrodeposited Copper Foil)
-
½oz (18μm) HH/HH
-
1 oz (35μm) H1/H1
LoPro Reverse Treated Electrodeposited Copper Foil:½oz (18μm) TH/TH, 1 oz (35μm) T1/T1
Material Usage Note
Prolonged exposure of RO4725JXR high frequency laminate to an oxidative environment may cause slight changes in dielectric properties, and the rate of change increases with temperature, which is also related to the specific antenna circuit design. AlthoughRogers high-frequency materials have been verified in a large number of practical applications and oxidation-induced performance problems are extremely rare, we recommend that customers conduct a compatibility evaluation of the material and specific circuit design to ensure the material's stable performance throughout the entire service life of the end antenna product.
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