Wangling F4BME255 DK2.55 PTFE Glass Fiber Cloth Reversed RTF Copper Foil Substrate

Wangling F4BME255 DK2.55 PTFE Glass Fiber Cloth Reversed RTF Copper Foil Substrate

Product Overview

Wangling F4BME255 is a high-end high-frequency PTFE copper clad laminate independently developed by Taizhou Wangling Insulation Material Factory, engineered for high-precision RF/microwave applications with strict PIM performance requirements. The product takes high-quality PTFE resin, premium glass fiber cloth as the dielectric core, and is matched withreversed RTF copper foil through optimized hot pressing process. By precisely adjusting the ratio of PTFE to glass fiber cloth, it achieves a fixed dielectric constant of 2.55, while realizing ultra-low conductor loss, excellent passive intermodulation (PIM) performance and high-precision circuit control capability.

Different from conventional PTFE laminates, F4BME255 substrate is specially designed for scenarios with PIM index requirements. Its reversed RTF copper foil effectively reduces signal reflection and intermodulation interference, and the higher glass fiber ratio brings better dimensional stability, lower thermal expansion coefficient and superior temperature drift performance. The F4B DK2.55 laminate has stable electrical properties in a wide temperature range, can completely replace imported similar products, and has the advantages of mass production and high cost performance, making it an ideal material for high-precision communication components.

Core Advantages

1)Targeted dielectric constant (typical value) 2.55@10GHz with tight tolerance±0.05, ensuring consistent electrical performance of batch products

2)Equipped with reversed RTF copper foil, excellent PIM performance (≤-159dBc), effectively suppressing passive intermodulation interference

3)Ultra-low loss factor: 0.0013@10GHz, 0.0018@20GHz, reducing high-frequency signal attenuation and conductor loss

4)Superior dimensional stability: XY direction thermal expansion coefficient 16~21ppm/℃(-55~288℃), matching with PCB processing process

5)Reliable bonding performance: peel strength >1.6N/mm (1 OZ), no delamination between copper foil and dielectric layer

6)Wide temperature adaptability: long-term operating temperature -55～+260℃, passing 3 times of 260℃thermal stress test without failure

7)Excellent insulation and voltage resistance: Z-direction electrical strength >25KV/mm, XY-direction breakdown voltage >34KV

8)Low water absorption (≤0.08%) and anti-radiation, low outgassing characteristics, adapting to harsh working environments

9)UL-94 V-0 flame retardant grade, meeting the safety and reliability requirements of communication equipment

10)Customizable metal base (aluminum/copper) for enhanced heat dissipation and shielding performance

Typical Applications

• High-precision phased array antennas, base station antennas with strict PIM requirements
• Microwave/RF radar system core components, low-loss feed networks
• High-precision phase shifters, passive microwave devices, RF power dividers/couplers
• Satellite communication on-board equipment, ground station high-frequency circuits
• 5G/6G communication high-precision RF components, signal combiners
• High-frequency test fixtures, precision microwave module circuit boards

F4BME255 Technical Parameters

Customization Specifications

1. RTF Copper Foil Thickness Options (Exclusive for F4BME255)

2. Plate Size Specifications

Regular Sizes (mm)

460×610、500×600、850×1200、914×1220、1000×1200

Custom Irregular Sizes (mm)

300×250、350×380、500×500、840×840、1000×1500

Important Note: When the plate thickness is≥4.0mm or≤0.2mm, the maximum available size shall not exceed 500×610mm.

3. Thickness & Tolerance Specifications

Conventional thickness (including total copper thickness/dielectric thickness, customizable), with matching tolerances as follows: