6-Layer Hybrid PCB 4mil RO4350B + High Tg FR-4 S1000-2M with Blind Via ENEPIG

6-Layer Hybrid PCB 4mil RO4350B+ High Tg FR-4 S1000-2M with Blind Via ENEPIG

Designed to bridge the gap between high-frequency performance and mechanical reliability, our  6-Layer Hybrid PCB combines Rogers RO4350B’s microwave-grade dielectric properties with High Tg FR-4 (S1000-2M)’s robust mechanical and thermal characteristics. This hybrid construction is engineered for mission-critical applications requiring stable signal integrity, extreme temperature resistance, and long-term durability—from aerospace antennas to radar systems. Below is a comprehensive breakdown of its specifications, material synergies, and performance advantages, with core technical details organized in clear tables for quick reference. 

PCB Construction Details

Below is a detailed breakdown of the Hybrid PCB Board’s core construction parameters, ensuring transparency on manufacturing specifications and performance-critical attributes:

PCB Stackup

The 6-layer hybrid PCB stackup is optimized for signal integrity and thermal stability, leveraging the unique properties of each dielectric material:

PCB Statistics

Key dimensional and component-related metrics for design and assembly planning:

Material Synergy: RO4350B + S1000-2M

The Hybrid PCB Material’s core advantage lies in its dual-material construction:

RO4350B: A woven glass-reinforced hydrocarbon/ceramic laminate with Dk 3.48±0.05 (10GHz) and low dissipation factor (0.0037), offering PTFE-like performance at a fraction of the cost. Its >280°C Tg, copper-matched CTE (X:10 ppm/°C, Y:12 ppm/°C), and low Z-axis CTE (32 ppm/°C) ensure dimensional stability and reliable plated through-holes—even in severe thermal shock. UL 94 V-0 rated, it requires no special processing compared to PTFE materials.

S1000-2M High Tg FR-4: Enhances through-hole reliability with lower Z-axis CTE, 180°C Tg, and lead-free compatibility. Features UV-blocking (AOI-friendly) properties, excellent anti-CAF performance, and low water absorption—reinforcing mechanical robustness for mixed-dielectric multi-layer constructions.

Core Advantages

1)Signal Integrity: 4mil trace/space precision andRO4350B Frequency PCB’s tight Dk control minimize insertion loss for high-frequency applications (up to millimeter-wave).

2)Thermal Stability: Combined Tg values (>280°C for RO4350B, 180°C for S1000-2M) ensure stability across circuit processing and operational temperatures.

3)Reliability: Low Z-axis CTE, anti-CAF performance, and ENEPIG finish guarantee long-term durability in harsh environments (thermal shock, humidity). 

4) Manufacturability: Compatible with standard epoxy/glass processing (no special PTFE treatments) and Gerber RS-274-X artwork for seamless production.

Typical Applications

Ideal for industries requiring high performance and reliability, this hybrid PCB excels in:

Commercial airline broadband antennas

Microstrip and stripline circuits

Millimeter wave systems

Radar and guidance systems

Point-to-point digital radio antennas

Whether you’re designing next-generation communication hardware or critical aerospace systems, this 6-Layer RO4350B High Tg FR-4 Hybrid PCB delivers the perfect balance of performance, durability, and cost-effectiveness. Our engineering team is ready to support customizations—contact us today to discuss your specific requirements and unlock the full potential of your application.