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Hybrid PCB
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Home Hybrid PCB Board Hybrid 10-Layer PCB Rogers RO4350 6.6mil+FR4 Hybrid PCB Red Solder Mask Immersion Gold

Hybrid 10-Layer PCB Rogers RO4350 6.6mil+FR4 Hybrid PCB Red Solder Mask Immersion Gold


Hybrid PCB is also known as mixed material lamination, it’s normally combined by two different material like FR4 and PI(rigid flex PCB), FR4 and Ceramic, FR4 and Teflon, FR4 and Aluminum base etc.




  • Item NO.:

    BIC-084-v169.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

Hybrid 10-Layer PCB Rogers RO4350 6.6mil+FR4 Hybrid PCB With Red Solder Mask and Immersion Gold

(PCB's are custom-made products, the picture and parameters shown are just for reference)


There is a type of 10-layer hybrid PCB built on RO4350B and FR-4. This board is used for high gain applications.


stack up 10 layer 6.6 mil RO4350B+ FR4


The board actually is simple, because there’s only through holes connected each layer. Finished height is 1.7mm thick. Pads and holes are immersion gold plated, the surface is with red solder mask. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 boards are packed for shipment.


Applications

Preamplifier, WiFi amplifier, relay stations and RF transceiver etc.


Our advantages

1) Help you focus on your core competencies on research and development, sales and marketing;

2) 30000 square meter month capability;

3) Meeting your PCB needs from prototype to mass production;

4) Quick and on-time delivery;

5) IATF 16949 (2016), ISO14001 (2015), ISO9001 (2015), UL certified factory.


RO4350B PCB 10-Layer


Parameter and data sheet:

PCB SIZE 210 x 85mm=1PCS
BOARD TYPE
Number of Layers Multilayer PCB, 10 Layer PCB
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 35um(1oz)+plate TOP layer
RO4350B core 0.168mm
copper ------- 18um(0.5oz) MidLayer 1
RO4450F Prepreg (2x0.1) 0.2mm
copper ------- 18um(0.5oz) MidLayer 2
RO4350B core 0.168mm
copper ------- 18um(0.5oz) MidLayer 3
RO4450F Prepreg (2x0.1) 0.2mm
copper ------- 18um(0.5oz) MidLayer 4
RO4350B core 0.168mm
copper ------- 18um(0.5oz) MidLayer 5
RO4450F Prepreg (2x0.1) 0.2mm
copper ------- 18um(0.5oz) MidLayer 6
RO4350B core 0.168mm
copper ------- 18um(0.5oz) MidLayer 7
FR-4 pregpreg 0.1mm
copper ------- 18um(1oz) MidLayer 8
FR-4 core 0.1mm
copper ------- 35um(1oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 5.9mil/5.9mil
Minimum / Maximum Holes: 0.3mm/3.8mm
Number of Different Holes: 16
Number of Drill Holes: 11385
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control no
BOARD MATERIAL
Glass Epoxy:  RO4350B, RO4450B mixed with FR-4 TG>135
Final foil external:  1.5oz
Final foil internal:  0.5oz
Final height of PCB:  1.7mm ±0.17
PLATING AND COATING
Surface Finish Immersion Gold (17.7%) 2µ" over 100µ" nickel
Solder Mask Apply To:  Top and Bottom, 12micon Minimum.
Solder Mask Color:  Red
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend TOP and Bottom.
Colour of Component Legend White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:  Marked on the board in a conductor and leged FREE AREA
VIA Plated Through Hole(PTH), via tented.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:   0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance:  0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


Our Driving Circuit Boards Capabilities 2021

Blind vias, Buried vias

Flex PCB

Heavy Copper Boards 12oz

High Tg, High CTI Material

Hybrid FR-4 material and High Frequency Material

Impedance Controlled PCB

IPC Class 2, IPC Class 3

Lead Free PCB (RoHS Compliant)

Multilayer PCBs to 32+ copper layers boards

Metal Core PCB (MCPCB)

RoHS Compliant PCB Manufacturer

Rigid Flex PCB

Through-hole, BGA, Gold Finger, Edge dome

Via-in-pad, Filled vias


PCB Materials

FR-4, Polyimide,

Rogers RO4350B, RO4003C, RO3003, RO3006, RO3010, RO3210 etc.

Rogers RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010,

PTFE F4B DK2.2, DK2.65 etc..

Taconic TLX-8, TLY-5, RF-35TC, TLF-35 etc..


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