Hybrid PCB Mixed Material PCB Built On 10 mil RO4350B FR-4 With Depth Controlled Drill

Hybrid PCB | Mixed Material PCB Built On 10 mil RO4350B + FR-4 With Depth Controlled Drill

(PCB’s are custom-made products, the picture and parameters shown are just for reference)

A hybrid printed circuit board (PCB) multilayer is a PCB made of different materials. In order to improve electrical performance and system reliability for high-frequency RF applications, Managing the various coefficients of thermal expansion (CTE) qualities of the various circuit materials both during PCB fabrication and component assembly is the major issue when manufacturing this sort of PCB.

These designs typically combine FR-4 material and PTFE laminates, allowing a designer to consolidate RF functionality and RF functionality on the same PCB, reducing the device's size and expenses.

The board is designed as a 4-layer structure, because 4-layer is relatively simple and cost controllable, this is helpful to open up a new market.

Let's take a look at first build-up,

The first layer to the second layer is 10mil RO4350B core material, the core has fixed thickness which is very important to the electrical length of RF lines on the circuit board, and the other layers are FR-4 materials, which are bonded by semi-cured sheets. Inner layer is 0.5 ounces and the outer layer is 1 ounce.

Following picture is the cross section.

Plated through holes connect each layer. Pads and vias are with immersion gold.

The second board has a special “hole” in the board. See the build-up first.

Layer 1 and layer 2 is the 10mil core. The depth-control drill is dented on FR-4 side. The whole height of this board is only 0.7mm thick.

The applications of 10mil RO4350B hybrid PCB are wide, such as preamplifier, radar sensors, digital transmitter and splitter module; GPS antenna, communications relays, analogue transmitter and 4G antennas; RF transmitter, WiFi amplifier, RFID and attenuator etc.

The advantages of 10mil RO4350B hybrid PCBs:

1) RO4350B exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications;

2) Signal integrity performance improved over the stack-ups with all FR4 board;

3) Cost reduced over stack-ups with all low loss material;

4) Benefit from our strong capabilities: meeting your PCB needs from prototype to mass production and IATF 16949 (2016), ISO14001 (2015), ISO9001 (2015) and UL certified factory guarantee your quality.

Appendix: Our PCB Capability 2021

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