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Home Hybrid PCB Board Hybrid PCB Mixed Material PCB Built On 10 mil RO4350B FR-4 With Depth Controlled Drill

Hybrid PCB Mixed Material PCB Built On 10 mil RO4350B FR-4 With Depth Controlled Drill

Hybrid constructions PCB typically involve a low loss material such as Nelco or Rogers combined with another core material like FR-4.

  • Item NO.:

    BIC-078-v178.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

Hybrid PCB | Mixed Material PCB Built On 10 mil RO4350B + FR-4 With Depth Controlled Drill

(PCB’s are custom-made products, the picture and parameters shown are just for reference)


A hybrid printed circuit board (PCB) multilayer is a PCB made of different materials. In order to improve electrical performance and system reliability for high-frequency RF applications, Managing the various coefficients of thermal expansion (CTE) qualities of the various circuit materials both during PCB fabrication and component assembly is the major issue when manufacturing this sort of PCB.


These designs typically combine FR-4 material and PTFE laminates, allowing a designer to consolidate RF functionality and RF functionality on the same PCB, reducing the device's size and expenses.


The board is designed as a 4-layer structure, because 4-layer is relatively simple and cost controllable, this is helpful to open up a new market.


Let's take a look at first build-up,


1 Stackup 4L 10mil RO4350B+FR4 1.2mm.


The first layer to the second layer is 10mil RO4350B core material, the core has fixed thickness which is very important to the electrical length of RF lines on the circuit board, and the other layers are FR-4 materials, which are bonded by semi-cured sheets. Inner layer is 0.5 ounces and the outer layer is 1 ounce.


Following picture is the cross section.


1 Microsection 4L 10mil RO4350B+FR4


Plated through holes connect each layer. Pads and vias are with immersion gold.


The second board has a special “hole” in the board. See the build-up first.


2 stackup 4L 10mil RO4350B+FR4 0.7mm TK


Layer 1 and layer 2 is the 10mil core. The depth-control drill is dented on FR-4 side. The whole height of this board is only 0.7mm thick.


4L 10mil RO4350B+FR4 =0.7mm


The applications of 10mil RO4350B hybrid PCB are wide, such as preamplifier, radar sensors, digital transmitter and splitter module; GPS antenna, communications relays, analogue transmitter and 4G antennas; RF transmitter, WiFi amplifier, RFID and attenuator etc.


The advantages of 10mil RO4350B hybrid PCBs:

1) RO4350B exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications;

2) Signal integrity performance improved over the stack-ups with all FR4 board;

3) Cost reduced over stack-ups with all low loss material;

4) Benefit from our strong capabilities: meeting your PCB needs from prototype to mass production and IATF 16949 (2016), ISO14001 (2015), ISO9001 (2015) and UL certified factory guarantee your quality.


Appendix: Our PCB Capability 2021

Parameter Value
 Layer Counts  1-32
 Substrate Material FR-4(including High Tg 170, High CTI>600V); Aluminum based; Copper based;  Rogers RO4350B, RO4003C, RO3003, RO3006, RO3010, RO3210 etc.; Rogers RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010 etc..; Taconic TLX-8, TLY-5, RF-35TC, TLF-35 etc..; Arlon AD450, AD600 etc; PTFE F4B DK2.2, DK2.65 etc..; Polyimide and PET.
 Maximum Size  Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
 Board Outline Tolerance  ±0.0059" (0.15mm)
 PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)  ±8%
Thickness Tolerance(t<0.8mm)  ±10%
 Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
 Minimum Track 0.003" (0.075mm)
 Minimum Space  0.003" (0.075mm)
 Outer Copper Thickness  35µm--420µm (1oz-12oz)
 Inner Copper Thickness  17µm--350µm (0.5oz - 10oz)
 Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
 Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
 Registration (Mechanical) 0.00197" (0.05mm)
 Aspect Ratio  12:1
 Solder Mask Type  LPI
 Min Soldermask Bridge 0.00315" (0.08mm)
 Min Soldermask Clearance 0.00197" (0.05mm)
 Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance  ±10%
 Surface Finish HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger


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