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It is a double layer build-up with large area of immersion gold and
partial green solder mask. Finished copper 1oz are on both sides.
Item NO.:
BIC-182-v116.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaColor:
WhiteShipping Port:
ShenzhenLead Time:
7-10 days
60mil RF-10 High Frequency PCB Double Sided Taconic Microwave PCB Low Loss High DK RF PCBs
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description:
This type of low loss high DK PCB is built on 60mil RF-10 substrate. It is a double layer build-up with large area of immersion gold and partial green solder mask. Finished copper 1oz are on both sides. The boards are fabricated per IPC 6012 Class 2 using supplied Gerber data. Every 25 boards are packed for shipment.
PCB Specifications:
PCB SIZE | 90 x 100mm=1up |
BOARD TYPE | Double sided PCB |
Number of Layers | 2 layers |
Surface Mount Components | YES |
Through Hole Components | NO |
LAYER STACKUP | copper ------- 17um(0.5 oz)+plate TOP layer |
RF-10 1.524mm | |
copper ------- 17um(0.5 oz) + plate BOT Layer | |
TECHNOLOGY | |
Minimum Trace and Space: | 4 mil / 4 mil |
Minimum / Maximum Holes: | 0.3 mm / 4.0 mm |
Number of Different Holes: | 5 |
Number of Drill Holes: | 211 |
Number of Milled Slots: | 5 |
Number of Internal Cutouts: | 3 |
Impedance Control: | no |
Number of Gold finger: | 0 |
BOARD MATERIAL | |
Glass Epoxy: | RF-10 1.524mm |
Final foil external: | 1.0 oz |
Final foil internal: | N/A |
Final height of PCB: | 1.6 mm ±0.16 |
PLATING AND COATING | |
Surface Finish | Immersion Gold, 89% |
Solder Mask Apply To: | Top layer |
Solder Mask Color: | Green |
Solder Mask Type: | LPI |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | N/A |
Colour of Component Legend | N/A |
Manufacturer Name or Logo: | N/A |
VIA | Plated through hole(PTH), minimum size 0.3mm. |
FLAMIBILITY RATING | 94V-0 |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" |
Board plating: | 0.0029" |
Drill tolerance: | 0.002" |
TEST | 100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Typical Applications:
1.Aircraft Collision Avoidance Systems
2.GPS Antennas
3.Microstrip Patch Antennas
4.Passive Components (filters, couplers, power dividers)
5.Satellite Components
Why choose us?
1.ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
2.More than 18+ years’ high frequency PCB experience;
3.Small quantity order is available, no MOQ required;
4.We’re a Team of passion, discipline, responsibility and honesty;
5.Delivery on time: >98%, Customer complaint rate: <1%
6.16000㎡workshop, 30000㎡output a month and 8000 types of PCB's a month;
7.Powerful PCB capabilities support your research and development, sales and marketing;
8.IPC Class 2 / IPC Class 3
Typical Value of RF-10:
RF-10 Typical Values | |||||
Property | Test Method | Unit | Value | Unit | Value |
Dk @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | 10.2±0.3 | 10.2±0.3 | ||
Df @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | 0.0025 | 0.0025 | ||
TcK†(-55 to 150 °C) | IPC-650 2.5.5.6 | ppm/°C | -370 | ppm/°C | -370 |
Moisture Absorption | IPC-650 2.6.2.1 | % | 0.08 | % | 0.08 |
Peel Strength(1 oz. RT copper) | IPC-650 2.4.8 (solder) | lbs/in | 10 | N/mm | 1.7 |
Volume Resistivity | IPC-650 2.5.17.1 | Mohm/cm | 6.0 x 107 | Mohm/cm | 6.0 x 107 |
Surface Resistivity | IPC-650 2.5.17.1 | Mohm | 1.0 x 108 | Mohm | 1.0 x 108 |
Flexural Strength(MD) | IPC - 650 - 2.4.4 | psi | 14,000 | N/mm2 | 96.53 |
Flexural Strength(CD) | IPC - 650 - 2.4.4 | psi | 10,000 | N/mm2 | 68.95 |
Tensile Strength(MD) | IPC - 650 - 2.4.19 | psi | 8,900 | N/mm2 | 62.57 |
Tensile Strength(CD) | IPC - 650 - 2.4.19 | psi | 5,300 | N/mm2 | 37.26 |
Dimensional Stability | IPC-650 2.4.39(After Etch) | % (25 mil-MD) | -0.0032 | % (25 mil-CD) | -0.0239 |
Dimensional Stability | IPC-650 2.4.39(After Bake) | % (25 mil-MD) | -0.0215 | % (25 mil-CD) | -0.0529 |
Dimensional Stability | IPC-650 2.4.39(After Stress) | % (25 mil-MD) | -0.0301 | % (25 mil-CD) | -0.0653 |
Dimensional Stability | IPC-650 2.4.39(After Etch) | % (60 mil-MD) | -0.0027 | % (60 mil-CD) | -0.0142 |
Dimensional Stability | IPC-650 2.4.39(After Bake) | % (60 mil-MD) | -0.1500 | % (60 mil-CD) | -0.0326 |
Dimensional Stability | IPC-650 2.4.39(After Stress) | % (60 mil-MD) | -0.0167 | % (60 mil-CD) | -0.0377 |
Density(Specific Gravity) | IPC-650-2.3.5 | g/cm3 | 2.77 | g/cm3 | 2.77 |
Specific Heat | IPC-650-2.4.50 | J/g°C | 0.9 | J/g°C | 0.9 |
Thermal Conductivity(Unclad) | IPC-650-2.4.50 | W/M*K | 0.85 | W/M*K | 0.85 |
CTE (X -Y axis)(50 to 150 °C) | IPC-650 2.4.41 | ppm/°C | 16-20 | ppm/°C | 16-20 |
CTE (Z axis)(50 to 150 °C) | IPC-650 2.4.41 | ppm/°C | 25 | ppm/°C | 25 |
Flammability Rating | Internal | V-0 | V-0 |
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BICHNEG PCB CERTIFICATION:
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