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Home High Frequency PCB 60mil RF-10 High Frequency Double Sided Taconic Microwave Low Loss High DK RF PCBs

60mil RF-10 High Frequency Double Sided Taconic Microwave Low Loss High DK RF PCBs

It is a double layer build-up with large area of immersion gold and partial green solder mask. Finished copper 1oz are on both sides.





  • Item NO.:

    BIC-182-v116.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Color:

    White
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


60mil RF-10 High Frequency PCB Double Sided Taconic Microwave PCB Low Loss High DK RF PCBs

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


General Description: 


This type of low loss high DK PCB is built on 60mil RF-10 substrate. It is a double layer build-up with large area of immersion gold and partial green solder mask. Finished copper 1oz are on both sides. The boards are fabricated per IPC 6012 Class 2 using supplied Gerber data. Every 25 boards are packed for shipment.


PCB Specifications:


PCB SIZE 90 x 100mm=1up
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 17um(0.5 oz)+plate TOP layer
RF-10 1.524mm
copper ------- 17um(0.5 oz) + plate  BOT Layer
TECHNOLOGY
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.3 mm / 4.0 mm
Number of Different Holes: 5
Number of Drill Holes: 211
Number of Milled Slots: 5
Number of Internal Cutouts: 3
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy:  RF-10 1.524mm
Final foil external:  1.0 oz
Final foil internal:  N/A
Final height of PCB:  1.6 mm ±0.16
PLATING AND COATING
Surface Finish Immersion Gold, 89%
Solder Mask Apply To:  Top layer
Solder Mask Color:  Green
Solder Mask Type: LPI
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo:  N/A
VIA Plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING 94V-0
DIMENSION TOLERANCE
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

RF-10 PCB


Typical Applications:


1.Aircraft Collision Avoidance Systems

2.GPS Antennas

3.Microstrip Patch Antennas

4.Passive Components (filters, couplers, power dividers)

5.Satellite Components


Why choose us?

1.ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;

2.More than 18+ years’ high frequency PCB experience;

3.Small quantity order is available, no MOQ required;

4.We’re a Team of passion, discipline, responsibility and honesty;

5.Delivery on time: >98%, Customer complaint rate: <1%

6.16000㎡workshop, 30000㎡output a month and 8000 types of PCB's a month;

7.Powerful PCB capabilities support your research and development, sales and marketing;

8.IPC Class 2 / IPC Class 3


Typical Value of RF-10:


RF-10 Typical Values
Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 Mod. 10.2±0.3 10.2±0.3
Df @ 10 GHz IPC-650 2.5.5.5.1 Mod. 0.0025 0.0025
TcK†(-55 to 150 °C) IPC-650 2.5.5.6 ppm/°C -370 ppm/°C -370
Moisture Absorption IPC-650 2.6.2.1 % 0.08 % 0.08
Peel Strength(1 oz. RT copper) IPC-650 2.4.8 (solder) lbs/in 10 N/mm 1.7
Volume Resistivity IPC-650 2.5.17.1 Mohm/cm 6.0 x 107 Mohm/cm 6.0 x 107
Surface Resistivity IPC-650 2.5.17.1 Mohm 1.0 x 108 Mohm 1.0 x 108
Flexural Strength(MD) IPC - 650 - 2.4.4 psi 14,000 N/mm2 96.53
Flexural Strength(CD) IPC - 650 - 2.4.4 psi 10,000 N/mm2 68.95
Tensile Strength(MD) IPC - 650 - 2.4.19 psi 8,900 N/mm2 62.57
Tensile Strength(CD) IPC - 650 - 2.4.19 psi 5,300 N/mm2 37.26
Dimensional Stability IPC-650 2.4.39(After Etch) % (25 mil-MD) -0.0032 % (25 mil-CD) -0.0239
Dimensional Stability IPC-650 2.4.39(After Bake) % (25 mil-MD) -0.0215 % (25 mil-CD) -0.0529
Dimensional Stability IPC-650 2.4.39(After Stress) % (25 mil-MD) -0.0301 % (25 mil-CD) -0.0653
Dimensional Stability IPC-650 2.4.39(After Etch) % (60 mil-MD) -0.0027 % (60 mil-CD) -0.0142
Dimensional Stability IPC-650 2.4.39(After Bake) % (60 mil-MD) -0.1500 % (60 mil-CD) -0.0326
Dimensional Stability IPC-650 2.4.39(After Stress) % (60 mil-MD) -0.0167 % (60 mil-CD) -0.0377
Density(Specific Gravity) IPC-650-2.3.5 g/cm3 2.77 g/cm3 2.77
Specific Heat IPC-650-2.4.50 J/g°C 0.9 J/g°C 0.9
Thermal Conductivity(Unclad) IPC-650-2.4.50 W/M*K 0.85 W/M*K 0.85
CTE (X -Y axis)(50 to 150 °C) IPC-650 2.4.41 ppm/°C 16-20 ppm/°C 16-20
CTE (Z axis)(50 to 150 °C) IPC-650 2.4.41 ppm/°C 25 ppm/°C 25
Flammability Rating Internal V-0 V-0



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