8mil RO4003C Material Rogers 4003C Rigid high frequency PCB for Telecommunication Aerospace Defense

8mil RO4003C Material Rogers 4003C Rigid high frequency PCB for Telecommunication Aerospace Defense

PCB Material:

Utilizes 8mil RO4003C hydrocarbon ceramic laminates for superior electrical properties and thermal stability.

Lead-free process ensures compliance with environmental regulations.

Operates flawlessly in temperatures ranging from -40℃ to +85℃.

Stackup:

Consists of a 2-layer configuration with a finished copper weight of 35um.

RO4003C dielectric with a thickness of 8 mil (0.203mm) ensures excellent signal integrity.

Finished copper weight of 35um on both sides ensures optimal conductivity.

Construction Details:

PCB Statistics:

RO4003C Hydrocarbon Ceramic Laminates: The 8mil RO4003C material used in this PCB is a high-performance hydrocarbon ceramic laminate. It offers several key advantages:

Low Dielectric Loss: RO4003C substrate has a low-loss tangent, which means it exhibits minimal energy loss when transmitting high-frequency signals. This property makes it suitable for applications requiring excellent signal integrity.

High Thermal Conductivity: The hydrocarbon ceramic material in RO4003C provides high thermal conductivity, allowing for efficient dissipation of heat generated during operation. This feature is particularly beneficial in applications with high power requirements or temperature-sensitive components.

Stable Performance over Temperature: The 8mil RO4003C material maintains its electrical properties and performance across a wide temperature range, from -40℃ to +85℃. This temperature stability ensures reliable operation in various environmental conditions.

The combination of RO4003C hydrocarbon ceramic laminates, lead-free manufacturing, adherence to IPC-Class-2 standards, and global availability makes the 8mil Rogers 4003C PCB an excellent choice for demanding applications that require exceptional signal integrity, thermal management, and environmental compliance.