Shenzhen Bicheng
Electronics Technology Co., Ltd

# Call Us Now ! Tel : +86 755 27374946

# Order Online Now ! Email : info@bichengpcb.com

Hybrid PCB
Hybrid PCB
Products
Home PCB SMT Stencil Aluminum Screen Printing Framed SMT Laser Cut PCB Stencil

Aluminum Screen Printing Framed SMT Laser Cut PCB Stencil

SMT stencil in our house, framed or frameless are 100% laser cut. The thickness of stainless steel foil ranges from 0.05mm to 0.4mm, with size 300mm x 300mm to 600mm x 600mm.

  • Item NO.:

    BIC-951-v43.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

Aluminum Screen Printing Framed SMT Laser Cut PCB Stencil

(Stencils are custom-made products, the pictures below are just for your reference)


1.1 General Description:


SMT stencil are fabricated per IPC 7525A using supplied Gerber data, squeegee area locating in the center.Fiducial marks are half carved on the back side to suit for the SMT machine. It’s packed with KK carton (hard card) and usually 2 stencils are packed for shipment.


1.2 Features and Benefits:

     

1.) The data file is used directly to produce and reduce the error rate;

2.) The opening accuracy of SMT template is very high: the whole process error is ≤ ±4 μ m;

3.) The opening of SMT template has geometric figure, which is advantageous to the printing and forming of tin paste;

4.) Quick and on-time delivery;

5.) Diversified shipping method;

6.) No MOQ, low cost for prototypes and small runs quantity


SMT Stencil


1.3 Applications:


SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.


1.4 Manufacturing Essentials:


1) Aluminium Frame

2) Laser cut

3) PCB locate in the middle of squeegee area.

4) Stainless Steel Shim: In general a standard thickness of 5 mils. For microBGA step down in the area to 4mils. For fine pitch QFP reduce the paste apertures by 10%-15% at centre.

5) Reduction for fine pitch components

6) Engraving is required

7) Electro Polishing


Two types of Stenicl Holes Formed


1.5 Available Thickness of Stainless Steel Foils:


0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm, 0.25mm, 0.3mm, 0.4mm


1.6 Commonly used Frame Size:


Although stencil is custom-made product, there are also some sizes which are in common use. For example, 300mm x 300mm, 520mm x 420mm, 600mm x 600mm


\Aluminum Framed SMT Stencil 23inch

Framed PCB Stencil 520mm x 420mm


1.7 Opening Holes Design for SMT Stencil:


Pitch Soldering Width Soldering Length Opening Width Opening Length Shim Thickness
1.27mm 0.65mm 2.00mm 0.60mm 1.95mm 0.15-0.25mm
0.635mm 0.35mm 1.50mm 0.32mm 1.45mm 0.15-0.18mm
0.50mm 0.254-0.33mm 1.25mm 0.22-0.25mm 1.20mm 0.12-0.15mm
0.40mm 0.25mm 1.25mm 0.20mm 1.20mm 0.10-0.12mm
0.30mm 0.20mm 1.00mm 0.15mm 0.95mm 0.07-0.12mm
0.50mm 0.65mm 0.45mm 0.60mm 0.12-0.15mm
0.25mm 0.40mm 0.23mm 0.35mm 0.07-0.12mm
1.27mm 0.80mm 0.75mm 0.75mm 0.15-0.20mm
1.00mm 0.38mm 0.35mm 0.35mm 0.10-0.12mm
0.50mm 0.30mm 0.28mm 0.28mm 0.07-0.12mm
0.25mm 0.12mm 0.12mm 0.12mm 0.12mm 0.08-0.10mm
0.20mm 0.10mm 0.10mm 0.10mm 0.10mm 0.05-0.10mm

BICHENG PCB TEAM PRACTICE:



BICHENG PCB CERTIFICATE:



BICHENG MAIN COURIERS:



Leave A Message

If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

Related Products
AMB Si3N4 Ceramic PCB
AMB Si3N4 Ceramic PCB 96% Substrate 80 W/MK Thermal Conductivity 100um Copper Gold Plated

This is a single-sided ceramic PCB constructed with96% Silicon Nitride (Si3N4) ceramic substrates, using Active Metal Brazing (AMB) technology.

High-Tg TU-768 HDI PCB
High-Tg PCB Built on TU-768 With 1.2mm Thick Coating Immersion Gold Multilayer TU-768 PCB

This is a type of High-Tg 4-layer PCB Built on TU-768 material. Each layer is plated with 1oz copper. 

Double Layer 60mil Rogers RO4835 PCB
RO4835 High Frequency PCB Double Layer 60mil 1.524mm Rogers 4835 PCB With Immersion Gold

It is plated with immersion gold, no solder mask or silkscreen. It’s fabricated using 60mil substrates, 0.5oz copper starting.

TRF-45 Double Sided PCB
TRF-45 RF 1.0mm Double Sided High Thermal Conductivity Low Loss PCB

This type of double sided high frequency PCB is built on 40mil TRF-45 low-loss ceramic-filled material with 1oz copper on both top and bottom side.

RO3210 PCB 4-layer 1.22mm Thick
RO3210 PCB 4-layer 1.22mm Thick Rogers 3210 Laminate ENIG Multilayer Board

The RO3210 4-layer multilayer PCB is a high-performance solution for RF and microwave applications, offering superior signal integrity, thermal stability, and mechanical strength.

F4BTMS430 PCB
F4BTMS430 DK4.3 F4B PCB 2-layer 125mil 3.175mm Thick F4BTMS Series Substrate Circuit Board

The F4BTMS high frequency PCB is a high-performance, ceramic-reinforced PTFE circuit board designed for demanding RF, aerospace, and military applications.

6035HTC PCB 2-layer 30mil
RT/duroid 6035HTC PCB 2-layer 30mil 0.762mm ENIG No Solder Mask Black Silkscreen

The RT/duroid 6035HTC 30mil substrate PCB is a high-performance solution for engineers needing to balance power, thermal management, and cost.

Low Loss TU-883 Substrate PCB
Low Loss PCB on TU-883 Substrate and TU-883P Prepreg Multi-layer PCB

ThunderClad 2 ( TU-883 ) is a very low loss category material based on a high performance resin.

© Copyright: 2026 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.

IPv6 network supported

IPv6 network supported

top

Leave A Message

Leave A Message

    If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

  • #
  • #
  • #