Rogers
RT/Duroid 5870 20mil 0.508mm High Frequency PCB Double Sied RF PCB for
Millimeter Wave Applications
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
The exceptional dielectric constant uniformity results from its
randomly oriented microfibers. The dielectric constant of RT/duroid 5870 is
uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness of RT/duroid 5870 to Ku-band and
above. RT/duroid 5870 materials are easily cut, sheared and machined to shape.
They are resistant to all solvents and reagents, hot or cold, normally used in
etching printed circuits or in plating edges and holes.
The
typical applications are commercial airline broadband antennas, microstrip
circuits, stripline circuits, millimeter wave applications, military radar
systems, missile guidance systems and point to point digital radio antennas
etc.
PCB
Specifications:
|
PCB SIZE
|
99 x 65mm=1PCS
|
|
BOARD TYPE
|
Double
sided PCB
|
|
Number
of Layers
|
2 layers
|
|
Surface
Mount Components
|
YES
|
|
Through
Hole Components
|
YES
|
|
LAYER STACKUP
|
copper
------- 35um(1 oz)+plate TOP layer
|
|
RT/duroid 5870 0.508mm
|
|
copper ------- 35um(1oz) + plate BOT Layer
|
|
TECHNOLOGY
|
|
|
Minimum Trace and Space:
|
5
mil / 4.5 mil
|
|
Minimum
/ Maximum Holes:
|
0.3
mm / 4.6 mm
|
|
Number
of Different Holes:
|
7
|
|
Number
of Drill Holes:
|
105
|
|
Number
of Milled Slots:
|
0
|
|
Number
of Internal Cutouts:
|
0
|
|
Impedance
Control:
|
no
|
|
Number
of Gold finger:
|
0
|
|
BOARD
MATERIAL
|
|
|
Glass
Epoxy:
|
RT/duroid
5870 0.508mm
|
|
Final
foil external:
|
1.0
oz
|
|
Final
foil internal:
|
N/A
|
|
Final
height of PCB:
|
0.6
mm ±0.1
|
|
PLATING AND COATING
|
|
|
Surface Finish
|
Immersion Gold
|
|
Solder
Mask Apply To:
|
N/A
|
|
Solder
Mask Color:
|
N/A
|
|
Solder
Mask Type:
|
N/A
|
|
CONTOUR/CUTTING
|
Routing
|
|
MARKING
|
|
|
Side of
Component Legend
|
n/a
|
|
Colour
of Component Legend
|
N/A
|
|
Manufacturer
Name or Logo:
|
N/A
|
|
VIA
|
Plated
through hole(PTH), minimum size 0.3mm. Solder mask uncovered
|
|
FLAMIBILITY RATING
|
UL
94-V0 Approval MIN.
|
|
DIMENSION TOLERANCE
|
|
|
Outline
dimension:
|
0.0059"
|
|
Board
plating:
|
0.0029"
|
|
Drill
tolerance:
|
0.002"
|
|
TEST
|
100%
Electrical Test prior shipment
|
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email
file, Gerber RS-274-X, PCBDOC etc
|
|
SERVICE AREA
|
Worldwide,
Globally.
|
Data
Sheet of Rogers RT/duroid 5870
|
RT/duroid
5870 Typical Value
|
|
Property
|
RT/duroid 5870
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric
Constant,εProcess
|
2.33
2.33±0.02 spec.
|
Z
|
N/A
|
C24/23/50
C24/23/50
|
1 MHz
IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
|
|
Dielectric Constant,εDesign
|
2.33
|
Z
|
N/A
|
8GHz to 40 GHz
|
Differential Phase
Length Method
|
|
Dissipation Factor,tanδ
|
0.0005
0.0012
|
Z
|
N/A
|
C24/23/50
C24/23/50
|
1
MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
|
|
Thermal Coefficient of ε
|
-115
|
Z
|
ppm/℃
|
-50℃to 150℃
|
IPC-TM-650 2.5.5.5
|
|
Volume Resistivity
|
2 x
107
|
Z
|
Mohm cm
|
C/96/35/90
|
ASTM D 257
|
|
Surface Resistivity
|
3 x 107
|
Z
|
Mohm
|
C/96/35/90
|
ASTM D 257
|
|
Specific Heat
|
0.96(0.23)
|
N/A
|
j/g/k
(cal/g/c)
|
N/A
|
Calculated
|
|
Tensile Modulus
|
Test
at 23℃
|
Test
at 100℃
|
N/A
|
MPa(kpsi)
|
A
|
ASTM D 638
|
|
1300(189)
|
490(71)
|
X
|
|
1280(185)
|
430(63)
|
Y
|
|
Ultimate Stress
|
50(7.3)
|
34(4.8)
|
X
|
|
42(6.1)
|
34(4.8)
|
Y
|
|
Ultimate Strain
|
9.8
|
8.7
|
X
|
%
|
|
9.8
|
8.6
|
Y
|
|
Compressive Modulus
|
1210(176)
|
680(99）
|
X
|
MPa(kpsi)
|
A
|
ASTM D 695
|
|
1360(198)
|
860(125)
|
Y
|
|
803(120)
|
520(76)
|
Z
|
|
Ultimate Stress
|
30(4.4)
|
23(3.4）
|
X
|
|
37(5.3)
|
25(3.7)
|
Y
|
|
54(7.8)
|
37(5.3)
|
Z
|
|
Ultimate Strain
|
4
|
4.3
|
X
|
%
|
|
3.3
|
3.3
|
Y
|
|
8.7
|
8.5
|
Z
|
|
Moisture Absorption
|
0.02
|
N/A
|
%
|
0.62"(1.6mm)
D48/50
|
ASTM D 570
|
|
Thermal Conductivity
|
0.22
|
Z
|
W/m/k
|
80℃
|
ASTM C 518
|
|
Coefficient of Thermal Expansion
|
22
28
173
|
X
Y
Z
|
ppm/℃
|
0-100℃
|
IPC-TM-650 2.4.41
|
|
Td
|
500
|
N/A
|
℃TGA
|
N/A
|
ASTM D 3850
|
|
Density
|
2.2
|
N/A
|
gm/cm3
|
N/A
|
ASTM D 792
|
|
Copper Peel
|
27.2(4.8)
|
N/A
|
Pli(N/mm)
|
1oz(35mm)EDC
foil
after solder float
|
IPC-TM-650 2.4.8
|
|
Flammability
|
V-0
|
N/A
|
N/A
|
N/A
|
UL 94
|
|
Lead-free Process Compatible
|
Yes
|
N/A
|
N/A
|
N/A
|
N/A
|
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