F4BTM320 High Frequency PCB DK3.2 2oz Copper 1.27mm Substrates With Immersion Gold
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Brief Introduction
This F4B substrate PCB features a size of 110mm x 76mm and is designed as a double-sided layout with two layers. It accommodates surface mount components while excluding through-hole components. The layer stackup includes a top layer of 70 µm (2 oz) copper withstarting 1oz plating, supported by a robust F4BTM320 core material of 1.27mm substrate thickness, and a bottom layer of the same copper specifications for consistent performance.
The F4B material PCB allows for a minimum trace width of 5 mil and a minimum spacing of 9 mil, facilitating precise circuit design. The surface finish is Immersion Gold, ensuring excellent solderability and durability. Both the top and bottom sides are coated with a black solder mask, providing protection and aesthetic appeal, while white silkscreen is applied to the top side for clear labeling and identification.
Here are details in table below.
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PCB SIZE
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110mm x 76 mm =1up
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BOARD TYPE
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Double sided PCB
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Number of Layers
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2 layers
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Surface Mount Components
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YES
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Through Hole Components
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NO
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LAYER STACKUP
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copper ------- 70 um(1 oz+plate) TOP layer
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F4BTM320 - 1.27mm
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copper ------- 70 um(1 oz + plate) BOT Layer
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TECHNOLOGY
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Minimum Trace and Space:
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5 mil / 9 mil
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Minimum / Maximum Holes:
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0.35 mm / 1.0 mm
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Number of Different Holes:
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4
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Number of Drill Holes:
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61
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Number of Milled Slots:
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0
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Number of Internal Cutouts:
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0
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Impedance Control:
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no
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Number of Gold finger:
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0
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BOARD MATERIAL
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Glass Epoxy:
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F4BTM320 DK3.2
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Final foil external:
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2 oz
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Final foil internal:
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N/A
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Final height of PCB:
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1.4 mm
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PLATING AND COATING
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Surface Finish
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Immersion Gold
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Solder Mask Apply To:
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Top side & Bottom Side
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Solder Mask Color:
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Black
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Solder Mask Type:
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N/A
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CONTOUR/CUTTING
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Routing
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MARKING
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Side of Component Legend
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Top Side
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Colour of Component Legend
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White
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Manufacturer Name or Logo:
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N/A
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VIA
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Plated through hole(PTH), minimum size 0.35mm.
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FLAMIBILITY RATING
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UL 94-V0 Approval MIN.
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DIMENSION TOLERANCE
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Outline dimension:
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0.0059"
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Board plating:
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0.0029"
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Drill tolerance:
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0.002"
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TEST
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100% Electrical Test prior shipment
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TYPE OF ARTWORK TO BE SUPPLIED
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email file, Gerber RS-274-X, PCBDOC etc
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SERVICE AREA
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Worldwide, Globally.
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F4BTM High Frequency Laminates
F4BTM series materials are made by scientifically formulating fiberglass cloth, nano-ceramic filling, and polytetrafluoroethylene resin, followed by strict pressing processes. The series is based on the F4BM dielectric layer, with the addition of high dielectric and low loss nano-level ceramics, resulting in higher dielectric constant, improved heat resistance, lower thermal expansion coefficient, higher insulation resistance, and better thermal conductivity, while maintaining low loss characteristics. Optional copper foil is available with ED copper in thicknesses of 0.5 oz, 1 oz, 1.5 oz, and 2 oz.
Features & Benefits
DK 2.98-3.5 optional
Adding ceramic improves performance
Excellent PIM indicators
Rich thickness ranging 0.254mm to 12mm
Diversified size 460mm x 610mm to 914mm x 1220mm
Cost saving
Commercialization for mass production
High cost performance
Anti radiation
Low exhaust
Our PCB Capability (F4BTM)
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PCB Capability (F4BTM)
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PCB Material:
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PTFE / glass fiber cloth / Nano-ceramic filler
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Designation (F4BTM )
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F4BTM
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DK (10GHz)
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DF (10 GHz)
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F4BTM298
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2.98±0.06
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0.0018
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F4BTM300
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3.0±0.06
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0.0018
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F4BTM320
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3.2±0.06
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0.0020
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F4BTM350
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3.5±0.07
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0.0025
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Layer count:
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Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
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Copper weight:
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0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
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Dielectric thickness (or overall thickness)
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0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
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PCB size:
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≤400mm X 500mm
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Solder mask:
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Green, Black, Blue, Yellow, Red etc.
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Surface finish:
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Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..
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Data Sheet(F4BTM)
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Product Technical Parameters
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Product Models & Data Sheet
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Product Features
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Test Conditions
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Unit
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F4BTM298
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F4BTM300
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F4BTM320
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F4BTM350
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Dielectric Constant (Typical)
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10GHz
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/
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2.98
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3.0
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3.2
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3.5
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Dielectric Constant Tolerance
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/
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/
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±0.06
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±0.06
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±0.06
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±0.07
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Loss Tangent (Typical)
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10GHz
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/
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0.0018
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0.0018
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0.0020
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0.0025
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20GHz
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/
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0.0023
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0.0023
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0.0026
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0.0035
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Dielectric Constant Temperature Coefficient
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-55 º~150ºC
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PPM/℃
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-78
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-75
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-75
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-60
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Peel Strength
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1 OZ F4BTM
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N/mm
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>1.6
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>1.6
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>1.6
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>1.6
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1 OZ F4BTME
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N/mm
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>1.4
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>1.4
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>1.4
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>1.4
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Volume Resistivity
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Standard Condition
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MΩ.cm
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≥1×10^7
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≥1×10^7
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≥1×10^7
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≥1×10^7
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Surface Resistivity
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Standard Condition
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MΩ
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≥1×10^6
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≥1×10^6
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≥1×10^6
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≥1×10^6
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Electrical Strength (Z direction)
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5KW，500V/s
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KV/mm
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>26
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>30
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>32
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>32
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Breakdown Voltage (XY direction)
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5KW，500V/s
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KV
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>34
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>35
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>40
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>40
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Coefficientof Thermal Expansion
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XY direction
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-55 º~288ºC
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ppm/ºC
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15，16
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15，16
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13，15
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10，12
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Z direction
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-55 º~288ºC
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ppm/ºC
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78
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72
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58
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51
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Thermal Stress
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260℃, 10s，3 times
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No delamination
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No delamination
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No delamination
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No delamination
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Water Absorption
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20±2℃, 24 hours
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%
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≤0.05
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≤0.05
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≤0.05
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≤0.05
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Density
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Room Temperature
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g/cm3
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2.25
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2.25
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2.20
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2.20
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Long-Term Operating Temperature
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High-Low Temperature Chamber
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℃
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-55～+260
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-55～+260
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-55～+260
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-55～+260
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Thermal Conductivity
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Z direction
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W/(M.K)
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0.42
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0.42
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0.50
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0.54
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PIM
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Only applicable to F4BTME
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dBc
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≤-160
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≤-160
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≤-160
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≤-160
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Flammability
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/
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UL-94
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V-0
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V-0
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V-0
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V-0
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Material Composition
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/
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/
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PTFE, Fiberglass Cloth, nano-ceramics
F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil.
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BICHENG PCB CERTIFICATE:
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