Hybrid PCB RO3210 and RO3003 3-Layer 3mm Thick Hybrid Circuit Materials

Hybrid PCB RO3210 and RO3003 3-Layer 3mm Thick Hybrid Circuit Materials

1.1 Introduction of RO3210:

RO3210 is a high-frequency circuit material developed by Rogers. It is a ceramic-filled laminate reinforced with woven fiberglass, engineered to provide outstanding electrical performance and mechanical stability. One key characteristic that sets Rogers 3210 apart is its improved mechanical stability. The material combines the refined surface smoothness of a non-woven PTFE laminate with the rigid properties of a woven-glass PTFE laminate. These features make RO3210 an excellent choice for fabricating printed circuit boards using standard PTFE processing techniques.

1.2 Introduction of RO3003:

RO3003 is another high-frequency laminate offered by Rogers. It is a ceramic-filled PTFE composite designed for use in commercial microwave and RF applications.Rogers 3003 laminates exhibit exceptional stability of dielectric constant (Dk) across different temperatures and frequencies. Moreover, they eliminate the step change in Dk that is usually observed near room temperature with PTFE glass materials. This makes Rogers RO3003 ideally suited for applications such as automotive radar (77 GHz), advanced driver assistance systems (ADAS), and 5G wireless infrastructure (mmWave).

2.1 Features of RO3210

-Dk of 10.2 +/- 0.5

-Dissipation factor of 0.0027 at 10GHz

-Coefficient of thermal expansion matched to copper: x-axis 13 ppm/°C, y-axis 13 ppm/°C, z-axis 34 ppm/°C

-Decomposition Temperature (Td) of 500°C TGA

-Thermal Conductivity of 0.81W/mK

-Flammability rating of V0 according to UL 94 standard

2.2 Features of RO3003

-Rogers RO3003 ceramic-filled PTFE composites

-Dielectric constant of 3+/- 0.04 at 10 GHz/23°C

-Dissipation factor of 0.001 at 10 GHz/23°C

-Td > 500°C

-Thermal Conductivity of 0.5 W/mK

-Moisture Absorption of 0.04%

-Coefficient of Thermal Expansion (-55 to 288°C): x-axis 17 ppm/°C, y-axis 16 ppm/°C, z-axis 25 ppm/°C

PCB Stackup

The Hybrid PCB features a 3 layer PCB stackup configuration, ensuring excellent signal integrity and reliability. The stackup consists of the following layers:

Top Copper Layer: 35μm

Rogers RO3003 Core: 1.524 mm (60mil)

RO4450F Bondply: 0.101mm (4mil)

Copper Layer: 35μm

Rogers RO3210 Core: 1.27 mm (50mil)

Bottom Copper Layer: 35μm

PCB Construction Details

To meet the highest standards of quality and performance,This hybrid circuit board incorporates various construction elements:

PCB Statistics

This Hybrid PCB possesses the following statistics:

Type of Artwork Supplied

We provide the Gerber RS-274-X artwork forthehybrid circuit materials PCB, allowing for seamless integration into various manufacturing processes.

Quality Standard

Our PCB adheres to the IPC-Class-2 quality standard, ensuring consistent performance and reliability across different applications and environments.

Availability

Hybrid PCB is available worldwide, enabling customers from all locations to benefit from its exceptional features and performance.

Typical Applications

The versatility and high-frequency capabilities ofthe Hybrid multilayer printed circuit board PCB make it suitable for a wide range of applications, including:

Automotive collision avoidance systems

Automotive global position satellite antennas

Wireless telecommunications systems

Microstrip patch antennas for wireless communications

Direct broadcast satellites

Datalink on cable systems

Remote meter readers

Power backplanes

LMDS and wireless broadband

Base station infrastructure

Conclusion

In summary, our Hybrid PCB, combining RO3210 and RO3003 hybrid materials, offers outstanding electrical performance, mechanical stability, and reliability. With features such as matched coefficient of thermal expansion, excellent thermal conductivity, and optimal dielectric constant stability, this PCB is well-suited for demanding high-frequency applications. Its 3 layer PCB construction, along with precise manufacturing and quality standards, ensures consistent performance and reliability. Whether you require a PCB for automotive, wireless communication, or satellite applications, our Hybrid PCB delivers exceptional results. Place your order today and experience the power of our Hybrid PCB in your project.