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Home FR-4 PCB Board Thick 2.4mm Circuit Board Dual Layer PCB Built on FR-4 With 2oz Copper

Thick 2.4mm Circuit Board Dual Layer PCB Built on FR-4 With 2oz Copper

This is a type of 2 oz double sided PCB built on FR-4 substrate with Tg 150°C for the application of micro SATA carrier board.


  • Item NO.:

    BIC-464-v99.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Thick PCB 2.4mm Circuit Board Dual Layer PCB Board Built on FR-4 With 2oz Copper

(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)


1.1 General description


It's 2.4 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and immersion gold(4 microinch gold) on pads. The base material is from ITEQ supplying single PCB. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panels are packed for shipment.


1.2 Features and benefits     


1. Mid Tg substrate with Very Low moisture absorption and better CAF resistance;

2. Immersion gold has high solderability, no stressing of circuit boards and less contamination of PCB surface.

3. ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;

4. 16000㎡workshop and 30000㎡output capability per month;

5. Experienced sales persons provide skilled customer services;

6. IPC Class 2 / IPC Class 3;

7. Prototype PCB capability and Volume Production capability;

8. More than 18+ years of PCB experience.


Thick PCB 2.4mm


1.3 Applications


Splitter

Alarm System     

Security Alarm

Long Range WiFi Antenna

Modem 4G WiFi

Vehicle GPS

PLC Programming Tutorial

Security Access

Modular Oscilloscope

Fiber optic receptors


1.4 PCB Parameter


PCB SIZE 65.5 x 33.75mm=1PCS
BOARD TYPE Double Sided PCB
Number of Layers 2 Layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 52.5um(1.5oz)+plate TOP layer
FR-4 2.3mm
copper ------- 52.5um(1.5oz)+plate BOT layer
TECHNOLOGY
Minimum Trace and Space: 23 mil / 7.7 mil
Minimum / Maximum Holes: 0.7 mm / 3.2 mm
Number of Different Holes: 6
Number of Drill Holes: 23
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy:  FR-4 Tg150℃, er<5.4.IT-158,  ITEQ Supplied
Final foil external:  2 oz
Final foil internal:  2 oz
Final height of PCB:  2.4 mm ±0.2
PLATING AND COATING
Surface Finish Immersion gold (12.1% ) 0.1µm over 3µm nickel
Solder Mask Apply To:  TOP and Bottom, 12micron Minimum
Solder Mask Color:  Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend TOP and Bottom.
Colour of Component Legend White, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo:  Marked on the board in a conductor and leged FREE AREA
VIA Plated through hole(PTH), minimum size 0.7mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


1.5 Our PCB Capability (2022)


Parameter Value
 Layer Counts  1-32
 Substrate Material  RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
 Maximum Size  Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
 Board Outline Tolerance  ±0.0059" (0.15mm)
 PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)  ±8%
Thickness Tolerance(t<0.8mm)  ±10%
 Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
 Minimum Track 0.003" (0.075mm)
 Minimum Space  0.003" (0.075mm)
 Outer Copper Thickness  35µm--420µm (1oz-12oz)
 Inner Copper Thickness  17µm--350µm (0.5oz - 10oz)
 Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
 Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
 Registration (Mechanical) 0.00197" (0.05mm)
 Aspect Ratio  12:1
 Solder Mask Type  LPI
 Min Soldermask Bridge 0.00315" (0.08mm)
 Min Soldermask Clearance 0.00197" (0.05mm)
 Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance  ±10%
 Surface Finish HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger



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