• February 23, 2023

1. Printed Circuit Board (FPC) The FPC is made up of a plastic film, copper foil, and a binding agent. The FPC can contain circuits in multiple layers and support chip mounting or chip surface mounting, in addition to being bendable and flexible, ultrathin, and high-precision (SMT). The FPC is also known as the flex circuit, flexible PCB, membrane, flexible electronics, Large Fine Line FPC PCB, and so on. As with other substrates, higher wire density and more layers are required for the FPC to improve performance while lowering power consumption in signal transmission. FPC's technology threshold is higher due to the complexity of its manufacturing process. Application The FPC is widely used in a variety of products, almost all of which are high-tech. It is most commonly found in communication devices such as smartphones. Over 40% of the PCBs in a smartphone are FPCs. In addition, the FPC is used in laptops, autotronics, medical devices, weapons, and wearables. The miniaturization trend of products increases the importance of the FPC. According to statistics, the iPhone X uses approximately 20 FPCs. In addition to the iPhone, the FPC is frequently used in other terminal devices, such as the antenna FPC, backlight module FPC, camera lens FPC, touch screen FPC, Touch ID FPC, SIM FPC, laptop screen connection FPC, car image sensor FPC, car light assembly FPC, and so on. As a result, the significance of FPC is demonstrated. Texture The Flxible PCB can be classified according to material into the PI, MPI, and LCP. Because the performance of PI is so low that it is almost phased out, the MPI is a modified PI. Currently, the two most common FPC materials are MPI and LCP. Because the LCP performs better, its price is significantly higher. In terms of price-to-performance ratio (PPR), the MPI is generally thought to have a higher PPR. The MPI, in particular, has become a threat to the LCP after significant improvements in recent years. In 2018, Apple, for example, decided to replace LCP FPCs with MPI FPCs in order to reduce costs. The primary consideration in the selection of FPC materials is power consumption in signal transmission. Although there is no significant difference in power consumption in low-frequency transmission, as the frequency increases, the power consumption of the PI gradually increases, as does that of the MPI and LPC. As a result, the LCP has a greater advantage in high-frequency transmission. As a result, because a portion of the signal transmission frequency in 5G will exceed 24GHz, the FPC requirements will be higher. 2. Rigid-Flex Printed Circuit Board (RFPCB) The RFPCB is an abbreviation for Radio Frequency Power Control Board. In general, an RFPCB is formed when an FPC is laminated between two RFPCBs to form a complete PCB. The integration of HDI technology and the trend of high-frequency signal development will increase the popularity of the RFPCB. Traditionally, the FPC and Rigid-Flex PCB FR-4 Poyimide are linked together usin...

• February 17, 2023

When selecting high frequency and high speed materials for PCB used in high frequency circuits, the DK value of PCB materials and their variation characteristics at different frequencies should be taken into account. DF and its performance under frequency, temperature, and humidity conditions will be investigated for requirements that focus on high-speed signal transmission or characteristic impedance control. In general, high-frequency and high-speed materials exhibit the law of large changes in DK and DF values as frequency changes. Their DK and DF values change more noticeably in the frequency range from 1 MHz to 1 GHz. For example, the DK value of general epoxy resin-glass fiber cloth based substrate material general FR-4 substrates is 4.7 at lMHz, but it changes to 4.19 at lGHz. Its DK value changes slowly above lGHz. The change trend is decreasing as the frequency increases, but the change range is not large. At l0GHz, for example, the DK value of FR-4 is typically 4.15. The DK value of substrate materials with high speed and high frequency properties varies slightly with frequency. DK mostly stays within the 0.02 range as the frequency changes from lMHz to lGHz. Its DK value has a slight downward trend as frequency increases from low to high. Because of the influence of frequency changes, the dielectric loss factor DF of high frequency materials and high speed materials changes more than DK. Its change rule is increasing. As a result, when evaluating a substrate material's high-frequency characteristics, the focus of its investigation is its DF value change. There are two distinct types of common substrate materials that have high speed and high frequency characteristics. One advantage is that its DF value varies very little with frequency. In the range of change, another type is similar to the general substrate material, but its DF value is low. How to Choose High-Frequency and High-Speed Materials? PCB material selection must strike a balance between meeting design requirements, mass production, and cost. Design requirements, in short, include electrical and structural reliability. When designing a very high-speed PCB with a frequency greater than GHz, the PCB material issue usually takes precedence. The current FR-4 material, for example, has a high dielectric loss at several GHz frequencies, which may be inapplicable. What are the high-frequency and high-speed PCB materials? For example, a 10Gb/S high-speed digital signal is a square wave, which can be thought of as a superposition of sine wave signals of varying frequencies. As a result, 10Gb/S contains a wide range of frequency signals. 5GHz fundamental signal, 3rd order 15GHz signal, 5th order 25GHz signal, 7th order 35GHz signal, and so on. The digital signal's integrity and the steepness of the upper and lower edges are the same as the high-frequency harmonic part of the RF microwave digital signal, which achieves low loss and low distortion transmission in the microwave frequency...

• February 09, 2023

The Advantages of Rogers DiClad 870/880 Series Laminates The Rogers DiClad 870 and 880 series laminates have low dielectric constant values, low moisture absorption, and a unique routing design. The two-layer, woven PTFE laminates are also available in 48′′ x 54′′ sizes. They are ideal for PCB applications that require high frequency and registration stability. Continue reading to learn more. Low-density woven-fiberglass composites reinforced with woven fiberglass are used in both the DiClad 870 laminates. These materials are excellent for high-frequency PCB applications that require low dielectric constants as well as improved registration and dimensional stability. TMM and IsoClad laminates are also available from Rogers for a more reliable and complex routing process. Rogers PCB materials, in addition to their unique routing design, are critical in a variety of technologies. The most recent advances in semiconductor technology have enabled signal processing at higher frequencies. The high-frequency Rogers laminate is ideal for digital PCB applications that require 10 GHz performance. FR-4 materials may also be required for high-frequency PCB applications. Rogers DiClad laminates are the best choice for high-frequency PCB designs. When determining the proper thickness for your PCB, consider how many circuits your design requires. Naturally, the more layers there are, the higher the overall cost. However, keep in mind that custom designs may necessitate specialized skills. Furthermore, these custom designs may necessitate the use of specialized equipment or tools. Once you've determined the thickness you require, you can choose the best substrate for your needs. The dissipation factor, or Dk, of Rogers DiClad 870/881 laminates is lower than that of other materials on the market. These materials have higher thermal conductivity than traditional PTFE laminates and are suitable for multilayer PCBs. In the PCB semiconductor industry, they also have the highest embedded resistor constancy. Rogers DiClaD 870/880 laminates have a dielectric constant of 2.60 nm. Microwave and millimeter-wave applications are possible with these materials. The thin metal cladding used in these laminates contributes to their thermal stability. Furthermore, the materials can be used with standard PTFE-based printed circuit board substrates. These materials are ideal for use on high-reliability printed circuit boards. Rogers DiClad 870/80 material's electrical properties are critical in high-frequency PCB design. High-frequency laminates are required for high-frequency PCB applications. The dielectric constant quantifies a material's ability to store electrical charge. The greater the dielectric constant, the greater the benefit. Rogers DiClad 870/880 material has a lower dielectric constant, which means less signal loss in high-frequency PCB applications. Rogers DiClad 880 and 850 laminates' thermal stability is critical to their application. It must be able to withstand a...

• February 03, 2023

Rogers TMM Series PCB: TMM 3, TMM 4, TMM 6, and TMM 10 Rogers TMM thermoset microwave materials are composites of hydrocarbon ceramics and thermoset polymers designed specifically for strip-line and microstrip applications. TMM is available in a variety of claddings and dielectric constants. TMM laminates have mechanical and electrical properties that make them suitable for a variety of applications. TMM has a very good thermal expansion coefficient, a slow thermal change of the dielectric constant (Dk), and a stable dielectric constant. Greater copper coating specifications are available from TMM. These laminates possess the qualities of both ceramic and PTFE microwave circuit laminates without requiring the manufacturing processes for those materials. TMM is distinct from other laminates in that it does not require sodium napthanate treatment prior to electroless plating. TMM laminates have an extremely low thermal coefficient of Dk, which is usually less than 30 ppm/°C, which is one of their most amazing properties. TMM laminates are based on thermoset resins, and do not soften when heated. As a result, wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation. TMM laminates combine many of the desirable features of ceramic substrates with the ease of soft substrate processing techniques. Substrate thicknesses of 0.015” to 0.500” are available. The base substrate is resistant to etchants and solvents used in printed circuit production. Consequently, all common PWB processes can be used to produce TMM thermoset microwave materials The Benefits of Rogers TMM TMM laminates from Rogers are high-quality microwave materials with excellent electrical and mechanical properties. These materials bring together the advantages of PTFE microwave circuits and ceramic laminates. Rogers TMM laminates have exceptional mechanical properties because they resist cold and creep flow, making them mechanically reliable and stable. Chemical reagent resistance: Rogers TMM laminates are chemical reagent resistant, which helps to ensure that there is no damage during the placement and production process. After being exposed to chemical reagents for a set period of time, these microwave materials retain their original properties. Rogers TMM laminates are made of thermosetting resin, which ensures good wire bonding. These materials can withstand any temperature, including extreme heat. Absorption of moisture: These laminates can endure in a humid setting. Rogers TMM is a good material for a setting with high levels of humidity because it can absorb moisture from its surroundings. The laminate known as Rogers TMM is made of ceramics, hydrocarbons, and thermosetting polymers. Comparing these laminates to some alumina filler substrates reveals processing advantages. Rogers TMM laminates come in a variety of thicknesses, including TMM 10, TMM 6, TMM 4, etc., but they all share a number of characteristics. The m...

• January 12, 2023

Today, a wide range of portable wireless and commerce sectors, including health, communication, etc., have adopted Microwave PCB technologies. Circuit interferences and radiation in the PCB design are difficult to control because microwave circuit boards are distributed variable circuits that continue to produce skin effects and interaction effects. The most common issues include resonance issues caused by absurd layouts, cross-interference between digital and analog circuitry, power interference with noise, and related resonance issues. As a result, it is crucial for Microwave PCB design to weigh the advantages and disadvantages of PCB design and make an effort to cut down on interference. What is the Microwave PCB? The RF and microwave PCB boards are distinctive and cutting-edge PCB kinds created to operate at signal frequencies between megahertz and gigahertz (medium frequency to extremely high frequency). From cellphones to military radars for network transmissions, these frequencies are used everywhere. Extremely specific materials and technology are required for this PCB equipment, which are not readily available from many producers. How do RF and Microwave PCB differ? The radiofrequency of RF circuit boards and microwave PCBs is their primary differentiator. Microwave PCBs are categorized as RF circuit boards that operate over 2GHz. Microwave PCBs and RF circuit boards are used for networking signals in any application that calls for the reception and transmission of radio signals. Radar stations and mobile phones, for instance, are two common applications. Microwave PCB advantages: Since electronics are so useful, this technology is becoming more and more popular every day. The PCB design for microwaves has several benefits. Let's look at them now. High Stability: Extreme temperature PCB design is especially stable. When analog applications are used, these PCBs are capable of operating at 40 GHz. High Speed: Signals can pass through the PCB more quickly and imperturbably thanks to the low tangent and consistency of the loss. Components: Fine pitch components can be successfully mounted on the board without too many issues. Costs reduced: In order to reduce PCB assembly costs while maintaining optimal PCB performance, the materials may be combined in a panel storage system. Multifaceted: A PCB engineer can quickly align several layers of boards into complex patterns because to the usage of low CTE components. Microwave PCB Materials: Conductivity constant (DK), overindulgence feature, thermal expansion coefficient (CTE), dielectric constants, and current conductivity are important factors that determine laminate circuit performance for microwave/RF printed circuit boards when designing PCB components at higher frequencies. The most identifiable different frequencies material for PCB cover workers is polytetrafluoroethylene (PTFE). It is a manufactured thermoplastic fluoropolymer with good radio wave dielectric properties. Here is a brief s...

• January 11, 2023