Shenzhen Bicheng
Electronics Technology Co., Ltd

# Call Us Now ! Tel : +86 755 27374946

# Order Online Now ! Email : info@bichengpcb.com

RF PCB Printed Board
RF PCB Printed Board
Industry News
  • Let's get to know the High Frequency Boards in 5G Era.
    Let's get to know the High Frequency Boards in 5G Era.
    • April 08, 2022

    Let's get to know the High Frequency Boards in 5G Era. We provide high frequency plate of various technologies With the development of electronic technology. The production of electronic products requires more and more materials, such as high-frequency materials. ROGERS PCB, for example, is a type of high-frequency board produced by ROGERS Company. Unlike conventional PCB board epoxies, it has no glass fiber in the middle and is a ceramic based high-frequency material. When the circuit operates at frequencies above 500MHz, the range of materials available to the design engineer is greatly reduced. Rogers RO4350B materials allow RF engineers to easily design circuits, such as network matching, impedance control of transmission lines, etc. Due to its low dielectric loss, R04350B has an advantage over ordinary circuit materials in high frequency applications. Its dielectric constant fluctuation with temperature is almost the lowest among similar materials. In a wide frequency range, its dielectric constant is quite stable 3.48, and the design recommended value 3.66. LoPra copper foil reduces insertion loss. This makes the material suitable for broadband applications. Rogers PCB materials ceramic hf plate series classification: Rogers RO3000 series: PTFE circuit materials based on ceramic filling, Rogers models are: RO3003, RO3006, RO3010, RO3035 high frequency laminate. Rogers RT6000 series: Based on ceramic filled PTFE circuit material, designed for electronic and microwave circuits requiring high dielectric constant, Rogers models are: RT6006 dielectric constant 6.15, RT6010 dielectric constant 10.2. Rogers TMM series: based on ceramic, hydrocarbon, thermosetting polymer composite materials, Rogers models: TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i. , etc. At present, the global 5G layout is accelerating. The traditional 3G/4G base station distributed architecture can be mainly divided into BBU, RRU and antenna feed system, among which RRU and antenna feed system are connected through feeders. Due to the increased risk of transmission loss under high frequency, the architecture of integrated RRU and antenna feed system can reduce signal loss on feeders and improve transmission efficiency. Highly integrated, a large number of scattered parts are replaced by PCB boards, which ultimately increases the unit usage of PCB. In the 5G era, high frequency bands must be used (3GPP has specified that 5GNR supports a frequency range of 450MHz to 52.6ghz) for the following reasons: 1) After the iteration of the first 4 generations of communication technology, the resources of low frequency band have been occupied, and the resources that can be used for 5G development are few; 2) The higher the frequency is, the more information can be loaded, the more resources are richer, and thus the transmission rate can be higher (for example, in 100MHz, only 5 channels of 20MHz can be divided, while 1GHz can be divided into 50 channels of 20MHz). Resonance phenomenon caused ...

  • A Brief Analysis of the Future Trend from the PCB/Copper Clad Market in 2021
    A Brief Analysis of the Future Trend from the PCB/Copper Clad Market in 2021
    • April 01, 2022

    A Brief Analysis of the Future Trend from the PCB/Copper Clad Market in 2021 2021 will be a roller-coaster year for the PCB and copper clad markets. In 2020, all countries except the Chinese mainland experienced a sharp decline in the economy due to the impact of COVID-19. Governments in order to save the economy, in 2021 took a variety of powerful economic stimulus policies, under the policy to promote national economy all has the different degrees of recovery, notably the world's two largest economies of China and the United States (regardless of cause) the performance of the most bright eye, GDP growth of 8.1% and 5.7% respectively, Europe toward positive growth 5.2%, Japan has also climbed out of the trough and southeast Asian economies have turned positive. The year of 2021 will go down in history Under the influence of such a macro economy, the electronics industry will fully recover in 2021, which also drives the explosive growth of PCB demand. Prismark expects global PCB production to grow 22.6 per cent -- a double-digit increase rarely seen in years -- to more than $80bn. The main PCB producing areas in Asia are not only Mainland China (more than 40 billion US dollars), Taiwan (up 17.5% with an output value of 817.8 billion NT dollars), but even Japan (19.2% with an output value of 14.06 billion US dollars), which has been declining for several years. In such PCB market strong demand, copper-clad board is also hard to find, a time "where are the copper-clad board" in the supply chain boiling. The hard demand of economic recovery and supply chain obstruction, plus inflation, plus the instantaneous shortage of production capacity, plus inventory depletion and other reasons, the supply chain as a whole is difficult to bear, all materials of copper clad plate have risen sharply, the general increase of more than 50%. Some materials, for example, have nearly doubled in value since their lows in 2020. Due to the rapid and dramatic rise in cost and the instantaneous shortage of supply, the price increase of copper-clad plate became the only choice. Back then, people didn't ask what went up, they asked what didn't go up. Therefore, "shortage", "increase" almost noisy for a whole year. For most of the year, there was a rush to buy, stock up and adjust prices, but in the fourth quarter of 2021, the market began to adjust. 2021 is sure to go down in history for the entire PCB/ copper-clad industry, with many experiences that will be talked about for years to come. Although the final full-year operating statistics are not yet available, a 20 per cent increase in mainland China's copper clad industry output is not a problem. Although the overall production expansion incremental effect in 2021 has not been fully shown, but because the operating rate in previous years is about 75%, and it is believed that the vast majority of enterprises have full or close to full production in 2021, therefore, production and sales will have a large increase. With the ...

  • PCB Technology Is Facing New Challenges in 5G Era, What Should We Do?
    PCB Technology Is Facing New Challenges in 5G Era, What Should We Do?
    • March 22, 2022

    PCB Technology Is Facing New Challenges in 5G Era, What Should We Do? 5G communication has more and more influence on people's life, and new mobile phones will step into the 5G era bit by bit. Today, let's take a look at what challenges 5G communication brings to PCB industry. Material requirements: A very clear direction of 5G PCB is high frequency and high speed material and plate making. In terms of high frequency materials, it is obvious that leading materials manufacturers in the field of traditional high speed, such as Lianmao and Panasonic, have begun to lay out high frequency plates and launched a series of new materials. This will break the current situation of Rogers alone in the field of high-frequency sheet metal. After healthy competition, the performance, convenience and availability of materials will be greatly enhanced. Therefore, high-frequency materials localization is an inevitable trend. Requirements for quality monitoring: Due to the improvement of 5G signal rate, plate making deviation has a greater impact on signal performance, which requires more stringent production deviation control of plate making. However, the existing mainstream plate making process and equipment are not updated much, which will become a bottleneck for future technological development. How PCB manufacturers break the situation is very important. Requirements for manufacturing process: The enhancement of functions of 5G-related application products will increase the demand for high-density PCB, and HDI will also become an important technology area. Multi-stage HDI products and even arbitrary sequential interconnect products will be promoted, and new technologies such as buried resistance and buried capacity will be applied more and more. The uniformity of copper thickness, precision of line width, alignment between layers, thickness of interlayer medium, control precision of back drilling depth and plasma drilling ability of PCB are all worthy of further study. Requirements for PCB design: panel selection should meet the requirements of high frequency and high speed, impedance matching, cascade planning, wiring spacing/holes should meet the requirements of signal integrity, which can be started from six aspects: loss, embedding, high frequency phase/amplitude, mixed voltage, heat dissipation and PIM. Requirements for equipment and instruments: high-precision equipment and pretreatment line with less coarsening of copper surface are ideal processing equipment at present; And the test equipment has no source intermodulation tester, flying needle impedance tester, loss test equipment. Precision graphic transfer and vacuum etching equipment, real-time monitoring and feedback data changes in line width and coupling spacing detection equipment; Electroplating equipment with good uniformity and high-precision lamination equipment can also meet the production requirements of 5G PCB.

  • Focus on Domestic High-end PCB Replacement Process
    Focus on Domestic High-end PCB Replacement Process
    • March 08, 2022

    Focus on Domestic High-end PCB Replacement Process PCB is the mother of electronic products, and the range of market is growing steadily. As a transmission medium, PCB can realize the connection between electronic components, play the role of relay transmission, and is the support body of electronic components. In 2019, the global PCB output value was 61.3 billion US dollars, with a compound annual growth rate of 2.18% from August to 19th, showing an overall steady growth. The PCB market in Mainland China is benefiting from the transfer of global PCB production capacity to mainland China and the growth of downstream terminal demand. In recent years, the PCB market in Mainland China has shown a rapid development trend. The OUTPUT value of PCB in Mainland China reached 33.507 billion US dollars in 2013, with a compound annual growth rate of 7.56% from August to 19th. Raw material cost pressure eased, PCB enterprises 21Q3 ushered in the performance inflection point. Since 2021, supply constraints/strong demand/monetary easing and other factors have jointly driven up the price of commodity raw materials, affecting the profitability of downstream PCB companies. After Q3, with the easing of the epidemic in copper producing countries, superimposed enterprises began to shift part of the cost pressure to the downstream, and the impact of raw material prices on corporate performance was blunted to some extent, and the profitability of the sector was repaired. PCB board 21Q3 realized revenue of 53.33 billion yuan, up 27.7% year on year, realized net profit of 5.08 billion yuan, up 38.2% year on year. In q3, the gross profit margin of the sector was 20.9%, down 2.4 PCT year-on-year. The net profit margin of the sector was 9.6%, up 0.7 PCT year-on-year. The profit growth rate began to turn positive, and the profitability was improved, and the sector ushered in the performance inflection point. China's PCB products are mainly low-end, focusing on IC board, high order HDI and other high-end products of domestic replacement process. At present, China's PCB products are mainly low-end PCBS, while the share of packaging substrate, high-order HDI and other high-end PCBS is relatively low, and the product structure needs to be optimized. As PCB enterprises represented by Xingsen and Shennan expand the production capacity of high-end PCB such as IC board, the voice of domestic enterprises in the field of high-end PCB is expected to be enhanced. It is suggested to pay attention to relevant beneficiary enterprises.

  • China's PCB Production Value Drives the Development of Flying Probe Testers
    China's PCB Production Value Drives the Development of Flying Probe Testers
    • March 01, 2022

    China's PCB production value drives the development of flying probe testers The flying probe tester is used for analog component testing and analog signal analysis. It has the advantages of being free from grid restrictions, high flexibility, convenient operation, saving testing costs, and improving shipping efficiency. Flying probe tester is mainly used to test PCB. It is an instrument for testing PCB boards with many layers of components, large wiring density and small distance between measuring points. PCB boards have a wide range of applications and high market demand, which is good for the development of the flying probe tester industry. Flying probe testers are mainly used for PCB boards. PCB boards have a wide range of applications and are used in many fields such as communications, computers, consumer electronics, automotive lists, aerospace, and the market demand continues to rise. With the gradual maturity of 5G technology, the number of 5G macro base stations has increased. In the first half of 2021, the number of 5G macro base stations constructed in my country is about 720,000. The increase in the number of 5G base stations has driven the continuous increase in the market demand for high-speed PCBs. According to the "2022-2027 Flying Probe Tester Industry Market In-depth Research and Investment Prospect Forecast Analysis Report" released by Xinsijie, benefiting from the development of the terminal industry, my country's PCB output and output value continue to rise, and the output in 2019 is about 7 100 million square meters, the output value is 33.3 billion US dollars. And driven by the development of automotive electronics, the domestic PCB output value continues to rise, reaching 38.2 billion US dollars in 2021. my country's PCB output value ranks first in the world. Driven by the development of the Chinese market, the global PCB output value is relatively high. It is expected that the market size will reach 80 billion US dollars by 2025. The rapid development of the global and domestic PCB board industry has also promoted the rising market demand for flying probe testers, and the flying probe tester industry has developed rapidly. In 2020, the global flying probe tester market size is about 150 million US dollars. In the future, driven by the development of the automotive electronics industry, the flying probe tester market size will maintain a growing trend, reaching 170 million US dollars by 2025. In terms of market competition, the manufacturers of flying probe testers include Takaya Corporation, ATG Luther & Maelzer GmbH, SPEA and other companies. The above three companies account for about 80% of the market, and the market is highly concentrated. In the world, Europe, the United States and Japan have leading technological advantages in the field of flying probe testers, and have a large market competitive advantage. my country's layout in the field of PCB boards is relatively late, the production technology and equipment ...

  • PCB Industry Development Features
    PCB Industry Development Features
    • February 23, 2022

    PCB Industry Development Features The full name for a Circuit Board is "Printed Circuit Board" or "PCB", also known as "Printed Wiring Board" (PWB). There are many kinds of printed circuit board products, which can be classified by substrate material, conductive graphic layer, product performance, application field and other dimensions. According to the substrate structure, the printed circuit board can be divided into rigid circuit board, flexible circuit board, RF board and HDI board. 1. Industry Features (1) Periodicity With the development of electronic information industry, printed circuit board industry downstream application fields are also more and more diversified, applications involving communications electronics, consumer electronics, computer, automotive electronics, industrial control, medical equipment, defense and aerospace, etc. All of the social economy, so the PCB industry of periodic less affected by single downstream industry, Its periodicity is mainly reflected in the fluctuation of macroeconomic and the change of the overall development of the electronic information industry. (2) seasonality At present, the main downstream application products of THE HDI industry are concentrated in the fields of communication electronics and consumer electronics such as mobile phones, tablets and laptops. In the field of consumer electronics, HDI manufacturers' production and sales volume in the second half of the year is generally higher than that in the first half of the year due to the comprehensive influence of downstream customers' holiday consumption and peak consumption season. (3) Regional Globally, as Asia especially China in such aspects as Labour, policy guidance, industry gathered the advantage of global PCB industry centre of gravity is constantly shift to Asia, gradually formed in the other parts of Asia as the center, the new pattern of auxiliary, Asia especially China become the world's PCB and its main production base of high-end products of HDI. In China, PCB manufacturers are mainly concentrated in the pearl River Delta, Yangtze River Delta, Bohai Rim and other regions with high economic level. However, due to the influence of cost and other factors, domestic PCB manufacturers tend to gradually shift to the mainland.

© Copyright: 2024 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.

IPv6 network supported

IPv6 network supported

top

Leave A Message

Leave A Message

    If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

  • #
  • #
  • #