• November 17, 2022

What is the base material of a metal core PCB? Metal-core PCB commonly use aluminum-based, iron-based (including silicon steel), copper-based, and CIC as the base substrate. 1.Aluminum-based substrate The most commonly used aluminum-based substrates for manufacturing metal-core PCBs are LF, L4M, and LY12, which require a tensile strength of 294N / mm. The elongation is 5%, and the thicknesses generally used are four specifications of 1mm, 1.6mm, 2mm, and 3.2mm. Generally, the thickness of the aluminum layer commonly used in the aluminum-based PCB used for communication power is 140um, and copper foil is attached above and below. 2. Copper-based substrate The commonly used copper-based substrates have a tensile strength of 245 to 313.6 N / mm2, an elongation of 12%, and generally five thicknesses of 1 mm, 1.6 mm, 2 mm, 2.36 mm, and 3.2 mm. 3.Iron-based substrate Generally used in production are cold-rolled rolled steel plates, which are low-carbon steels with thicknesses of 1mm and 2.3mm, or phosphorus-containing iron-based thicknesses of 0.5mm, 0.8mm, and 1.0mm. 4. Features of metal core PCB Heat dissipation Conventional PCB substrates are generally poor thermal conductors, and the heat dissipation from the interlayer insulation material is very slow. The internal heat of various electronic equipment and power equipment cannot be eliminated in time, resulting in high-speed component failure. The metal core PCB has good heat dissipation. The metal core has large thermal capacity and high thermal conductivity, which can quickly dissipate the heat inside the board. If the metal core is connected to the case and the external heat sink, the heat dissipation effect is better. Because electronic equipment and communication systems use metal-core PCBs, the fans in the equipment can be eliminated, the size of the equipment is greatly reduced, and the efficiency is improved, which is especially suitable for electronic equipment with closed chassis. Thermal expansion Thermal expansion and contraction are the common characteristics of materials, and the thermal expansion coefficients of different materials are different. PCB is a composite material composed of resin, reinforcing material, and copper foil. Its thermal expansion coefficient is anisotropic. In the XY axis direction, the thermal expansion coefficient CTE of PCB is 13 × 10-6 ～ 18 × 10-6 / ℃. The thickness direction (Z-axis direction) is 80 × 10-6 to 90 × 10-6 / ° C, the CTE of copper is 16.8 × 10-6 / ° C, and the CTE of the sheet-shaped ceramic body is 6 × 10-6 / ° C. From these data, it can be seen that the CTE of the metalized hole wall of the PCB and the connected insulating substrate in the z-axis is very different. If the heat generated cannot be eliminated in time, thermal expansion and contraction will easily cause the metalized hole wall plating to crack or disconnect. When soldering a ceramic chip carrier device on a PCB, due to the difference between the device and the PCB material CTE,...

• November 11, 2022

What is the difference between PCB and metal core PCB? One important difference to understand between metal core PCB and standard PCB is how the materials work together to create the necessary result. In metal core PCB, there is a single layer of copper with is bonded to a layer of conductive dielectric material, which is further bonded to a thick metal layer (typically Aluminum 5052, Aluminum 6061, or Copper C1100). The dielectric used is approximately 6-7 times as thermally conductive as FR4. The dielectric is to be kept as thin as possible. This reduces the distance from the heat source to the metal plate which is more conductive than the dielectric. As you know, the metal plate on the bottom side is the thickest element in the structure. It is available in several different thicknesses, however, there are three most common thickness, such as 1.0mm, 1.5mm, and 3.2mm as they are the easiest to purchase. The metal also gives the PCB rigidity and does not require any surface finish or solder mask. FR-4 PCB Vs. Metal core PCB comparison Plated through holes: in general, plated through holes are used in FR-4 PCB. It can be through hole components if required. In metal core PCB, plated through holes are not available for 1-layer PCB. All components are surface-mounted. Conductivity: FR-4 PCB has low thermal conductivity, in general about 0.3W, however, MCPCB has a higher thermal conductivity between 1.0W and 4.0W, most commonly about 2.0W. Thickness: FR-4 PCB has a wide range of thickness, also uses many material combinations and layers. Metal core PCB has a limited thickness variation. Thermal relief: as usual, Thermal relief in FR4 PCB involves vias for heat transfer. And it has a longer drilling processing cycle. Metal core PCBs don’t require via as their own thermal dissipation. Consequently, they do not require drilling, deposition and plating processes. Solder mask: FR-4 PCB solder mask is dark colors such as green, red, black and so on, which usually applied on top and bottom. For LED boards, metal core PCB solder mask are almost exclusively white and they are only applied to the top. Machining process: FR-4 PCB uses standard processing such as drilling, routing, v-scoring, countersink, counterbore and so on. whereas in metal core PCBs, there is a distinctive difference in the v-scoring process i.e. diamond-coated saw blades are used for the added strain from cutting into metal.

• November 03, 2022

What Makes the HDI PCB Different? The advantages of HDI PCBs over ordinary PCBs are listed below, demonstrating how they differ from other kinds of PCBs. 1. Enhanced Thermal Efficiency Due to the use of copper foil rather than aluminum foil in FR4s, HDI PCBs have higher thermal performance. In comparison to aluminum, copper is a far superior heat conductor and can dissipate heat much more effectively. Less power is wasted as a result, which is crucial when working with high-power circuits like motor drivers or power supplies. 2. Improved Signal Integrity Because signal traces from multiple layers can be routed closer together on the same plane, HDI pcb boards are able to retain signal integrity over longer distances than conventional single-layer boards. Additionally, due to capacitance effects, signal traces on one layer can be routed over other traces on another without degrading the quality of the signal. 3. Increasing Reliability By enhancing the insulation between conductors and circuits, lowering crosstalk, and preventing short circuits between signals moving on neighboring planes, HDI pcb boards improve system dependability. Additionally, they improve mechanical strength by lowering stress concentrations brought on by densely packed components in high numbers. 4. Greater Density Compared to conventional single-layer boards, HDI pcb boards support more electrical connections per unit space. The usage of several layers in the stackup and blind vias as layer interconnects are mostly to blame for this. 5. More Compact Size HDI PCBs are more compact than conventional PCBs because of the enhanced trace density. As a result, they take up less space on one board, making them perfect for portable gadgets like laptops, tablets, and smartphones. Additionally, because of their reduced size, they are simpler to manufacture on a single assembly line without the need for special tools for each product's various sizes. 6. Mechanical Power Standard PCBs cannot sustain the amount of stress that HDI PCBs. This is a result of their construction, which consists of several sheets of thin plastic linked together with an epoxy adhesive. Depending on the kind of resin used in construction, each layer's strength varies. 7. Lower Price HDI pcb boards can be less expensive than other kinds of multilayer boards and other kinds of boards produced from copper-clad laminate because they are easier to make and less expensive to create than single-sided boards (CCL). Both low-volume production runs and high-volume production runs are compatible with them. HDI PCBs for a Variety of Applications Where reliability is crucial, HDI PCBs are frequently utilized in avionics, military, and aerospace applications. A typical airplane requires hundreds of microcircuits, sensors, and other electronic parts, all of which must be wired together. The conventional method calls for all of these wires to be soldered directly on top of one another, which frequently results in a number of iss...

• October 18, 2022

American PCB manufacturer Calumet Electronics plans to build an advanced packaging substrate manufacturing plant in China The US PCB manufacturer Calumet Electronics said in an external statement that the company is working hard to fill a key gap in the production capacity of packaging substrates in the United States. "Calumet will be one of the first, if not the first, to bring scalable IC substrate capacity to the U.S.," said Todd Brassard, the company's chief operating officer. "We've been developing this capability for about three years. We have partnered with some Defense and commercial OEMs have collaborated to complete the first substrate sample fabrication. We have received in-demand requests for our substrates in excess of 1.5 million units per year before we even started production.” The United States currently lags behind Asian suppliers significantly in the field of IC packaging substrates, especially the FCBGA and FCCSP substrates used for advanced packaging are almost completely dependent on Asian manufacturers such as Xinxing, ASE, Ibiden, etc., and low-volume customized substrates involving national defense and other needs are often Lead times are several years. According to Brassard, Calumet is one of the few PCB companies in the United States that can produce high-density interconnect (HDI) circuit boards, and it is also one of the few manufacturers with ABF substrate research and development capabilities. Customers in the fields of satellite communications, medical equipment and other fields provide customized development services.

• September 30, 2022

Holiday Notice for People's Republic of China National Day Dear customers: We will have National Day holiday from Oct.01-Oct.07, 2022. And we will resume normal work on Oct.08. During Holidays, should you have any enquiries, please feel free to email to infor@bichengpcb,com. Thank you. Best regards, Shenzhen Bicheng Electronics Technology Co., Ltd

• September 22, 2022

What is the difference between Rogers PCB and ordinary PCB? Compared with ordinary PCB, Rogers is more suitable for making high-frequency PCB, and the board has better stability and higher precision. Rogers board has the following 4 series: RO4000 PCB board: Hydrocarbon-filled ceramic laminate with excellent cost performance. High-reliability TMM: rich dielectric constant, DK from 3.27-12.85, extremely low change with temperature, excellent mechanical properties, can resist creep flow and cold flow. High thermal conductivity 92ML: Epoxy resin + high thermal conductivity ceramic powder filled high thermal conductivity and high withstand voltage electronic material, UL MOT150 ℃, the absolute value of the same medium thickness withstand higher, 8mil> 4500VAC High-reliability RT / Duroid 5000/6000: PTFE filled ceramic or random glass fiber laminates with strict batch consistency and extremely stable electrical performance. Focus on high reliability and high stability applications. Rogers products are mainly used in: Mobile communication RF power amplifier circuit & antenna, microwave millimeter wave antenna, LNB for satellite broadcasting, microwave communication, millimeter-wave radar and optical communication, high-performance high-speed digital circuit multilayer PCB, high power and high thermal conductivity, automotive electronics, power supply, etc.