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Home Newly Shipped RF PCB IT-180ATC 1.6mm 4-layer High Tg Multi-layer Rigid Blind Via FR-4 PCB

IT-180ATC 1.6mm 4-layer High Tg Multi-layer Rigid Blind Via FR-4 PCB

IT-180ATC 1.6mm PCB offers exceptional thermal reliability, CAF resistance, and various advanced features that make it an ideal solution for demanding applications

  • Item NO.:

    BIC-294-v366.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


IT-180ATC 1.6mm 4-layer High Tg Multi-layer Rigid Blind Via FR-4 PCB

 

Overview

The IT-180ATC PCB is an advanced and versatile printed circuit board (PCB) designed to meet the demanding requirements of various applications. With its high glass transition temperature (Tg) of 175°C, exceptional thermal reliability, and CAF resistance, the IT-180ATC Multi-layer PCB offers superior performance and reliability. This 4-layer rigid PCB is suitable for lead-free assembly processes and has excellent through-hole reliability, making it an ideal choice for automotive, telecommunications, data storage, server and networking, and backplane applications.

 

Key Properties

The IT-180ATC High Tg Multi-layer PCB boasts a range of impressive properties that contribute to its reliability and performance. Here are some noteworthy features:

 

1)Glass Transition Temperature (Tg) by DSC:

The Tg of 175°C ensures the board's dimensional stability, enabling it to withstand high operating temperatures without compromising its structural integrity.

 

2)Lead Free Process Compatibility:

The IT-180ATC PCB is compatible with lead-free assembly processes, adhering to the industry standards and regulations while ensuring environmentally-friendly manufacturing practices.

 

3)Excellent Coefficient of Thermal Expansion (CTE):

With a low X-axis CTE of 11-13 ppm/°C and a slightly higher Y-axis CTE of 13-15 ppm/°C, this PCB minimizes the risk of thermal stress-related failures, resulting in improved reliability.

 

4)Time to Delaminate by TMA: 

The IT-180ATC PCB exhibits excellent thermal stability, with a T260 of 60 minutes and a T288 of 20 minutes. These values indicate the amount of time the board can withstand given temperatures without experiencing delamination.

 

5)DK and Df Values:

The dielectric constant (DK) is 4.4 at 1 GHz and 4.5 at 1 MHz, while the dissipation factor (Df) is 0.014 at 1 MHz and 0.015 at 1 GHz. These properties are vital for achieving efficient signal transmission and minimizing signal loss in high-speed applications.

 

6)CAF Resistance:

The IT-180ATC PCB demonstrates excellent resistance to Conductive Anodic Filament (CAF) formation, ensuring long-term reliability and preventing failures caused by conductive metal filaments forming under biased conditions.

 

7)Moisture Resistance:

With a moisture resistance rating of 0.1%, this PCB is highly resilient against moisture-related issues, including delamination, warping, and degradation of electrical properties.

 

8)Flammability:

The laminate and laminated prepreg of the IT-180ATC PCB comply with the UL94-V0 flammability standard. This indicates that the PCB has excellent flame retardant properties, making it a safe choice for various applications.


IT-180_4-Layer_PCB_4-Layer_BICHENG

 

PCB Construction and Specifications

The IT-180ATC PCB, a 4-Layer Blind Via FR-4 PCB, is carefully constructed to ensure optimal performance and reliability.


Stack-up:

Layer Type

Layer Name

Thickness

Copper

Copper_layer_1

0.035 mm

Prepreg

Prepreg 7628H X 1

0.21mm

Copper

Copper_layer_2

0.035 mm

Core

IT - 180ATC Core

1.03 mm (40.5mil)

Copper

Copper_layer_3

0.035 mm

Prepreg

Prepreg 7628H X 1

0.21mm

Copper

Copper_layer_4

0.035 mm

 

Here are the key construction details:

Parameter

Details

Board Dimensions

130mm x 175 mm = 6PCS, +/- 0.15mm

Minimum Trace/Space

4/6 mils

Minimum Hole Size

0.2mm

Blind Vias

L1 - L2

Finished Board Thickness

1.6mm

Finished Cu Weight

1oz (1.4 mils) outer layers

Via Plating Thickness

20 μm

Surface Finish

Immersion Gold

Top Silkscreen

White

Bottom Silkscreen

White

Top Solder Mask

Green

Bottom Solder Mask

Green

Electrical Test

100% Electrical test used prior to shipment

Countersink Holes

On Top side

 

 

PCB Statistics

PCB Statistics

Value

Components

59

Total Pads

137

Thru Hole Pads

86

Top SMT Pads

51

Bottom SMT Pads

12

Vias

73

Nets

4

 

 

Artwork and Quality Standards

The IT-180ATC multi circuit boards are supplied with Gerber RS-274-X files, ensuring compatibility with various PCB design tools and facilitating easy integration into the manufacturing process. Moreover, the PCB adheres to the IPC-Class-2 quality standard, demonstrating its reliability and carefully controlled manufacturing processes.

 

Availability

The IT-180ATC 4 layer PCB is available worldwide, allowing customers from different regions to access and benefit from its advanced features and superior performance.

 

Typical Applications

The versatility and high performance of the IT-180ATC PCB make it an ideal choice for a range of applications. Some typical applications include:

 

- Automotive Engine room ECU

- Backplanes

- Data Storage

- Server and Networking

- Telecommunications

 

Conclusion

In summary, the IT-180ATC 1.6mm PCB offers exceptional thermal reliability, CAF resistance, and various advanced features that make it an ideal solution for demanding applications such as automotive engine room ECUs, backplanes, data storage, server and networking, and telecommunications equipment. With its worldwide availability and adherence to industry standards, the IT-180ATC PCB is a reliable choice for customers seeking high-performance PCB solutions.




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