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IT-180ATC 1.6mm PCB offers exceptional thermal reliability, CAF resistance, and various advanced features that make it an ideal solution for demanding applications
Item NO.:
BIC-294-v366.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
IT-180ATC 1.6mm 4-layer High Tg Multi-layer Rigid Blind Via FR-4 PCB
Overview
The IT-180ATC PCB is an advanced and versatile printed circuit board (PCB) designed to meet the demanding requirements of various applications. With its high glass transition temperature (Tg) of 175°C, exceptional thermal reliability, and CAF resistance, the IT-180ATC Multi-layer PCB offers superior performance and reliability. This 4-layer rigid PCB is suitable for lead-free assembly processes and has excellent through-hole reliability, making it an ideal choice for automotive, telecommunications, data storage, server and networking, and backplane applications.
Key Properties
The IT-180ATC High Tg Multi-layer PCB boasts a range of impressive properties that contribute to its reliability and performance. Here are some noteworthy features:
1)Glass Transition Temperature (Tg) by DSC:
The Tg of 175°C ensures the board's dimensional stability, enabling it to withstand high operating temperatures without compromising its structural integrity.
2)Lead Free Process Compatibility:
The IT-180ATC PCB is compatible with lead-free assembly processes, adhering to the industry standards and regulations while ensuring environmentally-friendly manufacturing practices.
3)Excellent Coefficient of Thermal Expansion (CTE):
With a low X-axis CTE of 11-13 ppm/°C and a slightly higher Y-axis CTE of 13-15 ppm/°C, this PCB minimizes the risk of thermal stress-related failures, resulting in improved reliability.
4)Time to Delaminate by TMA:
The IT-180ATC PCB exhibits excellent thermal stability, with a T260 of 60 minutes and a T288 of 20 minutes. These values indicate the amount of time the board can withstand given temperatures without experiencing delamination.
5)DK and Df Values:
The dielectric constant (DK) is 4.4 at 1 GHz and 4.5 at 1 MHz, while the dissipation factor (Df) is 0.014 at 1 MHz and 0.015 at 1 GHz. These properties are vital for achieving efficient signal transmission and minimizing signal loss in high-speed applications.
6)CAF Resistance:
The IT-180ATC PCB demonstrates excellent resistance to Conductive Anodic Filament (CAF) formation, ensuring long-term reliability and preventing failures caused by conductive metal filaments forming under biased conditions.
7)Moisture Resistance:
With a moisture resistance rating of 0.1%, this PCB is highly resilient against moisture-related issues, including delamination, warping, and degradation of electrical properties.
8)Flammability:
The laminate and laminated prepreg of the IT-180ATC PCB comply with the UL94-V0 flammability standard. This indicates that the PCB has excellent flame retardant properties, making it a safe choice for various applications.
PCB Construction and Specifications
The IT-180ATC PCB, a 4-Layer Blind Via FR-4 PCB, is carefully constructed to ensure optimal performance and reliability.
Stack-up:
Layer Type |
Layer Name |
Thickness |
Copper |
Copper_layer_1 |
0.035 mm |
Prepreg |
Prepreg 7628H X 1 |
0.21mm |
Copper |
Copper_layer_2 |
0.035 mm |
Core |
IT - 180ATC Core |
1.03 mm (40.5mil) |
Copper |
Copper_layer_3 |
0.035 mm |
Prepreg |
Prepreg 7628H X 1 |
0.21mm |
Copper |
Copper_layer_4 |
0.035 mm |
Here are the key construction details:
Parameter |
Details |
Board Dimensions |
130mm x 175 mm = 6PCS, +/- 0.15mm |
Minimum Trace/Space |
4/6 mils |
Minimum Hole Size |
0.2mm |
Blind Vias |
L1 - L2 |
Finished Board Thickness |
1.6mm |
Finished Cu Weight |
1oz (1.4 mils) outer layers |
Via Plating Thickness |
20 μm |
Surface Finish |
Immersion Gold |
Top Silkscreen |
White |
Bottom Silkscreen |
White |
Top Solder Mask |
Green |
Bottom Solder Mask |
Green |
Electrical Test |
100% Electrical test used prior to shipment |
Countersink Holes |
On Top side |
PCB Statistics
PCB Statistics |
Value |
Components |
59 |
Total Pads |
137 |
Thru Hole Pads |
86 |
Top SMT Pads |
51 |
Bottom SMT Pads |
12 |
Vias |
73 |
Nets |
4 |
Artwork and Quality Standards
The IT-180ATC multi circuit boards are supplied with Gerber RS-274-X files, ensuring compatibility with various PCB design tools and facilitating easy integration into the manufacturing process. Moreover, the PCB adheres to the IPC-Class-2 quality standard, demonstrating its reliability and carefully controlled manufacturing processes.
Availability
The IT-180ATC 4 layer PCB is available worldwide, allowing customers from different regions to access and benefit from its advanced features and superior performance.
Typical Applications
The versatility and high performance of the IT-180ATC PCB make it an ideal choice for a range of applications. Some typical applications include:
- Automotive Engine room ECU
- Backplanes
- Data Storage
- Server and Networking
- Telecommunications
Conclusion
In summary, the IT-180ATC 1.6mm PCB offers exceptional thermal reliability, CAF resistance, and various advanced features that make it an ideal solution for demanding applications such as automotive engine room ECUs, backplanes, data storage, server and networking, and telecommunications equipment. With its worldwide availability and adherence to industry standards, the IT-180ATC PCB is a reliable choice for customers seeking high-performance PCB solutions.
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F4BTMS615 PCB 2-layer DK6.15 5.08mm Thick F4BTMS Series High Frequency LaminatesNext:
ISOLA 370HR PCB 1.6mm 6-layer Multi-layer High Tg Circuit BoardIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
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