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Home Newly Shipped RF PCB F4BTMS615 PCB 2-layer DK6.15 5.08mm Thick F4BTMS Series High Frequency Laminates

F4BTMS615 PCB 2-layer DK6.15 5.08mm Thick F4BTMS Series High Frequency Laminates

The F4BTMS615, the latest addition to theF4BTMS series, represents a significant leap forward in material formulation and manufacturing processes.

  • Item NO.:

    BIC-293-v365.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


F4BTMS615 PCB 2-layer DK6.15 5.08mm Thick F4BTMS Series High Frequency Laminates

 

The F4BTMS615, the latest addition to the F4BTMS series, represents a significant leap forward in material formulation and manufacturing processes. Boasting a host of groundbreaking features and enhanced performance, this high frequency PCB stands as a technologically advanced solution, capable of outperforming similar foreign products.

 

F4BTMS Introduction

The F4BTMS series laminates are the culmination of meticulous research and development endeavors aimed at creating a superior PCB material. The innovative formulation involves enriching the material with a substantial amount of ceramics and reinforcing it with ultra-thin, ultra-fine glass fiber cloth. These advancements have resulted in remarkable improvements in material performance and a broader range of dielectric constants.

 

By incorporating special nano-ceramics mixed with polytetrafluoroethylene resin and a small amount of ultra-thin, ultra-fine glass fiber cloth, the negative effects of traditional glass fiber on electromagnetic wave propagation are mitigated. This breakthrough minimizes dielectric loss, enhances dimensional stability, and reduces the X/Y/Z anisotropy of the material. Consequently, the F4BTMS615 DK6.15 PCB exhibits an extended usable frequency range, improved electrical strength, and enhanced thermal conductivity.

 

Furthermore, this exceptional material showcases outstanding characteristics such as a low thermal expansion coefficient, exceptional stability in diverse temperature conditions, and a minimal impact of temperature on its dielectric constant.


F4BTMS615_PCB_5.08mm_Bicheng

 

Features

The F4BTMS615 PCB is packed with a myriad of cutting-edge features, ensuring optimal performance and reliability. Let's delve into its remarkable specifications:

 

1)Dielectric constant (Dk) of 6.15 at 10GHz:

This high Dk value provides the necessary support for high-frequency applications, enabling efficient signal transmission and minimizing loss.

 

2)Dissipation factor of 0.0020 at 10GHz, 0.0023 at 20GHz:

With such low dissipation factors, the F4BTMS615 minimizes signal loss, ensuring consistently high signal integrity even at higher frequencies.

 

3)Coefficient of Thermal Expansion (CTE):

The material exhibits a CTE x-axis of 10 ppm/°C, CTE y-axis of 12 ppm/°C, and CTE z-axis of 40 ppm/°C, covering a wide temperature range (-55°C to 288°C). This exceptional dimensional stability ensures reliable performance across varying thermal conditions.

 

4)Low thermal coefficient of Dk:

The F4BTMS615 demonstrates a low thermal coefficient of Dk at -96 ppm/°C, guaranteeing minimal variation in the dielectric constant with temperature fluctuations from -55°C to 150°C. This stability and predictability are crucial for maintaining consistent electrical performance.

 

5)High thermal conductivity of 0.67 W/mk:

The impressive thermal conductivity of the F4BTMS615 ensures efficient heat dissipation, preventing overheating and optimizing the performance of high-power applications.

 

6)Moisture absorption of 0.1%:

The PCB's moisture absorption capability is minimal, ensuring stable electrical performance even in humid environments.


 

PCB Stackup

The F4BTMS615 features a 2 layer pcb board stackup, ensuring robustness and durability. Its stackup configuration is as follows:

 

Copper_layer_1: 35μm

F4BTMS615 Core: 5.08 mm (200mil)

Copper_layer_2: 35μm

 

PCB Construction Details

To ensure optimum performance, the F4BTMS615 dual layer pcb is crafted with meticulous attention to detail. Here are the key construction details:


Parameter

Details

Board Dimensions

92.32mm x 31.5 mm = 1PCS, ±0.15mm

Minimum Trace/Space

5/5 mils

Minimum Hole Size

0.5mm

Blind Vias

No

Finished Board Thickness

5.2mm

Finished Cu Weight (Outer Layers)

1oz (1.4 mils)

Via Plating Thickness

20 μm

Surface Finish

Hot Air Soldering Level (HASL)

Top Silkscreen

No

Bottom Silkscreen

No

Top Solder Mask

No

Bottom Solder Mask

No

Pre - Shipment Test

100% Electrical test

 

 

PCB Statistics

To provide a comprehensive overview, here are the relevant statistics regarding the F4BTMS615:


Statistic

Value

Components

20

Total Pads

35

Thru Hole Pads

21

Top SMT Pads

14

Bottom SMT Pads

0

Vias

37

Nets

2

 

 

Artwork, Quality, and Availability: Meeting Industry Standards

To ensure seamless integration into various projects, the F4BTMS615 PTFE F4B PCB complies with industry-standard requirements:

 

Artwork: Gerber RS-274-X is the accepted format for artwork supplied, facilitating compatibility with common design software tools.

 

Quality Standard: The F4BTMS615 F4B Substrate PCB adheres to the prestigious IPC-Class-2 quality standard. This industry-recognized standard guarantees exceptional reliability and performance.

 

Availability: The F4BTMS615 F4B PCB Material is readily available worldwide, making it accessible for projects across the globe.


 

Typical Applications

The F4BTMS615 wholesale high-frequency printed circuit boards opens up a world of possibilities with its unmatched performance and reliability. This high-reliability material finds applications in a wide range of industries and projects, including:

 

-Aerospace Equipment

-Microwave and RF Systems

-Radar

-Satellite Communications

-Military radar

-feed networks

-Phase-sensitive antennas

-Phased array antennas

 


Conclusion

The F4BTMS615 F4B High Frequency PCB represents a significant step forward in material innovation and manufacturing processes. With its impressive features, unrivaled performance, and uncompromising reliability, it has solidified its place at the forefront of the industry. From aerospace equipment to satellite communications, this high-reliability material opens up endless possibilities, empowering engineers and designers to push the boundaries of technology. Embrace the future of PCBs with the F4BTMS615 and witness the remarkable evolution it brings to your projects.




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