TSM-DS3 PCB 20mil 0.508mm 2-layer High Frequency Circuit Board with Immersion Silver

TSM-DS3 PCB 20mil 0.508mm 2-layer High Frequency Circuit Board with Immersion Silver

We are excited to introduce the TSM-DS3 PCB, a cutting-edge solution designed for high power applications where thermal stability, low loss, and dimensional stability are critical. This innovative PCB utilizes a ceramic-filled reinforced material with minimal fiberglass content, allowing for the fabrication of large format complex multilayers. With its exceptional performance and unique features, the TSM-DS3 PCB is set to revolutionize the industry.

The TSM-DS3 20mil high frequency laminate PCB is specifically engineered to excel in high power applications. Its thermally stable core material boasts a low loss factor (Df) of just 0.0011 at 10 GHz, enabling efficient heat dissipation from other heat sources on the PCB. With high thermal conductivity of up to 0.65 W/MK, the TSM-DS3 efficiently conducts heat away, ensuring optimal performance even under demanding thermal cycling conditions.

Features

The TSM-DS3 high frequency PCB offers a range of exceptional features that make it a stand-out choice for demanding applications:

2.1Precise Dielectric Constant:

With a dielectric constant of 3.0 at 10 GHz/23°C and a tight tolerance of 0.05, the TSM-DS3 delivers consistent and reliable performance.

2.2 Low Dissipation Factor:

The TSM-DS3 boasts a low dissipation factor of 0.0014 at 10 GHz, ensuring minimal signal loss and maintaining signal integrity.

2.3 Excellent Thermal Conductivity:

With a high thermal conductivity of 0.65 W/MK, the TSM-DS3 efficiently dissipates heat, preventing thermal issues and ensuring reliable operation.

2.4 Dimensional Stability:

The TSM-DS3 rivals epoxy materials in terms of dimensional stability, enabling the fabrication of complex multilayer PCBs with ease.

2.5 Low Moisture Absorption:

The TSM-DS3 exhibits a low moisture absorption rate of just 0.07%, maintaining consistent performance even in high humidity environments.

2.6 Matched Copper CTE:

The TSM-DS3 is designed to match the coefficients of thermal expansion (CTE) of copper in all three axes (X, Y, and Z-axis), reducing stress and ensuring reliable performance.

Benefits 

The TSM-DS3 20mil material PCB offers numerous benefits that set it apart from traditional alternatives:

3.1 Low Fiberglass Content:

With a minimal fiberglass content of around 5%, the TSM-DS3 provides improved dimensional stability and enables the fabrication of large format high layer count PCBs.

3.2 Consistency and Predictability:

The TSM-DS3 offers the predictability and consistency found in the best fiberglass reinforced epoxies, ensuring reliable and repeatable performance.

3.3 Temperature Stability:

With a temperature stable dielectric constant of±0.25% from -30 to 120°C, the TSM-DS3 maintains its performance across a wide range of temperatures.

3.4 Compatibility with Resistive Foils:

The TSM-DS3 is fully compatible with resistive foils, making it an ideal choice for applications requiring resistive materials.

PCB Construction

The TSM-DS3 PCB features a 2-layer rigid construction that incorporates the following specifications:

PCB Statistics

The TSM-DS3 PCB boasts impressive statistics, reflecting its capabilities:

Quality Standards and Global Availability

At our company, we adhere to the highest quality standards to ensure that our customers receive only the best products. The TSM-DS3 double circuit board is manufactured to meet IPC-Class-2 quality standards, reflecting our commitment to excellence. Additionally, the TSM-DS3 PCB is available for shipment worldwide, enabling customers from around the globe to benefit from its advanced capabilities.

Applications for TSM-DS3

The TSM-DS3 PCB is ideal for a wide range of applications that demand high performance and reliability:

- Couplers

- Phased Array Antennas

- Radar Manifolds

- mmWave Antenna/Automotive

- Oil Drilling

- Semiconductor/ATE Testing

Conclusion

In conclusion, the TSM-DS3 high frequency circuit board represents a leap forward in PCB technology, offering exceptional thermal stability, low loss performance, and dimensional stability. With its unique features and benefits, the TSM-DS3 is perfectly suited for a wide range of high power applications. Trust in our company's commitment to quality and performance and experience the difference that the TSM-DS3 PCB can bring to your projects.

Contact us today and unlock the potential of advanced PCB.