Rogers RO3035 PCB 20mil Laminate 2-layer High Frequency Circuit Board

Rogers RO3035 PCB 20mil Laminate 2-layer High Frequency Circuit Board

In the realm of high-frequency circuit materials, the Rogers RO3035 laminates stand tall as ceramic-filled PTFE-based innovations that redefine the standards of performance and reliability. Belonging to the prestigiousRO3000 series, these RO3000 laminates bear mechanical similarities while offering distinct dielectric constants (Dk), empowering designers to craft intricate multi-layer board designs without compromising on structural integrity or operational consistency. RO3035 20mil Rogers substrates boast a stable dielectric constant across varying temperatures, thereby serving as the cornerstone for cutting-edge applications in 5G, millimeter wave sub 6GHz, and massive MiMo technologies.

Key Features

1)Rogers RO3035 Composition:

 Infused with ceramic-filled PTFE composites, ensuring superior performance.

2)Precise Dielectric Constants:

Dk of 3.5+/- 0.05 at 10 GHz/23°C for reliable signal propagation.

3)Exceptional Dissipation Factor:

Merely 0.0015 at 10 GHz/23°C, ensuring minimal signal loss.

4)High Thermal Stability:

Td> 500°C, guaranteeing operational robustness under extreme conditions.

5)Optimal Thermal Conductivity:

0.5 W/mK to dissipate heat efficiently.

6)Minimal Moisture Absorption:

A mere 0.04%, sustaining consistent performance in varied environments.

7)Thermal Expansion Coefficients:

X axis 17 ppm/°C, Y axis 17 ppm/°C, Z axis 24 ppm/°C (-55 to 288°C), ensuring dimensional stability.

Benefits

1)High-Frequency Applications: Supports operations up to 30-40 GHz, ideal for cutting-edge technologies.

2)Enhanced Reliability: Lower operating temperatures and improved reliability in power amplifiers.

3)Versatile Design Capabilities: Enables multi-layer board designs with varied dielectric constants.

4)Mechanical Consistency: Uniform mechanical properties for enhanced reliability.

5)Temperature Sensitivity: Low in-plane expansion coefficient, ideal for temperature-sensitive applications.

6)Manufacturing Efficiency: Volume manufacturing process for cost-effective solutions.

PCB Specifications

Stackup: 2-layer rigid PCB with Rogers RO3035 Substrate(20mil).

PCB Statistics

Additional Information

Artwork Format: Gerber RS-274-X, ensuring compatibility with industry standards.

Accepted Standard: IPC-Class-2, guaranteeing quality compliance.

Global Availability: Accessible worldwide for seamless integration into diverse projects.

Typical Applications

Automotive Radar Systems

Global Positioning Satellite Antennas

Cellular Telecommunications - Power Amplifiers and Antennas

Wireless Communication Patch Antennas

Direct Broadcast Satellites

Datalink Systems

Remote Meter Readers

Power Backplanes

In conclusion, the Rogers 3035 20mil PCB encapsulates a fusion of cutting-edge technology, reliability, and versatility, making it the ideal choice for high-frequency applications that demand uncompromising performance and durability. Elevate your designs with the precision and innovation that only Rogers laminates can deliver.