RO3003 PCB 2-layer 10mil 0.254mm ENIG Rogers 3003 Green Solder Mask White Silkscreen
Designed for commercial microwave, RF, and high-frequency applications up to 77 GHz, the RO3003 2-layer 10mil ENIG PCB combines Rogers’ premium ceramic-filled PTFE composite material with rigorous manufacturing standards to deliver unmatched stability, low dielectric loss, and reliable performance across extreme temperatures. Below is a detailed breakdown of its specifications, capabilities, and value propositions, tailored to meet the demands of automotive, 5G, and satellite communication systems.
PCB Construction Details
The following table outlines the key structural parameters of the Rogers 3003 PCB, ensuring precision, compatibility, and industrial-grade durability for critical applications.
|
Parameter
|
Specification
|
|
Base Material
|
Rogers RO3003
|
|
Layer Count
|
2 layers
|
|
Board Dimensions
|
254mm x 142 mm=50PCS
|
|
Minimum Trace/Space
|
5/4 mils
|
|
Minimum Hole Size
|
0.2mm
|
|
Blind Vias
|
None
|
|
Finished Board Thickness
|
0.3mm
|
|
Finished Cu Weight (Outer Layers)
|
1 oz (1.4 mils)
|
|
Via Plating Thickness
|
20 μm
|
|
Surface Finish
|
ENIG
|
|
Top Silkscreen
|
No
|
|
Bottom Silkscreen
|
White
|
|
Top Solder Mask
|
No
|
|
Bottom Solder Mask
|
Green
|
|
Quality Assurance
|
100% Electrical test prior to shipment
|
PCB Stackup
The Rogers RO3003 2-layer rigid stackup is engineered to minimize signal loss and enhance transmission efficiency, ideal for high-frequency applications.
|
Layer
|
Material/Specification
|
Thickness
|
|
Copper_layer_1
|
Outer Copper
|
35 μm (1 oz)
|
|
Core
|
Rogers RO3003 Laminate
|
10mil (0.254mm)
|
|
Copper_layer_2
|
Outer Copper
|
35 μm (1 oz)
|
PCB Statistics
The following statistics reflect the 10mil RO3003 PCB’s optimized component layout and connectivity, balancing density with performance.
|
Metric
|
Value
|
|
Total Components
|
150
|
|
Total Pads
|
300
|
|
Thru Hole Pads
|
200
|
|
Top SMT Pads
|
100
|
|
Bottom SMT Pads
|
0
|
|
Vias
|
250
|
|
Nets
|
2
|
Core Material & Performance Highlights
1) Base Material: Rogers RO3003 (ceramic-filled PTFE composite), tailored for high-frequency scenarios
2) Electrical Performance: Dk=3±0.04 (10 GHz/23°C), dissipation factor=0.001, supports up to 77 GHz applications
3) Thermal & Physical Stability: Td>500°C, thermal conductivity=0.5 W/mK, moisture absorption=0.04%
4) Dimensional Reliability: CTE closely matched to copper (X:17 ppm/°C, Y:16 ppm/°C, Z:25 ppm/°C), minimizing warpage
Key Benefits
1) Low dielectric loss enables high-frequency deployment (up to 77 GHz) for ADAS, 5G mmWave, and radar systems
2) Stable Dk across temperature/frequency ensures consistent performance in dynamic environments
3) Uniform mechanical properties support hybrid designs with epoxy glass multi-layer boards
4) Cost-effective volume manufacturing without compromising quality
5) Copper-matched CTE enhances surface mount stability and dimensional precision
Typical Applications
This RO3003 high frequency PCB typical application scenarios target cutting-edge technology fields:
- Automotive radar applications
- Global positioning satellite antennas
- Cellular telecommunications systems - power amplifiers and antennas
- Patch antenna for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes
In summary, the 2 Layer Rogers RO3003 is a high-performance, cost-effective solution for high-frequency applications requiring stability, reliability, and compatibility.
If you need further tweaks—such as emphasizing specific applications, adjusting parameter priorities, or adding customization options—please let me know.
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