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RF-10 high frequency materials are engineered to
provide a cost effective substrates, responding to a need in RF applications
for size reduction.
Item NO.:
BIC-181-v115.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaColor:
WhiteShipping Port:
ShenzhenLead Time:
7-10 days
RF-10 Printed Circuit Board 10mil 20mil 60mil Taconic RF-10 High Frequency PCB Low Loss High DK RF PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
Taconic's RF-10 laminates are composites of ceramic filled PTFE and woven fiberglass, which have the advantage of high dielectric constant (10.2 10GHz) and low dissipation factor (0.0025 10GHz). Thin woven fiberglass reinforcement is used to offer both low dielectric loss and improved rigidity for ease of handling and improved dimensional stability for multilayer circuits.
RF-10 bonds well to smooth low profile copper too. The low dissipation combined with the use of very smooth copper results in optimal insertion losses at higher frequency where skin effect losses play a substantial role.
Features Benefits
1.Excellent adhesion to smooth coppers
2.Excellent dimensional stability
3.Excellent price/performance ratio
4.High thermal conductivity for enhanced thermal management
5.High DK for RF circuit size reduction
6.Low 0.0025 loss tangent @ 10 GHz
7.Low X, Y, Z expansion
8.Tight DK tolerance (10.2 +/-0.3)
Typical Applications
1.Aircraft Collision Avoidance Systems
2.GPS Antennas
3.Microstrip Patch Antennas
4.Passive Components (filters, couplers, power dividers)
5.Satellite Components
Our PCB Capability (RF-10)
PCB Capability (RF-10) | |
PCB Material: | Composites of Ceramic Filled PTFE and Woven Fiberglass |
Designation: | RF-10 |
Dielectric constant: | 10.2 |
Dissipation Factor | 0.0025 10GHz |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm ) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
RF-10 Typical Values
RF-10 Typical Values | |||||
Property | Test Method | Unit | Value | Unit | Value |
Dk @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | 10.2±0.3 | 10.2±0.3 | ||
Df @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | 0.0025 | 0.0025 | ||
TcK†(-55 to 150 °C) | IPC-650 2.5.5.6 | ppm/°C | -370 | ppm/°C | -370 |
Moisture Absorption | IPC-650 2.6.2.1 | % | 0.08 | % | 0.08 |
Peel Strength(1 oz. RT copper) | IPC-650 2.4.8 (solder) | lbs/in | 10 | N/mm | 1.7 |
Volume Resistivity | IPC-650 2.5.17.1 | Mohm/cm | 6.0 x 107 | Mohm/cm | 6.0 x 107 |
Surface Resistivity | IPC-650 2.5.17.1 | Mohm | 1.0 x 108 | Mohm | 1.0 x 108 |
Flexural Strength(MD) | IPC - 650 - 2.4.4 | psi | 14,000 | N/mm2 | 96.53 |
Flexural Strength(CD) | IPC - 650 - 2.4.4 | psi | 10,000 | N/mm2 | 68.95 |
Tensile Strength(MD) | IPC - 650 - 2.4.19 | psi | 8,900 | N/mm2 | 62.57 |
Tensile Strength(CD) | IPC - 650 - 2.4.19 | psi | 5,300 | N/mm2 | 37.26 |
Dimensional Stability | IPC-650 2.4.39(After Etch) | % (25 mil-MD) | -0.0032 | % (25 mil-CD) | -0.0239 |
Dimensional Stability | IPC-650 2.4.39(After Bake) | % (25 mil-MD) | -0.0215 | % (25 mil-CD) | -0.0529 |
Dimensional Stability | IPC-650 2.4.39(After Stress) | % (25 mil-MD) | -0.0301 | % (25 mil-CD) | -0.0653 |
Dimensional Stability | IPC-650 2.4.39(After Etch) | % (60 mil-MD) | -0.0027 | % (60 mil-CD) | -0.0142 |
Dimensional Stability | IPC-650 2.4.39(After Bake) | % (60 mil-MD) | -0.1500 | % (60 mil-CD) | -0.0326 |
Dimensional Stability | IPC-650 2.4.39(After Stress) | % (60 mil-MD) | -0.0167 | % (60 mil-CD) | -0.0377 |
Density(Specific Gravity) | IPC-650-2.3.5 | g/cm3 | 2.77 | g/cm3 | 2.77 |
Specific Heat | IPC-650-2.4.50 | J/g°C | 0.9 | J/g°C | 0.9 |
Thermal Conductivity(Unclad) | IPC-650-2.4.50 | W/M*K | 0.85 | W/M*K | 0.85 |
CTE (X -Y axis)(50 to 150 °C) | IPC-650 2.4.41 | ppm/°C | 16-20 | ppm/°C | 16-20 |
CTE (Z axis)(50 to 150 °C) | IPC-650 2.4.41 | ppm/°C | 25 | ppm/°C | 25 |
Flammability Rating | Internal | V-0 | V-0 |
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