RF-10
Printed Circuit Board 10mil 20mil 60mil Taconic RF-10 High Frequency PCB Low
Loss High DK RF PCB
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
General
Description
Taconic's
RF-10 laminates are composites of ceramic filled PTFE and woven fiberglass,
which have the advantage of high dielectric constant (10.2 10GHz) and low
dissipation factor (0.0025 10GHz). Thin woven fiberglass reinforcement is used
to offer both low dielectric loss and improved rigidity for ease of handling
and improved dimensional stability for multilayer circuits.
RF-10 bonds well to
smooth low profile copper too. The low dissipation combined with the use of
very smooth copper results in optimal insertion losses at higher frequency
where skin effect losses play a substantial role.
Features
Benefits
1.Excellent adhesion to smooth coppers
2.Excellent dimensional stability
3.Excellent price/performance ratio
4.High thermal conductivity for enhanced
thermal management
5.High DK for RF circuit size reduction
6.Low 0.0025 loss tangent @ 10 GHz
7.Low X, Y, Z expansion
8.Tight DK tolerance (10.2 +/-0.3)
Typical
Applications
1.Aircraft Collision Avoidance Systems
2.GPS Antennas
3.Microstrip Patch Antennas
4.Passive Components (filters, couplers,
power dividers)
5.Satellite Components
Our
PCB Capability (RF-10)
|
PCB Capability (RF-10)
|
|
PCB Material:
|
Composites of
Ceramic Filled PTFE and Woven Fiberglass
|
|
Designation:
|
RF-10
|
|
Dielectric constant:
|
10.2
|
|
Dissipation Factor
|
0.0025 10GHz
|
|
Layer count:
|
Double Sided PCB, Multilayer PCB, Hybrid PCB
|
|
Copper
weight:
|
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
|
|
PCB thickness:
|
10mil
(0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm )
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue,
Yellow, Red etc.
|
|
Surface
finish:
|
Bare
copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..
|
RF-10
Typical Values
|
RF-10
Typical Values
|
|
Property
|
Test Method
|
Unit
|
Value
|
Unit
|
Value
|
|
Dk @ 10 GHz
|
IPC-650 2.5.5.5.1
Mod.
|
|
10.2±0.3
|
|
10.2±0.3
|
|
Df @ 10 GHz
|
IPC-650 2.5.5.5.1
Mod.
|
|
0.0025
|
|
0.0025
|
|
TcK†(-55 to 150 °C)
|
IPC-650 2.5.5.6
|
ppm/°C
|
-370
|
ppm/°C
|
-370
|
|
Moisture
Absorption
|
IPC-650 2.6.2.1
|
%
|
0.08
|
%
|
0.08
|
|
Peel Strength(1 oz. RT copper)
|
IPC-650 2.4.8
(solder)
|
lbs/in
|
10
|
N/mm
|
1.7
|
|
Volume
Resistivity
|
IPC-650 2.5.17.1
|
Mohm/cm
|
6.0 x 107
|
Mohm/cm
|
6.0 x 107
|
|
Surface
Resistivity
|
IPC-650 2.5.17.1
|
Mohm
|
1.0 x 108
|
Mohm
|
1.0 x 108
|
|
Flexural
Strength(MD)
|
IPC - 650 - 2.4.4
|
psi
|
14,000
|
N/mm2
|
96.53
|
|
Flexural
Strength(CD)
|
IPC - 650 - 2.4.4
|
psi
|
10,000
|
N/mm2
|
68.95
|
|
Tensile
Strength(MD)
|
IPC - 650 - 2.4.19
|
psi
|
8,900
|
N/mm2
|
62.57
|
|
Tensile
Strength(CD)
|
IPC - 650 - 2.4.19
|
psi
|
5,300
|
N/mm2
|
37.26
|
|
Dimensional
Stability
|
IPC-650 2.4.39(After Etch)
|
% (25 mil-MD)
|
-0.0032
|
% (25 mil-CD)
|
-0.0239
|
|
Dimensional
Stability
|
IPC-650 2.4.39(After Bake)
|
% (25 mil-MD)
|
-0.0215
|
% (25 mil-CD)
|
-0.0529
|
|
Dimensional
Stability
|
IPC-650 2.4.39(After Stress)
|
% (25 mil-MD)
|
-0.0301
|
% (25 mil-CD)
|
-0.0653
|
|
Dimensional
Stability
|
IPC-650 2.4.39(After Etch)
|
% (60 mil-MD)
|
-0.0027
|
% (60 mil-CD)
|
-0.0142
|
|
Dimensional
Stability
|
IPC-650 2.4.39(After Bake)
|
% (60 mil-MD)
|
-0.1500
|
% (60 mil-CD)
|
-0.0326
|
|
Dimensional
Stability
|
IPC-650 2.4.39(After Stress)
|
% (60 mil-MD)
|
-0.0167
|
% (60 mil-CD)
|
-0.0377
|
|
Density(Specific Gravity)
|
IPC-650-2.3.5
|
g/cm3
|
2.77
|
g/cm3
|
2.77
|
|
Specific Heat
|
IPC-650-2.4.50
|
J/g°C
|
0.9
|
J/g°C
|
0.9
|
|
Thermal
Conductivity(Unclad)
|
IPC-650-2.4.50
|
W/M*K
|
0.85
|
W/M*K
|
0.85
|
|
CTE (X -Y
axis)(50 to 150 °C)
|
IPC-650 2.4.41
|
ppm/°C
|
16-20
|
ppm/°C
|
16-20
|
|
CTE (Z axis)(50 to 150 °C)
|
IPC-650 2.4.41
|
ppm/°C
|
25
|
ppm/°C
|
25
|
|
Flammability
Rating
|
Internal
|
|
V-0
|
|
V-0
|
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