RO3003 PCB 2-layer 5mil 0.127mm Rogers 3003 High Frequency Circuit Board ENIG

RO3003 PCB 2-layer 5mil 0.127mm Rogers 3003 High Frequency Circuit Board ENIG

Product Overview

Our newly shipped RO3003 PCB is a high-performance 2-layer rigid printed circuit board designed for RF, microwave, and high-frequency applications. Engineered with Rogers RO3003 ceramic-filled PTFE laminate, thisRogers 3003PCBdelivers exceptional electrical stability, low signal loss, and thermal reliability, making it ideal for automotive radar, 5G infrastructure, satellite communications, and advanced wireless systems.

Detailed PCB Construction & Specifications

This 2-layer rigid PCB is constructed with the following stackup:

PCB Construction details:

PCB Statistics:

Key Features of RO3003 Laminate

Rogers 3003 substrate PCB is a ceramic-filled PTFE composite specifically engineered forhigh-frequency PCBs. Its key advantages include:

1.Stable Dielectric Constant (Dk = 3.00±0.04)

• Minimal variation across temperature and frequency (ideal for 77 GHz automotive radar & 5G mmWave)
• Eliminates Dk step changes near room temperature (unlike standard PTFE-glass materials)

2.Ultra-Low Loss Tangent (Df = 0.001 @ 10 GHz)

• Minimizes signal attenuation in high-speed RF circuits
• Suitable for power amplifiers, filters, and antennas

3.Excellent Thermal & Mechanical Stability

Thermal Conductivity: 0.5 W/mK (efficient heat dissipation)

CTE Matched to Copper:

• X/Y: 17/16 ppm/°C (prevents delamination)
• Z-axis: 25 ppm/°C (reliable plated through-holes)
• Moisture Absorption: 0.04% (resistant to humidity)

4.Compatible with Hybrid Multilayer Designs

Can be combined with FR4 or other RF materials for cost-effective multilayer designs

Benefits of This RO3003 PCB Design

The key benefits of the RO30035 mil PCB include:

1.Low dielectric loss extends the frequency capabilities of your circuits, enabling performance up to 77 GHz.

2.Excellent mechanical properties ensure reliability and stability even in extreme temperature conditions.

3.The uniform mechanical properties of the RO3003 substrate make it an ideal choice for multi-layer board designs with varying dielectric constants.

4.The stable dielectric constant over temperature and frequency is particularly advantageous for applications such as bandpass filters, microstrip patch antennas, and voltage-controlled oscillators.

5.The low in-plane expansion coefficient of the RO3003 PCB, closely matching that of copper, enhances the reliability of surface-mounted assemblies.

6.Exceptional dimensional stability ensures that your PCB remains precise and reliable throughout its lifespan.

7.The RO3003 PCB is volume-manufacturable, offering an economical solution for your production needs.

Typical Applications

This RO3003 Rogers PCB is ideal for:

✅Automotive Radar Systems (77 GHz ADAS, collision avoidance)

✅5G mmWave Infrastructure (base stations, beamforming antennas)

✅Satellite Communications (GPS, DBS, datalink systems)

✅RF Filters & Power Amplifiers (cellular, Wi-Fi 6/6E, IoT)

✅Microstrip Patch Antennas (wireless sensors, remote monitoring)

✅High-Speed Digital Backplanes (low-loss signal transmission)

Ordering & Availability

Artwork Format: Gerber RS-274-X (industry-standard for fabrication)

Compliance: IPC-Class-2 (meets commercial reliability standards)

Global Shipping: Available worldwide with fast lead times.

Conclusion

This ultra-thin,high-frequency RO3003 PCB is engineered for demanding RF and microwave applications, offering exceptional signal integrity, thermal stability, and manufacturing reliability. With 5/5 mil trace precision, immersion gold finish, and Rogers RO3003’s low-loss properties, it is the ideal choice for automotive radar, 5G infrastructure, and advanced wireless systems.

Contact us today to integrate this high-performance PCB into your next RF design!