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Rogers RO3003 PCB is a high-frequency material known for its excellent electrical properties, low loss, and high thermal conductivity.
Item NO.:
BIC-040-v202.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Rogers RO3003 RF Printed Circuit Board 2-Layer Rogers 3003 60mil 1.524mm PCB with Low DK3.0 and Low DF 0.001
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers RO3003 High-frequency PCB material is renowned for its superior electrical qualities, minimal loss, and good thermal conductivity. It is extensively utilized in systems including satellite systems, radar systems, wireless communication systems, and high-speed digital circuits.
The low dielectric loss of RO3003 makes it perfect for high-frequency applications, which is one of its many advantages. Additionally, it possesses exceptional dimensional stability, a low dissipation factor, and strong thermal conductivity. The substance is stable in high-temperature conditions thanks to its high glass transition temperature (Tg).
Typical applications:
1) Automotive radar
2) Cellular telecommunications systems
3) Datalink on cable systems
4) Direct broadcast satellites
5) Global positioning satellite antennas
6) Patch antenna for wireless communications
7) Power amplifiers and antennas
8) Power backplanes
9) Remote meter readers
As part of its DFM offerings, Bicheng PCB additionally examines the board's layer stack-up, trace width, spacing, and via placement to make sure it complies with the client's requirements and specifications. To improve the performance of the board and guarantee its ability to be manufactured, their team of professionals can offer design suggestions and revisions.
The Rogers RO3003 PCB is a great option for high-frequency applications that demand low loss, good thermal conductivity, and superior electrical qualities. Due to their DFM skills, Bicheng PCB is the best partner for producing RO3003 PCBs since they guarantee that the PCB is produced to the highest standards and adheres to the customer's specifications.
There is 60mil Rogers 3003 PCB for reference.
PCB Specifications
PCB SIZE | 88 x 92mm=1PCS |
BOARD TYPE | Double sided PCB |
Number of Layers | 2 layers |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | copper ------- 18um(0.5 oz)+plate TOP layer |
RO3003 1.524mm | |
copper ------- 18um(0.5 oz) + plate BOT Layer | |
TECHNOLOGY | |
Minimum Trace and Space: | 5 mil / 5 mil |
Minimum / Maximum Holes: | 0.4 mm / 5.2 mm |
Number of Different Holes: | 7 |
Number of Drill Holes: | 95 |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | 3 |
Impedance Control: | no |
Number of Gold finger: | 0 |
BOARD MATERIAL | |
Glass Epoxy: | RO3003 1.524mm |
Final foil external: | 1oz |
Final foil internal: | N/A |
Final height of PCB: | 1.6 mm ±10% |
PLATING AND COATING | |
Surface Finish | Immersion Gold |
Solder Mask Apply To: | NO |
Solder Mask Color: | NO |
Solder Mask Type: | NO |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | TOP |
Colour of Component Legend | Black |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | Plated through hole(PTH), minimum size 0.4mm. |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" |
Board plating: | 0.0029" |
Drill tolerance: | 0.002" |
TEST | 100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Data Sheet of Rogers 3003 (RO3003)
RO3003 Typical Value | |||||
Property | RO3003 | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 3.0±0.04 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
Dielectric Constant,εDesign | 3 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor,tanδ | 0.001 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | -3 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
Dimensional Stability |
0.06 0.07 |
X Y |
mm/m | COND A | IPC-TM-650 2.2.4 |
Volume Resistivity | 107 | MΩ.cm | COND A | IPC 2.5.17.1 | |
Surface Resistivity | 107 | MΩ | COND A | IPC 2.5.17.1 | |
Tensile Modulus |
930 823 |
X Y |
MPa | 23℃ | ASTM D 638 |
Moisture Absorption | 0.04 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
Specific Heat | 0.9 | j/g/k | Calculated | ||
Thermal Conductivity | 0.5 | W/M/K | 50℃ | ASTM D 5470 | |
Coefficient of Thermal Expansion (-55 to 288℃) |
17 16 25 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
Td | 500 | ℃TGA | ASTM D 3850 | ||
Density | 2.1 | gm/cm3 | 23℃ | ASTM D 792 | |
Copper Peel Stength | 12.7 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
Flammability | V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |
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