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Home Rogers PCB Board RO3003 RF Printed Circuit Board 2-Layer Rogers 3003 60mil 1.524mm PCB Low DK3.0 and Low DF 0.001

RO3003 RF Printed Circuit Board 2-Layer Rogers 3003 60mil 1.524mm PCB Low DK3.0 and Low DF 0.001

Rogers RO3003 PCB is a high-frequency material known for its excellent electrical properties, low loss, and high thermal conductivity.

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Rogers RO3003 RF Printed Circuit Board 2-Layer Rogers 3003 60mil 1.524mm PCB with Low DK3.0 and Low DF 0.001

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RO3003 High-frequency PCB material is renowned for its superior electrical qualities, minimal loss, and good thermal conductivity. It is extensively utilized in systems including satellite systems, radar systems, wireless communication systems, and high-speed digital circuits.

The low dielectric loss of RO3003 makes it perfect for high-frequency applications, which is one of its many advantages. Additionally, it possesses exceptional dimensional stability, a low dissipation factor, and strong thermal conductivity. The substance is stable in high-temperature conditions thanks to its high glass transition temperature (Tg).

Typical applications:

1) Automotive radar

2) Cellular telecommunications systems

3) Datalink on cable systems

4) Direct broadcast satellites

5) Global positioning satellite antennas

6) Patch antenna for wireless communications

7) Power amplifiers and antennas

8) Power backplanes

9) Remote meter readers

As part of its DFM offerings, Bicheng PCB additionally examines the board's layer stack-up, trace width, spacing, and via placement to make sure it complies with the client's requirements and specifications. To improve the performance of the board and guarantee its ability to be manufactured, their team of professionals can offer design suggestions and revisions.

The Rogers RO3003 PCB is a great option for high-frequency applications that demand low loss, good thermal conductivity, and superior electrical qualities. Due to their DFM skills, Bicheng PCB is the best partner for producing RO3003 PCBs since they guarantee that the PCB is produced to the highest standards and adheres to the customer's specifications.

There is 60mil Rogers 3003 PCB for reference.

PCB Specifications

PCB SIZE 88 x 92mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3003 1.524mm
copper ------- 18um(0.5 oz) + plate  BOT Layer
Minimum Trace and Space: 5 mil / 5 mil
Minimum / Maximum Holes: 0.4 mm / 5.2 mm
Number of Different Holes: 7
Number of Drill Holes: 95
Number of Milled Slots: 0
Number of Internal Cutouts: 3
Impedance Control: no
Number of Gold finger: 0
Glass Epoxy:  RO3003 1.524mm
Final foil external:  1oz
Final foil internal:  N/A
Final height of PCB:  1.6 mm ±10%
Surface Finish Immersion Gold
Solder Mask Apply To:  NO
Solder Mask Color:  NO
Solder Mask Type: NO
Side of Component Legend TOP
Colour of Component Legend Black
Manufacturer Name or Logo:  Marked on the board in a conductor and leged FREE AREA
VIA Plated through hole(PTH), minimum size 0.4mm.
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Data Sheet of Rogers 3003 (RO3003)

 RO3003 Typical Value
Property RO3003 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.04 Z 10 GHz/23℃ IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 3 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.001 Z 10 GHz/23℃ IPC-TM-650
Thermal Coefficient of ε -3 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650
Dimensional Stability 0.06
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107 MΩ.cm COND A IPC
Surface Resistivity 107 COND A IPC
Tensile Modulus 930
MPa 23℃ ASTM D 638
Moisture Absorption 0.04 % D48/50 IPC-TM-650
Specific Heat 0.9 j/g/k Calculated
Thermal Conductivity 0.5 W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
ppm/℃ 23℃/50% RH IPC-TM-650
Td 500 ℃TGA ASTM D 3850
Density 2.1 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 12.7 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes




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