Rogers RO3003 RF Printed Circuit Board 2-Layer
Rogers 3003 60mil 1.524mm PCB with Low DK3.0 and Low DF 0.001
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
Rogers RO3003 High-frequency PCB material is
renowned for its superior electrical qualities, minimal loss, and good thermal
conductivity. It is extensively utilized in systems including satellite
systems, radar systems, wireless communication systems, and high-speed digital
circuits.
The low dielectric loss of RO3003 makes it
perfect for high-frequency applications, which is one of its many advantages.
Additionally, it possesses exceptional dimensional stability, a low dissipation
factor, and strong thermal conductivity. The substance is stable in
high-temperature conditions thanks to its high glass transition temperature
(Tg).
Typical applications:
1) Automotive radar
2) Cellular telecommunications systems
3) Datalink on cable systems
4) Direct broadcast satellites
5) Global positioning satellite antennas
6) Patch antenna for wireless communications
7) Power amplifiers and antennas
8) Power backplanes
9) Remote meter readers
As part of its DFM offerings, Bicheng PCB
additionally examines the board's layer stack-up, trace width, spacing, and via
placement to make sure it complies with the client's requirements and
specifications. To improve the performance of the board and guarantee its
ability to be manufactured, their team of professionals can offer design
suggestions and revisions.
The Rogers RO3003 PCB is a great option for
high-frequency applications that demand low loss, good thermal conductivity,
and superior electrical qualities. Due to their DFM skills, Bicheng PCB is the
best partner for producing RO3003 PCBs since they guarantee that the PCB is
produced to the highest standards and adheres to the customer's specifications.
There is 60mil Rogers 3003 PCB for reference.
PCB Specifications
|
PCB SIZE
|
88 x
92mm=1PCS
|
|
BOARD TYPE
|
Double sided PCB
|
|
Number of Layers
|
2
layers
|
|
Surface Mount Components
|
YES
|
|
Through Hole Components
|
YES
|
|
LAYER STACKUP
|
copper ------- 18um(0.5 oz)+plate TOP layer
|
|
RO3003 1.524mm
|
|
copper ------- 18um(0.5 oz) +
plate BOT Layer
|
|
TECHNOLOGY
|
|
|
Minimum Trace and Space:
|
5 mil / 5 mil
|
|
Minimum / Maximum Holes:
|
0.4 mm / 5.2 mm
|
|
Number of Different Holes:
|
7
|
|
Number of Drill Holes:
|
95
|
|
Number of Milled Slots:
|
0
|
|
Number of Internal Cutouts:
|
3
|
|
Impedance Control:
|
no
|
|
Number of Gold finger:
|
0
|
|
BOARD MATERIAL
|
|
|
Glass Epoxy:
|
RO3003 1.524mm
|
|
Final foil external:
|
1oz
|
|
Final foil internal:
|
N/A
|
|
Final height of PCB:
|
1.6 mm ±10%
|
|
PLATING AND COATING
|
|
|
Surface Finish
|
Immersion
Gold
|
|
Solder Mask Apply To:
|
NO
|
|
Solder Mask Color:
|
NO
|
|
Solder Mask Type:
|
NO
|
|
CONTOUR/CUTTING
|
Routing
|
|
MARKING
|
|
|
Side of Component Legend
|
TOP
|
|
Colour of Component Legend
|
Black
|
|
Manufacturer
Name or Logo:
|
Marked
on the board in a conductor and leged FREE AREA
|
|
VIA
|
Plated through hole(PTH), minimum size 0.4mm.
|
|
FLAMIBILITY RATING
|
UL 94-V0 Approval MIN.
|
|
DIMENSION TOLERANCE
|
|
|
Outline dimension:
|
0.0059"
|
|
Board plating:
|
0.0029"
|
|
Drill tolerance:
|
0.002"
|
|
TEST
|
100% Electrical Test prior shipment
|
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email file, Gerber RS-274-X, PCBDOC etc
|
|
SERVICE AREA
|
Worldwide, Globally.
|
Data Sheet of Rogers 3003 (RO3003)
|
RO3003 Typical Value
|
|
Property
|
RO3003
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric
Constant,εProcess
|
3.0±0.04
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650 2.5.5.5 Clamped Stripline
|
|
Dielectric
Constant,εDesign
|
3
|
Z
|
|
8GHz to 40 GHz
|
Differential Phase
Length Method
|
|
Dissipation
Factor,tanδ
|
0.001
|
Z
|
|
10
GHz/23℃
|
IPC-TM-650 2.5.5.5
|
|
Thermal
Coefficient of ε
|
-3
|
Z
|
ppm/℃
|
10 GHz -50℃to 150℃
|
IPC-TM-650 2.5.5.5
|
|
Dimensional
Stability
|
0.06
0.07
|
X
Y
|
mm/m
|
COND A
|
IPC-TM-650 2.2.4
|
|
Volume
Resistivity
|
107
|
|
MΩ.cm
|
COND A
|
IPC 2.5.17.1
|
|
Surface
Resistivity
|
107
|
|
MΩ
|
COND A
|
IPC 2.5.17.1
|
|
Tensile
Modulus
|
930
823
|
X
Y
|
MPa
|
23℃
|
ASTM D 638
|
|
Moisture
Absorption
|
0.04
|
|
%
|
D48/50
|
IPC-TM-650 2.6.2.1
|
|
Specific
Heat
|
0.9
|
|
j/g/k
|
|
Calculated
|
|
Thermal
Conductivity
|
0.5
|
|
W/M/K
|
50℃
|
ASTM D 5470
|
Coefficient of Thermal Expansion
(-55 to 288℃)
|
17
16
25
|
X
Y
Z
|
ppm/℃
|
23℃/50% RH
|
IPC-TM-650 2.4.4.1
|
|
Td
|
500
|
|
℃TGA
|
|
ASTM D 3850
|
|
Density
|
2.1
|
|
gm/cm3
|
23℃
|
ASTM D 792
|
|
Copper
Peel Stength
|
12.7
|
|
Ib/in.
|
1oz,EDC After Solder
Float
|
IPC-TM 2.4.8
|
|
Flammability
|
V-0
|
|
|
|
UL 94
|
|
Lead-free
Process Compatible
|
Yes
|
|
|
|
|
BICHENG PCB WORKSHOP:
BICHENG PCB EQUIPMENT:
BICHENG PCB CERTIFICATE:
Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
