Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
These RO3210 materials are engineered to offer exceptional
electrical performance and mechanical stability. RO3210 laminates combine the
surface smoothness of a non-woven PTFE laminate.
Item NO.:
BIC-056-v13.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 daysRogers RF PCB Built on RO3210 25mil 0.635mm DK10.2 With Immersion Gold for Automotive Collision Avoidance Systems
Rogers RO3210 high frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass.
RO3210 laminates combine the surface smoothness of a non-woven PTFE laminate. Since these materials can be fabricated into PCB using standard PTFE circuit board processing techniques, it results in the mass production and get competitive price on the market. The dielectric constant of RO3210 substrate is 10.2 with a dissipation factor of 0.0027.
Typical applications:
1. Automotive collision avoidance systems
2. Automotive global positions satellite antennas
3. Base station infrastructure
4. Datalink on cable systems
5. Direct broadcast satellites
6. LMDS and wireless broadband
7. Microstrip patch antennas
8. Power backplanes
9. Remote meter readers
10. Wireless telecommunications systems
PCB Specifications:
| PCB SIZE | 35 x 77 mm=2 designs = 2PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 18um(0.5 oz)+plate TOP layer |
| RO3210 0.635mm | |
| copper ------- 18um(0.5 oz)+plate BOT layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 6 mil / 6 mil |
| Minimum / Maximum Holes: | 0.3 mm / 5.6 mm |
| Number of Different Holes: | 2 |
| Number of Drill Holes: | 182 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | RO3210 0.635mm |
| Final foil external: | 1 oz |
| Final foil internal: | 1 oz |
| Final height of PCB: | 0.8 mm ±0.08 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold (23.3% ) 0.05µm over 3µm nickel |
| Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
| Solder Mask Color: | Green, PSR-2000GT600D, Taiyo Supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing, v-cut |
| MARKING | |
| Side of Component Legend | TOP and Bottom. |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo brand |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated through hole(PTH), minimum size 0.3mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Data Sheet of Rogers 3210 (RO3210):
| RO3210 Typical Value | |||||
| Property | RO3210 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 10.2±0.5 | Z | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 10.8 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0027 | Z | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -459 | Z | ppm/℃ | 10 GHz 0℃to 100℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.8 | X, Y | mm/m | COND A | ASTM D257 |
| Volume Resistivity | 103 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 103 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus |
579 517 |
MD CMD |
kpsi | 23℃ | ASTM D 638 |
| Water Absorption | <0.1 | - | % | D24/23 | IPC-TM-650 2.6.2.1 |
| Specific Heat | 0.79 | j/g/k | Calculated | ||
| Thermal Conductivity | 0.81 | W/M/K | 80℃ | ASTM C518 | |
|
Coefficient of Thermal Expansion (-55 to 288℃) |
13 34 |
X,Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ℃ | TGA | ASTM D3850 | |
| Density | 3 | gm/cm3 | |||
| Copper Peel Stength | 11 | pli | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
BICHENG PCB MANUFACTURING PROCESS:

BICHENG PCB TEAM PRACTICE:
BICHEN PCB WORKSHOP:
BICHENG PCB CERTIFICATE:
Previous:
Rogers 6035 Double Sided 20mil Core With Immersion Gold PCBNext:
Rogers RO3010 High Frequency 2-Layer 10mil Printed Circuit Board PCBIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
Categories
New Products
Wangling 5mil 0.127mm TFA300 Core 2-layer Immersion Gold Green Solder Mask PCB
7.5mil AGC Taconic TLY-5 Substrate Custom PCB EPIG Finish Bare Copper
10mil Rogers CuClad 250 Immersion Gold 2-Layer Rigid Microwave PCB
20mil F4BTMS450 Wangling DK4.5 Laminate Custom PCB HASL LF Finsh
F4BME275 Wangling DK2.75 Laminate 2-Layer 1.6mm Pure Gold RF Custom PCB
Wangling F4BTD350S High Frequency PCB 2-layer 20mil Thick ENIG DK3.5 Substrate
12-layer TG200 TU-872 SLK High-Speed FR4 1.68mm PCB with ENIG Impedance Control
12-Layer RO4350B + RO3010 3.14mm Hybrid PCB Nickel-Free EPIG Surface Finish Blind Via
© Copyright: 2026 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.
IPv6 network supported