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Home Rogers PCB Board Rogers RF PCB RO3210 25mil 0.635mm DK10.2 Immersion Gold

Rogers RF PCB RO3210 25mil 0.635mm DK10.2 Immersion Gold

These RO3210 materials are engineered to offer exceptional electrical performance and mechanical stability. RO3210 laminates combine the surface smoothness of a non-woven PTFE laminate.

  • Item NO.:

    BIC-056-v13.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

Rogers RF PCB Built on RO3210 25mil 0.635mm DK10.2 With Immersion Gold for Automotive Collision Avoidance Systems


Rogers RO3210 high frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass. 


RO3210 PCB 25mil


RO3210 laminates combine the surface smoothness of a non-woven PTFE laminate. Since these materials can be fabricated into PCB using standard PTFE circuit board processing techniques, it results in the mass production and get competitive price on the market. The dielectric constant of RO3210 substrate is 10.2 with a dissipation factor of 0.0027.


RO3210 PCB DK DF


Typical applications:


1. Automotive collision avoidance systems

2. Automotive global positions satellite antennas

3. Base station infrastructure

4. Datalink on cable systems

5. Direct broadcast satellites

6. LMDS and wireless broadband

7. Microstrip patch antennas

8. Power backplanes

9. Remote meter readers

10. Wireless telecommunications systems


PCB Specifications:


PCB SIZE 35 x 77 mm=2 designs = 2PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3210 0.635mm
copper ------- 18um(0.5 oz)+plate BOT layer
TECHNOLOGY
Minimum Trace and Space: 6 mil / 6 mil
Minimum / Maximum Holes: 0.3 mm / 5.6 mm
Number of Different Holes: 2
Number of Drill Holes: 182
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy:  RO3210 0.635mm
Final foil external:  1 oz
Final foil internal:  1 oz
Final height of PCB:  0.8 mm ±0.08
PLATING AND COATING
Surface Finish Immersion gold (23.3% ) 0.05µm over 3µm nickel
Solder Mask Apply To:  TOP and Bottom, 12micron Minimum
Solder Mask Color:  Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing, v-cut
MARKING
Side of Component Legend TOP and Bottom.
Colour of Component Legend White, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo:  Marked on the board in a conductor and leged FREE AREA
VIA Plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


Data Sheet of Rogers 3210 (RO3210):


 RO3210 Typical Value
Property RO3210 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.5 Z 10 GHz 23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 10.8 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0027 Z 10 GHz 23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -459 Z ppm/℃ 10 GHz 0℃to 100℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.8 X, Y mm/m COND A ASTM D257
Volume Resistivity 103 MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 103 COND A IPC 2.5.17.1
Tensile Modulus 579
517
MD
CMD
kpsi 23℃ ASTM D 638
Water Absorption <0.1 - % D24/23 IPC-TM-650 2.6.2.1
Specific Heat 0.79 j/g/k Calculated
Thermal Conductivity 0.81 W/M/K 80℃ ASTM C518
Coefficient of Thermal Expansion
(-55 to 288℃)
13
34

X,Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500 TGA ASTM D3850
Density 3 gm/cm3
Copper Peel Stength 11 pli 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes


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