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Home Rogers PCB Board TC350 Rogers RF PCB 30mil Double Sided Corel With Immersion Gold

TC350 Rogers RF PCB 30mil Double Sided Corel With Immersion Gold

TC350 is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies.

  • Item NO.:

    BIC-140-v25.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

TC350 Rogers RF PCB Built on 30mil Double Sided Corel With Immersion Gold for Tower Mounted Amplifiers


Rogers' TC350 is a woven fiberglass reinforced, ceramic filled, PTFE based composite for use as making printed circuit board.


30mil TC350 PCB


Features & Benefits:


1. The increased thermal conductivity of TC350 provides higher power handling, reduces hot-spots and improves device reliability. This results in reduced junction temperatures and extends the life of active components, which is critical for improving power amplifier reliability, extending MTBF and reducing warranty costs.


2. TC350 has excellent Dielectric Constant Stability across a wide temperature range. This helps Power Amplifier and Antenna designers maximize gain and minimize dead bandwidth lost to dielectric constant drift as operating temperature changes.


3. TC350 enjoys a strong bond to copper, utilizing microwave grade, low profile copper. This results in even lower insertion loss due to skin effect losses of copper that are more obvious at higher RF and microwave frequencies.


2L 30mil TC350 PCB


Our PCB Capabilities (TC350):


PCB Material: Woven Fiberglass Reinforced, Ceramic Filled, PTFE based Composite
Designation: TC350
Dielectric constant: 3.5±0.05
Thermal Conductivity 0.72 W/m-K
Dissipation Factor Df .002@10 GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..


Typical Applications:


1. Microwave Combiner and Power Dividers

2. Power Amplifiers, Filters and Couplers

3. Tower Mounted Amplifiers (TMA) and Tower Mounted Boosters (TMB)

4. Thermally Cycled Antennas sensitive to dielectric drift


Typical Properties of TC350:


Typical Properties:TC350
Property Units Value Test Merthod
1. Electrical Properties
Dielectric Constant (may vary by thickness)
                         @1 MHz 3.50 IPC TM-650 2.5.5.3
                         @1.8 GHz 3.50 RESONANT CAVITY
                         @10 GHz 3.50 IPC TM-650 2.5.5.5
                  Dissipation Factor
                        @1 MHz 0.0015 IPC TM-650 2.5.5.3
                        @1.8 GHz 0.0018 RESONANT CAVITY
                        @10 GHz 0.0020 IPC TM-650 2.5.5.5
Temperature Coefficient of Dielectric
            TC r @ 10 GHz (-40-150°C) ppm/ºC -9 IPC TM-650 2.5.5.5
Volume Resistivity
                    C96/35/90 MΩ-cm 7.4x106 IPC TM-650 2.5.17.1
                    E24/125 MΩ-cm 1.4x108
            Surface Resistivity
                   C96/35/90 3.2x107 IPC TM-650 2.5.17.1
                   E24/125 4.3x108 IPC TM-650 2.5.17.1
                   Electrical Strength Volts/mil (kV/mm) 780 (31) IPC TM-650 2.5.6.2
                  Dielectric Breakdown kV 40 IPC TM-650 2.5.6
                  Arc Resistance sec >240 IPC TM-650 2.5.1
2.Thermal Properties
Decomposition Temperature (Td)
Initial °C 520 IPC TM-650 2.4.24.6
5% °C 567 IPC TM-650 2.4.24.6
T260 min >60 IPC TM-650 2.4.24.1
T288 min >60 IPC TM-650 2.4.24.1
T300 min >60 IPC TM-650 2.4.24.1
Thermal Expansion, CTE (x,y) 50-150ºC ppm/ºC 7, 7 IPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150ºC ppm/ºC 12 IPC TM-650 2.4.24
% z-axis Expansion (50-260ºC) % 1.2 IPC TM-650 2.4.24
3. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)
       After Thermal Stress lb/in (N/mm) 7 (1.2) IPC TM-650 2.4.8
At Elevated Temperatures (150ºC) lb/in (N/mm) 9 (1.6) IPC TM-650 2.4.8.2
      After Process Solutions lb/in (N/mm) 7 (1.2) IPC TM-650 2.4.8
Young’s Modulus kpsi (MPa) IPC TM-650 2.4.18.3
Flexural Strength (Machine/Cross) kpsi (MPa) 14/10 (97/69) IPC TM-650 2.4.4
Tensile Strength (Machine/Cross) kpsi (MPa) 11/8 (76/55) IPC TM-650 2.4.18.3
Compressive Modulus kpsi (MPa) ASTM D-3410
Poisson’s Ratio ASTM D-3039
4. Physical Properties
Water Absorption % 0.05 IPC TM-650 2.6.2.1
Density, ambient 23ºC g/cm3 2.30 ASTM D792 Method A
Thermal Conductivity W/mK 0.72 ASTMD5470
Specific Heat J/gK 0.90 ASTM D5470
Flammability class V0 UL-94
NASA Outgassing, 125ºC, ≤10- 6 torr
Total Mass Loss % 0.02 NASA SP-R-0022A
Collected Volatiles % 0.01 NASA SP-R-0022A
Water Vapor Recovered % 0.01 NASA SP-R-0022A


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