Shenzhen Bicheng
Electronics Technology Co., Ltd

# Call Us Now ! Tel : +86 755 27374946

# Order Online Now ! Email : info@bichengpcb.com

Hybrid PCB
Hybrid PCB
Products
Home Rogers PCB Board TC350 Rogers RF PCB 30mil Double Sided Corel With Immersion Gold

TC350 Rogers RF PCB 30mil Double Sided Corel With Immersion Gold

TC350 is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies.

  • Item NO.:

    BIC-140-v25.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

TC350 Rogers RF PCB Built on 30mil Double Sided Corel With Immersion Gold for Tower Mounted Amplifiers


Rogers' TC350 is a woven fiberglass reinforced, ceramic filled, PTFE based composite for use as making printed circuit board.


30mil TC350 PCB


Features & Benefits:


1. The increased thermal conductivity of TC350 provides higher power handling, reduces hot-spots and improves device reliability. This results in reduced junction temperatures and extends the life of active components, which is critical for improving power amplifier reliability, extending MTBF and reducing warranty costs.


2. TC350 has excellent Dielectric Constant Stability across a wide temperature range. This helps Power Amplifier and Antenna designers maximize gain and minimize dead bandwidth lost to dielectric constant drift as operating temperature changes.


3. TC350 enjoys a strong bond to copper, utilizing microwave grade, low profile copper. This results in even lower insertion loss due to skin effect losses of copper that are more obvious at higher RF and microwave frequencies.




Our PCB Capabilities (TC350):


PCB Material: Woven Fiberglass Reinforced, Ceramic Filled, PTFE based Composite
Designation: TC350
Dielectric constant: 3.5±0.05
Thermal Conductivity 0.72 W/m-K
Dissipation Factor Df .002@10 GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..


Typical Applications:


1. Microwave Combiner and Power Dividers

2. Power Amplifiers, Filters and Couplers

3. Tower Mounted Amplifiers (TMA) and Tower Mounted Boosters (TMB)

4. Thermally Cycled Antennas sensitive to dielectric drift


Typical Properties of TC350:


Typical Properties:TC350
Property Units Value Test Merthod
1. Electrical Properties
Dielectric Constant (may vary by thickness)
                         @1 MHz 3.50 IPC TM-650 2.5.5.3
                         @1.8 GHz 3.50 RESONANT CAVITY
                         @10 GHz 3.50 IPC TM-650 2.5.5.5
                  Dissipation Factor
                        @1 MHz 0.0015 IPC TM-650 2.5.5.3
                        @1.8 GHz 0.0018 RESONANT CAVITY
                        @10 GHz 0.0020 IPC TM-650 2.5.5.5
Temperature Coefficient of Dielectric
            TC r @ 10 GHz (-40-150°C) ppm/ºC -9 IPC TM-650 2.5.5.5
Volume Resistivity
                    C96/35/90 MΩ-cm 7.4x106 IPC TM-650 2.5.17.1
                    E24/125 MΩ-cm 1.4x108
            Surface Resistivity
                   C96/35/90 3.2x107 IPC TM-650 2.5.17.1
                   E24/125 4.3x108 IPC TM-650 2.5.17.1
                   Electrical Strength Volts/mil (kV/mm) 780 (31) IPC TM-650 2.5.6.2
                  Dielectric Breakdown kV 40 IPC TM-650 2.5.6
                  Arc Resistance sec >240 IPC TM-650 2.5.1
2.Thermal Properties
Decomposition Temperature (Td)
Initial °C 520 IPC TM-650 2.4.24.6
5% °C 567 IPC TM-650 2.4.24.6
T260 min >60 IPC TM-650 2.4.24.1
T288 min >60 IPC TM-650 2.4.24.1
T300 min >60 IPC TM-650 2.4.24.1
Thermal Expansion, CTE (x,y) 50-150ºC ppm/ºC 7, 7 IPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150ºC ppm/ºC 12 IPC TM-650 2.4.24
% z-axis Expansion (50-260ºC) % 1.2 IPC TM-650 2.4.24
3. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)
       After Thermal Stress lb/in (N/mm) 7 (1.2) IPC TM-650 2.4.8
At Elevated Temperatures (150ºC) lb/in (N/mm) 9 (1.6) IPC TM-650 2.4.8.2
      After Process Solutions lb/in (N/mm) 7 (1.2) IPC TM-650 2.4.8
Young’s Modulus kpsi (MPa) IPC TM-650 2.4.18.3
Flexural Strength (Machine/Cross) kpsi (MPa) 14/10 (97/69) IPC TM-650 2.4.4
Tensile Strength (Machine/Cross) kpsi (MPa) 11/8 (76/55) IPC TM-650 2.4.18.3
Compressive Modulus kpsi (MPa) ASTM D-3410
Poisson’s Ratio ASTM D-3039
4. Physical Properties
Water Absorption % 0.05 IPC TM-650 2.6.2.1
Density, ambient 23ºC g/cm3 2.30 ASTM D792 Method A
Thermal Conductivity W/mK 0.72 ASTMD5470
Specific Heat J/gK 0.90 ASTM D5470
Flammability class V0 UL-94
NASA Outgassing, 125ºC, ≤10- 6 torr
Total Mass Loss % 0.02 NASA SP-R-0022A
Collected Volatiles % 0.01 NASA SP-R-0022A
Water Vapor Recovered % 0.01 NASA SP-R-0022A


PCB MANUFACTURING PROCESS:




BICHENG PCB WORKSHOP:



BICHENG PCB CERTIFICATE:



BICHENG MAIN COURIERS:



Leave A Message

If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

Related Products
RT/Duroid 5880 High Frequency PCB
RT/Duroid 5880 20mil 0.508mm Rogers High Frequency PCB

This is a type of double sided RF PCB built on RT/duroid 5880 for the application of Radar Systems.

2 layer  60mil  RO4003C RF PCB
Rogers 4003 60mil 1.524mm RO4003C High Frequency RF PCB

RO4003C PCBs are hydrocarbon ceramic filled laminates, not PTFE which are designed to offer superior high frequency performance.

RO3003 PCB 10mil
Rogers RO3003 High Frequency PCB 2 Layer 10mil DK3.0 DF 0.001 PCB

Rogers RO3003 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices.

RO3010 PCB 10mil
Rogers RO3010 High Frequency 2-Layer 10mil Printed Circuit Board PCB

RO3010 laminates are competitively priced products with exceptional mechanical and electrical stability. This stability simplifies the design of broadband components and allows the materials to be used in a wide range of applications over a very broad range of frequencies.

25mil RO3210 PCB
Rogers RF PCB RO3210 25mil 0.635mm DK10.2 Immersion Gold

These RO3210 materials are engineered to offer exceptional electrical performance and mechanical stability. RO3210 laminates combine the surface smoothness of a non-woven PTFE laminate.

RT/duroid 6035HTC
Rogers 6035 Double Sided 20mil Core With Immersion Gold PCB

RT/duroid 6035HTC laminates are an exceptional choice for high power applications.

Rogers RO3035 High Frequency PCB
Rogers RO3035 High Frequency 2-Layer 10mil Circuit Board DK3.5 DF 0.0015

RO3035 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability.

Rogers 6006 High Frequency PCB
Rogers 6006 High Frequency PCB Coating Immersion Gold and Green Mask

RT/duroid 6006 microwave laminates has tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.

© Copyright: 2024 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.

IPv6 network supported

IPv6 network supported

top

Leave A Message

Leave A Message

    If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

  • #
  • #
  • #