RO3010 PCB 2-layer 5mil 0.127mm Thick Rogers 3010 ENIG High DK 10.2 Board

RO3010 PCB 2-layer 5mil 0.127mm Thick Rogers 3010 ENIG High DK 10.2 Board

Designed for demanding high-frequency and precision applications, our RO3010 2-layer PCB combines Rogers’industry-leading ceramic-filled PTFE composite material with rigorous manufacturing standards (IPC-Class-2 compliance) to deliver exceptional electrical stability, mechanical durability, and cost-effectiveness. With a ultra-thin finished thickness of 0.2mm, minimum trace/space of 4/5 mils, and ENIG surface finish, this Rogers 3010 PCB is engineered to support miniaturized, high-reliability designs—from automotive radar to satellite communications. Below is a detailed breakdown of its specifications, materials, and value propositions.

1. PCB Construction Details

This table summarizes the foundational build characteristics, ensuring alignment with your design requirements and manufacturing compatibility.

2. PCB Stackup

The 2-layer rigid stackup is optimized for signal integrity and thermal management, leveraging RO3010 Rogers PCB ’s low loss properties to minimize signal degradation at high frequencies.

3. PCB Statistics

These metrics reflect the High DK 10.2 PCB’s component compatibility and design complexity, ideal for validating assembly workflows and connectivity needs.

Rogers RO3010 Material

At the core of this PCB is Rogers RO3010, a ceramic-filled PTFE composite that redefines high-frequency reliability. It offers a high dielectric constant (10.2±0.30 at 10 GHz/23°C) with exceptional stability, simplifying broadband component design while supporting a wide frequency range. Its mechanical and electrical consistency also enables circuit miniaturization—critical for space-constrained applications like GPS antennas or automotive radar modules.

Key Features

1) Electrical Efficiency: Low dissipation factor (0.0022 at 10 GHz/23°C) minimizes signal loss, ideal for high-frequency data transmission.

2) Thermal Resilience: Td (decomposition temperature) >500°C and operating temperature range of -40℃to +85℃, with a low coefficient of thermal expansion (CTE): 13 ppm/°C (X), 11 ppm/°C (Y), 16 ppm/°C (Z) (-55 to 288°C), reducing warpage under stress.

3) Durability: Thermal conductivity of 0.95 W/mK enhances heat dissipation, while moisture absorption of just 0.05% prevents performance degradation in humid environments.

Customer-Centric Benefits

1) Dimensional Stability: CTE matched to copper eliminates thermal stress, ensuring long-term reliability in harsh conditions (e.g., automotive underhoods).

2) Cost-Effectiveness: Economical laminate pricing supports volume manufacturing without compromising quality.

3) Quality Assurance: ISO 9001 certified and compliant with IPC-Class-2 standards, meeting global industry requirements.

4) Design Flexibility: Suitable for multi-layer board designs, expanding its use beyond 2-layer applications.

Typical Applications

This 5 mil Rogers 3010 PCB excels in scenarios demanding precision and stability:

- Automotive radar applications

- Global positioning satellite antennas

- Cellular telecommunications systems - power amplifiers and antennas

- Patch antenna for wireless communications

- Direct broadcast satellites

- Datalink on cable systems

- Remote meter readers

- Power backplanes

Embrace the future of high-frequency design with confidence. This RO3010 high frequency PCB is more than a product; it's a partnership in precision, enabling you to push the boundaries of what's possible in RF and microwave technology.