Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
The RO3206 25mil PCB is more than a circuit board—it’s a engineered solution for applications where performance, reliability, and cost must align.
Item NO.:
BIC-407-v490.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
RO3206 PCB 2-layer 25mil 0.635mm Rogers 3206 Blue Solder Mask White Silkscreen
Introduction
The RO3206 2-layer 25mil PCB is a high-performance circuit board engineered for demanding high-frequency applications, leveraging Rogers’spremium RO3206 ceramic-filled fiberglass-reinforced laminate. Designed to balance exceptional electrical stability, mechanical rigidity, and cost-effectiveness, this Rogers PCB complies with IPC-Class-2 standards, undergoes 100% electrical testing before shipment, and is available worldwide—making it ideal for automotive, wireless telecom, and satellite infrastructure projects. Below is a detailed breakdown of its technical specifications, material advantages, and real-world applications.
1. PCB Construction Details
This table outlines the core manufacturing and physical specifications of the RO3206 2-layer PCB, ensuring consistency in performance, assembly compatibility, and dimensional accuracy.
|
Parameter |
Specification |
|
Base Material |
Rogers RO3206 |
|
Layer Count |
2-layer |
|
Board Dimensions |
63mm x 45mm (1PCS), +/- 0.15mm |
|
Min. Trace/Space |
4/4 mils |
|
Min. Hole Size |
0.3mm |
|
Via Type |
Through-Hole Only (No Blind Vias) |
|
Finished Thickness |
0.75mm |
|
Finished Cu Weight |
1oz (35 μm) Outer Layers |
|
Via Plating Thickness |
20 μm |
|
Surface Finish |
Immersion Gold (ENIG) |
|
Silkscreen (Top/Bottom) |
White / None |
|
Solder Mask (Top/Bottom) |
Blue / None |
|
Electrical Test |
100% Tested |
2. PCB Stackup
The stackup design directly impacts electrical performance—this table details the layered structure of the 2-layer PCB, optimized for signal integrity in high-frequency environments.
|
Layer |
Material |
Thickness |
|
Layer 1 |
Copper Foil |
35 μm (1 oz) |
|
Core |
RO3206 Laminate |
0.635 mm (25 mil) |
|
Layer 2 |
Copper Foil |
35 μm (1 oz) |
3. PCB Statistics
These metrics provide critical data for design validation, assembly planning, and connectivity mapping, ensuring alignment with component requirements.
|
Item |
Quantity |
|
Components |
21 |
|
Total Pads |
43 |
|
Thru-Hole Pads |
25 |
|
Top-SMT Pads |
18 |
|
Bottom-SMT Pads |
0 |
|
Vias |
22 |
|
Nets |
2 |
4. About Rogers RO3206 Material
The Rogers RO3206 PCB is built on Rogers’industry-leadingRO3206 high-frequency laminate—an extension of the trusted RO3000 PCB series, enhanced with woven fiberglass reinforcement for superior mechanical stability. Unlike standard laminates, RO3206 combines ceramic filling with fiberglass to deliver consistent electrical performance across temperature and frequency ranges, making it a top choice for high-speed, high-reliability applications.
5. Key Features
6. Customer Benefits
7. Typical Applications
This Rogers 3206 PCB is ideally suited for a wide range of cutting-edge applications, including:
- Automotive collision avoidance systems
- Automotive global positions satellite antennas
- Wireless telecommunications systems
- Microstrip patch antennas for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes
- LMDS and wireless broadband
- Base station infrastructure
Technical & Logistical Notes
The RO3206 25mil PCB is more than a circuit board—it’s a engineered solution for applications where performance, reliability, and cost must align. Whether you’re designing automotive safety systems or wireless infrastructure, this PCB delivers the consistency and durability your projects demand.
Previous:
RO4003C PCB 4-layer Rogers 4003C Multi-layer ENIG Countersunk Holes and Filled ResinNext:
RO3010 PCB 2-layer 5mil 0.127mm Thick Rogers 3010 ENIG High DK 10.2 BoardIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
Categories
New Products
14-Layer Panasonic M6 R-5775(N) Laminate High Speed PCB ENEPIG Green Solder Mask
8-Layer RO4350B Tg180 FR-4 Mixed Dielectric Material PCB Blind Buried Via ENIG
4-layer RT/duroid 5880+TG175 FR4 Hybrid PCB with ENIG Controlled Depth Slots
4-layer RO4003C+TG175 FR4 Hybrid PCB 1.4mm Finished Board Thick ENIG
2-Layer Ultra-Thin Flexible Polyimide, Adhesiveless PCB SF202 ENEPIG Green Solder Mask
TP2000 PCB TP Series 6mm Wangling DK20 Substrate Pure Gold Bare Copper
25mil TF600-Based 2-Layer DK6.0 TF Series PCB with ENIG and Copper-filled Vias
Rogers RT/duroid 5870 PCB 2-layer 10mil Laminate ENIG Finish Bare Copper
© Copyright: 2026 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.
IPv6 network supported