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Home Newly Shipped RF PCB RO3206 PCB 2-layer 25mil 0.635mm Rogers 3206 Blue Solder Mask White Silkscreen

RO3206 PCB 2-layer 25mil 0.635mm Rogers 3206 Blue Solder Mask White Silkscreen

The RO3206 25mil PCB is more than a circuit board—it’s a engineered solution for applications where performance, reliability, and cost must align.

  • Item NO.:

    BIC-407-v490.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


RO3206 PCB 2-layer 25mil 0.635mm Rogers 3206 Blue Solder Mask White Silkscreen

 

Introduction

The RO3206 2-layer 25mil PCB is a high-performance circuit board engineered for demanding high-frequency applications, leveraging Rogers’spremium RO3206 ceramic-filled fiberglass-reinforced laminate. Designed to balance exceptional electrical stability, mechanical rigidity, and cost-effectiveness, this Rogers PCB complies with IPC-Class-2 standards, undergoes 100% electrical testing before shipment, and is available worldwide—making it ideal for automotive, wireless telecom, and satellite infrastructure projects. Below is a detailed breakdown of its technical specifications, material advantages, and real-world applications.

 

1. PCB Construction Details

This table outlines the core manufacturing and physical specifications of the RO3206 2-layer PCB, ensuring consistency in performance, assembly compatibility, and dimensional accuracy.


Parameter

Specification

Base Material

Rogers RO3206

Layer Count

2-layer

Board Dimensions

63mm x 45mm (1PCS), +/- 0.15mm

Min. Trace/Space

4/4 mils

Min. Hole Size

0.3mm

Via Type

Through-Hole Only (No Blind Vias)

Finished Thickness

0.75mm

Finished Cu Weight

1oz (35 μm) Outer Layers

Via Plating Thickness

20 μm

Surface Finish

Immersion Gold (ENIG)

Silkscreen (Top/Bottom)

White / None

Solder Mask (Top/Bottom)

Blue / None

Electrical Test

100% Tested



2. PCB Stackup

The stackup design directly impacts electrical performance—this table details the layered structure of the 2-layer PCB, optimized for signal integrity in high-frequency environments.


Layer

Material

Thickness

Layer 1

Copper Foil

35 μm (1 oz)

Core

RO3206 Laminate

0.635 mm (25 mil)

Layer 2

Copper Foil

35 μm (1 oz)



3. PCB Statistics

These metrics provide critical data for design validation, assembly planning, and connectivity mapping, ensuring alignment with component requirements.


Item

Quantity

Components

21

Total Pads

43

Thru-Hole Pads

25

Top-SMT Pads

18

Bottom-SMT Pads

0

Vias

22

Nets

2



4. About Rogers RO3206 Material

The Rogers RO3206 PCB is built on Rogers’industry-leadingRO3206 high-frequency laminate—an extension of the trusted RO3000 PCB series, enhanced with woven fiberglass reinforcement for superior mechanical stability. Unlike standard laminates, RO3206 combines ceramic filling with fiberglass to deliver consistent electrical performance across temperature and frequency ranges, making it a top choice for high-speed, high-reliability applications.

 

RO3206 PCB 2-layer 25 mil

 

5. Key Features


  • Precision Dielectric Performance: Dielectric constant (Dk) of 6.15±0.15 at 10 GHz/23°C, ensuring predictable signal propagation.
  • Low Dielectric Loss: Dissipation factor (Df) of 0.0027 at 10 GHz, minimizing signal attenuation in high-frequency circuits.
  • Enhanced Thermal Management: Thermal conductivity of 0.67 W/MK, preventing overheating in dense assemblies.
  • Low Moisture Absorption: <0.1% absorption, maintaining performance in humid environments (critical for automotive and outdoor telecom).
  • Copper CTE Matching: In-plane CTE of 13 ppm/°C (X/Y-axis) and 34 ppm/°C (Z-axis), reducing thermal stress and improving solder joint reliability.
  • Strong Copper Adhesion: Peel strength of 10.7 lbs/in, ensuring durability during handling and assembly.


 

6. Customer Benefits


  • Easier Handling: Woven glass reinforcement boosts rigidity, reducing damage during manufacturing and installation.
  • Reliable High-Frequency Performance: Low Df and tight Dk tolerance enable consistent operation in wireless and satellite systems.
  • Thermal Compatibility: CTE matching with copper supports reliable surface-mounted assemblies (SMAs) and hybrid epoxy multilayer designs.
  • High Production Yields: Excellent dimensional stability minimizes design deviations, lowering rework costs.
  • Cost-Effectiveness: Economical pricing supports volume manufacturing without compromising performance.
  • Finer Line Etching: Surface smoothness allows 4/4 mil trace/space, enabling compact, high-density designs.


 

7. Typical Applications

This Rogers 3206 PCB is ideally suited for a wide range of cutting-edge applications, including:

 

- Automotive collision avoidance systems

- Automotive global positions satellite antennas

- Wireless telecommunications systems

- Microstrip patch antennas for wireless communications

- Direct broadcast satellites

- Datalink on cable systems

- Remote meter readers

- Power backplanes

- LMDS and wireless broadband

- Base station infrastructure



Technical & Logistical Notes


  • Artwork Format: Accepts Gerber RS-274-X (industry-standard for PCB design files).
  • Compliance: Meets IPC-Class-2 standards (for high-reliability commercial and industrial applications).
  • Availability: Shipped worldwide, with flexible lead times for volume orders.


 

The RO3206 25mil PCB is more than a circuit board—it’s a engineered solution for applications where performance, reliability, and cost must align. Whether you’re designing automotive safety systems or wireless infrastructure, this PCB delivers the consistency and durability your projects demand.

 





BICHENG PCB CERTIFICATE:



Top 10 Sales of Rogers PCB




Major material Supplier



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