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The RO4350B high frequency laminate PCB board offers a compelling combination of high performance, cost-effectiveness, and reliability. Its unique material properties
Item NO.:
BIC-244-v309.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
RO4350B PCB 30mil 0.762mm Rogers 4350B Material Immersion Silver High Frequency Laminate PCB Board
Introduction
The RO4350B PCB, utilizing Rogers' proprietary woven glass reinforced hydrocarbon/ceramic materials, offers exceptional electrical performance comparable to PTFE/woven glass, combined with the manufacturability of epoxy/glass. This cutting-edge laminate provides precise control over the dielectric constant (Dk) while maintaining low loss. It stands as an excellent alternative to conventional microwave laminates due to its cost-effectiveness and elimination of special through-hole treatments or handling procedures required by PTFE-based materials. Additionally, RO4350B material are UL 94 V-0 rated, making them suitable for active devices and high-power RF designs.
Features
The Rogers 4350B PCB offers a range of notable features, making it an ideal choice for various applications:
1)Dielectric Constant (DK):
The Rogers RO4350B dielectric constant DK of 3.48 +/- 0.05 at 10GHz/23°C ensures reliable signal transmission and consistent electrical performance.
2)Dissipation Factor:
With a low dissipation factor of 0.0037 at 10GHz/23°C, RO4350B PCBs minimize signal loss, enabling high-frequency applications.
3)Thermal Conductivity:
The PCB's thermal conductivity of 0.69 W/m/°K facilitates efficient heat dissipation, ensuring optimal performance even under demanding thermal conditions.
4)Coefficient of Thermal Expansion (CTE):
With an X-axis CTE of 10 ppm/°C, Y-axis CTE of 12 ppm/°C, and Z-axis CTE of 32 ppm/°C, RO4350B PCBs exhibit excellent dimensional stability and reliability in mixed dielectric multi-layer board constructions.
5)High Tg Value:
The high glass transition temperature (Tg) of >280°C ensures the PCB's stability throughout the entire range of circuit processing temperatures, offering robust performance in extreme environments.
6)Low Water Absorption:
With a water absorption rate of only 0.06%, RO4350B PCBs maintain their electrical and mechanical properties, providing long-term reliability.
RO4350B data sheet:
RO4350B Typical Value |
|||||
Property |
RO4350B |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
3.48±0.05 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
3.66 |
Z |
|
8 to 40 GHz |
Differential Phase Length Method |
Dissipation Factortan,δ |
0.0037 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
+50 |
Z |
ppm/℃ |
-50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
1.2 x 1010 |
|
MΩ.cm |
COND A |
IPC-TM-650 2.5.17.1 |
Surface Resistivity |
5.7 x109 |
|
MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
Electrical Strength |
31.2(780) |
Z |
Kv/mm(v/mil) |
0.51mm(0.020") |
IPC-TM-650 2.5.6.2 |
Tensile Modulus |
16,767(2,432) |
X |
MPa(ksi) |
RT |
ASTM D 638 |
Tensile Strength |
203(29.5) |
X |
MPa(ksi) |
RT |
ASTM D 638 |
Flexural Strength |
255 |
|
MPa |
|
IPC-TM-650 2.4.4 |
Dimensional Stability |
<0.5 |
X,Y |
mm/m |
after etch+E2/150℃ |
IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion |
10 |
X |
ppm/℃ |
-55℃to288℃ |
IPC-TM-650 2.4.41 |
Tg |
>280 |
|
℃ TMA |
A |
IPC-TM-650 2.4.24.3 |
Td |
390 |
|
℃ TGA |
|
ASTM D 3850 |
Thermal Conductivity |
0.69 |
|
W/M/oK |
80℃ |
ASTM C518 |
Moisture Absorption |
0.06 |
|
% |
48hrs immersion 0.060" |
ASTM D 570 |
Density |
1.86 |
|
gm/cm3 |
23℃ |
ASTM D 792 |
Copper Peel Stength |
0.88 |
|
N/mm |
after solder float 1 oz. |
IPC-TM-650 2.4.8 |
Flammability |
(3)V-0 |
|
|
|
UL 94 |
Lead-free Process Compatible |
Yes |
|
|
|
|
Benefits
The Rogers RO4350B PCB brings numerous advantages to the circuit designer and end-user alike:
1)Ideal for Multi-Layer Board (MLB) Constructions:
The RO4350B material's characteristics make it an excellent choice for multi-layer board constructions, ensuring consistent electrical performance across all layers.
2)Processes Like FR-4 at Lower Fabrication Cost:
RO4350B laminates can be processed using standard FR-4 fabrication methods, significantly reducing manufacturing costs without compromising performance.
3)Excellent Dimensional Stability:
The material's low CTE provides exceptional dimensional stability, enabling precise registration of components and reliable interconnectivity.
4)Competitively Priced:
RO4350B laminates offer a cost-effective solution without compromising on quality, making them an attractive choice for budget-conscious projects.
RO4350B PCB Stackup:
2-layer rigid PCB
Copper_layer_1 - 35 μm
RogersRO4350Bthickness Core - 0.762 mm (30mil)
Copper_layer_2 - 20 μm
PCB Construction Details
The 2 layers Rogers PCB with RO4350B follows a 2-layer rigid construction, incorporating the following specifications:
Parameter |
Value |
Board Dimensions |
53.18mm x 76.04 mm (+/- 0.15mm) |
Minimum Trace/Space |
4/4 mils |
Minimum Hole Size |
0.35mm |
Blind Vias |
No |
Finished Board Thickness |
0.8mm |
Finished Cu Weight |
1oz (1.4 mils) outer layers |
Via Plating Thickness |
20 μm |
Surface Finish |
Immersion Silver |
Top Silkscreen |
No |
Bottom Silkscreen |
No |
Top Solder Mask |
No |
Bottom Solder Mask |
No |
100% Electrical Test |
Yes (prior to shipment) |
PCB Statistics
The RO4350B PCB, in its specific configuration, exhibits the following statistics:
Parameter |
Value |
Components |
12 |
Total Pads |
65 |
Thru Hole Pads |
33 |
Top SMT Pads |
32 |
Bottom SMT Pads |
0 |
Vias |
31 |
Nets |
3 |
Type of Artwork Supplied
The RO4350B PCB is supplied with Gerber RS-274-X artwork, a widely recognized and industry-standard format for PCB fabrication and manufacturing.
Quality Standard
The PCB adheres to the IPC-Class-2 quality standard, ensuring consistent and reliable performance for a wide range of applications.
Availability
The Rogers RO4350B 30mil material PCB is available worldwide, providing accessibility to customers and design engineers around the globe.
Some Typical Applications
The versatility and performance of the RO4350B PCB make it suitable for various advanced applications, including:
1)Cellular Base Station Antennas and Power Amplifiers:
The PCB's exceptional electrical characteristics and reliability make it an ideal choice for high-frequency applications in cellular base station antennas and power amplifiers, ensuring optimal signal transmission and performance.
2)RF Identification Tags:
RO4350B PCBs support the development of RF identification tags with reliable and consistent performance, enabling applications in asset tracking, inventory management, and access control systems.
3)Automotive Radar and Sensors:
With its high thermal stability and low loss, the RO4350B PCB is well-suited for automotive radar and sensor applications, providing accurate and reliable detection capabilities for enhanced safety and autonomous driving systems.
4)LNB's for Direct Broadcast Satellites:
The PCB's excellent dimensional stability, low loss, and cost-effectiveness make it a preferred choice for low-noise block downconverters (LNBs) used in direct broadcast satellite systems, ensuring efficient signal reception and processing.
Conclusion
In conclusion, the RO4350B high frequency laminate PCB board offers a compelling combination of high performance, cost-effectiveness, and reliability. Its unique material properties, including precise control over dielectric constant, low loss, and excellent dimensional stability, make it an ideal choice for advanced applications. With a versatile stackup, competitive specifications, and adherence to quality standards, the RO4350B 30mil substrate PCB provides design engineers worldwide with a dependable solution for their most demanding projects.
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