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Rogers 4533 PCB offers outstanding electrical performance, excellent dimensional stability, and easy integration into standard PCB fabrication processes.
Item NO.:
BIC-288-v357.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
RO4533 PCB 60mil 1.524mm Rogers Substrate 2-layer Circuit Board with ENIG
Introducing the RO4533 PCB, a high-performance solution designed specifically for mobile infrastructure microstrip antenna applications. Rogers RO4533 laminates combine controlled dielectric constant, low loss performance, and excellent passive intermodulation response to deliver exceptional antenna performance. With compatibility with conventional FR-4 and high temperature lead-free solder processing, it provides a cost-effective alternative to traditional PTFE antenna technologies.
The RO4533 Rogers laminates are engineered to optimize both price and performance, allowing designers to achieve the best results for their antenna designs. These laminates are also available in halogen-free options to meet the highest environmental standards and ensure compliance with "green" regulations.
With a resin system tailored for ideal antenna performance, the RO4533 dielectric materials offer outstanding properties for mobile infrastructure microstrip antennas. The coefficients of thermal expansion (CTEs) in the X and Y directions are closely matched with copper, reducing stresses in the printed circuit board antenna. The laminates exhibit a typical glass transition temperature exceeding 280°C (536°F), resulting in a low z-axis CTE and excellent plated through-hole reliability.
Key Features
2.1 Dielectric Constant (DK) of 3.3 at 10GHz:
Enables efficient signal transmission for a wide range of applications.
2.2 Dissipation Factor of 0.0025 at 10GHz:
Ensures low loss and excellent signal integrity.
2.3 Low Moisture Absorption of 0.02%:
Provides reliable performance in humid environments.
2.4 Thermal Conductivity of 0.6 W/mK:
Efficiently dissipates heat, improving power handling capabilities.
Benefits
3.1 Low Loss, Low Dk, and Low Passive Intermodulation (PIM) Response:
The RO4533 low dk pcb materials offer exceptional electrical performance, making them suitable for a wide range of high-frequency applications.
3.2 Compatibility with Standard PCB Fabrication:
The thermoset resin system of the RO4533 laminates allows for easy integration into standard PCB fabrication processes, reducing manufacturing complexity.
3.3 Excellent Dimensional Stability:
The laminates exhibit excellent dimensional stability, ensuring consistent performance and greater yield on larger panel sizes.
3.4 Uniform Mechanical Properties:
The RO4533 Rogers substrates possess uniform mechanical properties, making them easier to handle during assembly and installation.
3.5 High Thermal Conductivity:
With high thermal conductivity, the RO4533 laminates effectively dissipate heat, allowing for improved power handling capabilities.
PCB Stackup and Construction Details
PCB Stackup: double layer circuit rigid PCB
Copper_layer_1 - 35μm
Rogers 4533 Core - 1.524 mm (60mil)
Copper_layer_2 - 35μm
Parameter |
Value |
Board dimensions |
110mm x 61.3mm (1PCS), +/- 0.15mm |
Minimum Trace/Space |
4/4 mils |
Minimum Hole Size |
0.4mm |
Blind vias |
No |
Finished board thickness |
1.6mm |
Finished Cu weight |
1oz (1.4 mils) outer layers |
Via plating thickness |
20 μm |
Surface finish |
Immersion Gold |
Top Silkscreen |
White |
Bottom Silkscreen |
No |
Top Solder Mask |
Blue |
Bottom Solder Mask |
No |
Electrical test |
100% prior to shipment |
PCB Statistics
Parameter |
Value |
Components |
46 |
Total Pads |
142 |
Thru Hole Pads |
103 |
Top SMT Pads |
39 |
Bottom SMT Pads |
0 |
Vias |
121 |
Nets |
2 |
Quality Standard and Availability
The RO4533 60mil PCB adheres to IPC-Class-2 quality standard, ensuring consistent and reliable performance. It is available for worldwide distribution, enabling customers from around the globe to benefit from its exceptional features and benefits.
Typical Applications
The RO4533 Rogers PCB is well-suited for various mobile infrastructure microstrip antenna applications. Some of the typical applications include:
Cellular infrastructure base station antennas
WiMAX antenna networks
Conclusion
In conclusion, the Rogers 4533 PCB offers outstanding electrical performance, excellent dimensional stability, and easy integration into standard PCB fabrication processes. With its low loss, low dielectric constant, and compatibility with conventional manufacturing techniques, it provides a cost-effective solution for mobile infrastructure microstrip antenna applications. Whether it's for cellular infrastructure or WiMAX antenna networks, the RO4533 high frequency PCB delivers exceptional performance, reliability, and functionality. Choose RO4533 for your high-frequency applications experience superior results.
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