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Home Rogers PCB Board Rogers 6006 High Frequency PCB Coating Immersion Gold and Green Mask

Rogers 6006 High Frequency PCB Coating Immersion Gold and Green Mask

RT/duroid 6006 microwave laminates has tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.

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Rogers 6006 High Frequency PCB on 25mil, 50mil and 75mil Coating Immersion Gold and Green Mask for Ground Radar Warning

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Hi Guys,

Today we’re going to talk about Rogers 6006 PCB.

Rogers RT/duroid 6006 microwave laminates are ceramic-PTFE composites which are designed for electronic and microwave circuit applications requiring a high dielectric constant. RT/duroid 6006 laminate is available with a dielectric constant value of 6.15.

Rogers RT 6006 PCB

PCB Capability (RT/duroid 6006):

PCB Material:

Ceramic-PTFE composite


RT/duroid 6006

Dielectric constant:

6.15 ±0.15 (process)

6.45 (design)

Layer count:

1 Layer, 2 Layer

Copper weight:

0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

PCB thickness:

10mil (0.254mm), 25mil (0.635mm)

50mil (1.27mm), 75mil (1.90mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, Immersion Tin, Immersion Silver and OSP.

RT/duroid 6006 microwave laminates feature ease of fabrication and stability in use. This property results in the possibility of mass production and reducing the cost of goods.

RT-duroid 6006 PCB Patch Antenna

Features and Benefits:

1. High dielectric constant for circuit size reduction

2. Low loss. Ideal for operating at X-bank or below

3. Tight DK and thickness control for repeatable circuit performance

The typical applications are aircraft collision avoidance systems, ground radar warning systems, patch antennas, satellite communications systems etc.

Thank you for your reading.

Appendix: Properties of RT/duroid 6006 laminates:

RT/duroid 6006 Typical Value
Property RT/duroid 6006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.15 Z 10 GHz/23℃ IPC-TM-650 Clamped stripline
Dielectric Constant,εDesign 6.45 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0027 Z 10 GHz/A IPC-TM-650
Thermal Coefficient of ε -410 Z ppm/℃ -50℃-170℃ IPC-TM-650
Volume Resistivity 7 x 107 A IPC
Surface Resistivity 2 x 107 Mohm A IPC
Tensile Properties ASTM D638 (0.1/min. strain rate)
Young's Modulus 627(91)        517(75) X                           Y MPa(kpsi) A
Ultimate Stress 20(2.8)         17(2.5) X                    Y MPa(kpsi) A
Ultimate Strain 12 to 13                   4 to 6 X                    Y % A
Compressive Properties ASTM D695 (0.05/min. strain rate)
Young's Modulus 1069 (115) Z MPa(kpsi) A
Ultimate Stress 54(7.9) Z MPa(kpsi) A
Ultimate Strain 33 Z %
Flexural Modulus 2634 (382)      1951 (283) X MPa(kpsi) A ASTM D790
Ultimate Stress 38 (5.5)                X                    Y                MPa(kpsi) A
Deformation under load 0.33                     2.1 Z                    Z % 24hr/50℃/7MPa   24hr/150℃/7MPa ASTM D261
Moisture Absorption 0.05 % D48/50℃0.050"(1.27mm) thick IPC-TM-650
Thermal Conductivity 0.49 W/m/k 80℃ ASTM C518
Coefficient of Thermal Expansion
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.41
Td 500 ℃TGA ASTM D3850
Density 2.7 g/cm3 ASTM D792
Specific Heat 0.97(0.231) j/g/k
Copper Peel 14.3 (2.5) pli (N/mm) after solder float IPC-TM-650 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes


Manufacturing Process of Dual Layer PTH PCB







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