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RT/duroid 6006 microwave laminates has tight dielectric constant and thickness control, low
moisture absorption, and good thermal mechanical stability.
Item NO.:
BIC-062-v55.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaColor:
WhiteShipping Port:
ShenzhenLead Time:
7-10 days
Rogers 6006 High Frequency PCB on 25mil, 50mil and 75mil Coating Immersion Gold and Green Mask for Ground Radar Warning
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Hi Guys,
Today we’re going to talk about Rogers 6006 PCB.
Rogers RT/duroid 6006 microwave laminates are ceramic-PTFE composites which are designed for electronic and microwave circuit applications requiring a high dielectric constant. RT/duroid 6006 laminate is available with a dielectric constant value of 6.15.
PCB Capability (RT/duroid 6006):
PCB Material: |
Ceramic-PTFE composite |
Designator: |
RT/duroid 6006 |
Dielectric constant: |
6.15 ±0.15 (process) |
6.45 (design) |
|
Layer count: |
1 Layer, 2 Layer |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: |
10mil (0.254mm), 25mil (0.635mm) |
50mil (1.27mm), 75mil (1.90mm) |
|
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion Tin, Immersion Silver and OSP. |
RT/duroid 6006 microwave laminates feature ease of fabrication and stability in use. This property results in the possibility of mass production and reducing the cost of goods.
Features and Benefits:
1. High dielectric constant for circuit size reduction |
2. Low loss. Ideal for operating at X-bank or below |
3. Tight DK and thickness control for repeatable circuit performance |
The typical applications are aircraft collision avoidance systems, ground radar warning systems, patch antennas, satellite communications systems etc.
Thank you for your reading.
Appendix: Properties of RT/duroid 6006 laminates:
RT/duroid 6006 Typical Value | |||||
Property | RT/duroid 6006 | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 6.15±0.15 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped stripline | |
Dielectric Constant,εDesign | 6.45 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor,tanδ | 0.0027 | Z | 10 GHz/A | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | -410 | Z | ppm/℃ | -50℃-170℃ | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 7 x 107 | Mohm.cm | A | IPC 2.5.17.1 | |
Surface Resistivity | 2 x 107 | Mohm | A | IPC 2.5.17.1 | |
Tensile Properties | ASTM D638 (0.1/min. strain rate) | ||||
Young's Modulus | 627(91) 517(75) | X Y | MPa(kpsi) | A | |
Ultimate Stress | 20(2.8) 17(2.5) | X Y | MPa(kpsi) | A | |
Ultimate Strain | 12 to 13 4 to 6 | X Y | % | A | |
Compressive Properties | ASTM D695 (0.05/min. strain rate) | ||||
Young's Modulus | 1069 (115) | Z | MPa(kpsi) | A | |
Ultimate Stress | 54(7.9) | Z | MPa(kpsi) | A | |
Ultimate Strain | 33 | Z | % | ||
Flexural Modulus | 2634 (382) 1951 (283) | X | MPa(kpsi) | A | ASTM D790 |
Ultimate Stress | 38 (5.5) | X Y | MPa(kpsi) | A | |
Deformation under load | 0.33 2.1 | Z Z | % | 24hr/50℃/7MPa 24hr/150℃/7MPa | ASTM D261 |
Moisture Absorption | 0.05 | % | D48/50℃0.050"(1.27mm) thick | IPC-TM-650 2.6.2.1 | |
Thermal Conductivity | 0.49 | W/m/k | 80℃ | ASTM C518 | |
Coefficient of Thermal Expansion |
47 34 117 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |
Td | 500 | ℃TGA | ASTM D3850 | ||
Density | 2.7 | g/cm3 | ASTM D792 | ||
Specific Heat | 0.97(0.231) |
j/g/k (BTU/ib/OF) |
Calculated | ||
Copper Peel | 14.3 (2.5) | pli (N/mm) | after solder float | IPC-TM-650 2.4.8 | |
Flammability | V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |
MANUFACTURING PROCESS:
BICHNEG PCB WORKSHOP:
BICHNEG PCB CERTIFICATION:
BICHENG PCB MAIN COURIERS:
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