Rogers CuClad 233 2-Layer 20mil 0.508mm PCB ENIG High Frequency Board

Rogers CuClad 233 2-Layer 20mil0.508mmPCB ENIG High Frequency Board

Introducing our CuClad 233 2-layer 20mil PCB—a precision-engineered printed circuit board designed to meet the rigorous demands of high-frequency and high-reliability electronic systems. Built on Rogers’industry-leading CuClad 233 laminate, this Rogers PCB combines exceptional electrical performance, mechanical stability, and consistent quality, making it an ideal choice for critical applications ranging from radar systems to microwave components. Below is a comprehensive breakdown of its specifications, features, and value proposition.

Detailed PCB Construction

The following table outlines the critical construction details that define the Rogers CuClad 233 PCB’s performance and manufacturability, ensuring consistency and reliability in every unit.

PCB Stackup

The 2-layer stackup is engineered to maximize signal integrity, leveraging the CuClad 233 core’s low dielectric properties for minimal signal loss.

PCB Statistics

These metrics reflect the CuClad 233 PCB’s design complexity and compatibility with standard assembly processes.

About CuClad 233 Laminate

At the heart of this PCB is Rogers CuClad 233—a cross-plied, woven fiberglass and PTFE composite laminate renowned for its balanced electrical and mechanical properties. Unlike conventional laminates, CuClad 233 uses a medium fiberglass/PTFE ratio to deliver a low dielectric constant (Dk) without compromising rigidity or durability. Its cross-plied construction (alternating plies oriented 90°to each other) ensures exceptional dimensional stability, even under temperature fluctuations—a critical advantage for harsh environments.

Key Features

1) Ultra-Low Dielectric Constant: Dk of 2.33 at 10GHz / 1MHz, ensuring minimal signal delay and distortion.

2) Low Dissipation Factor: 0.0013 at 10GHz, reducing energy loss in high-frequency circuits.

3) Minimal Moisture Absorption: 0.02% absorption rate, preventing performance degradation in humid conditions.

4) Superior Mechanical Strength: Peel strength of 14 lbs/in, ensuring reliable copper-to-laminate bonding.

5) Space-Grade Outgassing Performance: Total Mass Loss (TML) of 0.01%, Collected Volatile Condensable Material (CVCM) of 0.01%, and 0% Water Vapor Regain (WVR)—ideal for aerospace applications.

6) Uniform Dielectric Properties: Better Dk uniformity than non-woven fiberglass laminates, ensuring consistent signal performance across the board.

Customer Benefits

1) Stable Performance Across Frequencies: Consistent Dk minimizes signal variation, critical for wideband systems.

2) Lower Insertion Loss: Low Dk allows for wider trace widths, reducing signal attenuation in high-frequency paths.

3) High-Frequency Efficiency: Low dissipation factor ensures minimal power loss, extending component lifespan and system reliability.

4) Scalability: Supports large PCB and antenna formats, enabling design flexibility for complex systems.

5) Aerospace Compatibility: In-plane CTE (Coefficient of Thermal Expansion) matches aluminum, making it suitable for aircraft skin/structure integration.

Typical Applications

This CuClad 233 high frequency PCB is engineered for industries that demand uncompromising reliability and signal integrity:

- Radars, Electronic Countermeasures, Electronic Support Measures

- Microwave Components (LNAs, filters, couplers, etc.)

Quality & Availability

Every CuClad 233 PCB adheres to IPC-Class-2 standards, ensuring compliance with global electronics manufacturing requirements. We conduct 100% electrical testing before shipment to eliminate defects, and our worldwide distribution network ensures fast delivery to any location.

Whether you’re designing next-generation radar systems or high-performance microwave components, the CuClad 233 20 mil PCB delivers the performance, reliability, and consistency your application demands. Contact our sales team today to discuss volume pricing or custom modifications.