PTFE PCB Board Built On 1.5mm PTFE Plate with
3oz Copper and Immersion Silver Pads for Power Amplifier
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
It has excellent
chemical stability, corrosion resistance, sealing, high lubrication and
non-viscosity, electrical insulation and good aging resistance. Used as engineering plastic, it can be made into PTFE tube, rod, belt, plate, film and
so on. Generally it’s used in high performance requirements of
corrosion-resistant pipes, containers, pumps, valves as well as radar,
high-frequency communication equipment, radio equipment.
Polytetrafluoroethylene
(F4,PTFE) has a series of excellent performance:
1.high temperature
resistance: long-term use temperature 200~260 degrees Celsius.
2.low temperature
resistance: still soft at -100 degrees Celsius;
3.corrosion resistance:
resistant aqua regia and all organic solvents;
4.climate resistance: best
aging life in plastics;
5.high lubrication: with the
smallest friction coefficient in plastics (0.04);
6.Non-viscous: with minimal
surface tension in solid materials without adhering to any substance;
7.non-toxic: with
physiological inertness;
8.excellent electrical
properties, ideal for C class of insulating materials, a thick layer of stack
of newspaper can block 1500 V of high voltage;
9.smoother than ice.
F4BM-1/2 is laminated by laying up
of varnished glass cloth with Teflon resin，according to the scientific formulation and strict technology process. This
product takes some advantages over F4B series in the electrical
performance（wider range of dielectric constant、lower dielectric loss angle tangent、increased resistance、and
more stability of performance）
At RF and Microwave frequencies, the dielectric
constant of PTFE materials is as low as 3.5 or below, which keeps strong signal
during transmission across PCB, making them ideal for overcoming the high speed
limitation of FR-4.
Application
LNA, Radar data acquisition converter, Spread
spectrum, 4G antenna
|
PCB SIZE
|
67 x 85 mm =1up
|
|
BOARD TYPE
|
Double
sided PCB
|
|
Number
of Layers
|
2 layers
|
|
Surface
Mount Components
|
YES
|
|
Through
Hole Components
|
NO
|
|
LAYER STACKUP
|
copper
------- 105um(1 oz)+plate TOP layer
|
|
F4B PTFE 1.5mm
|
|
copper ------- 105um(1oz) + plate BOT Layer
|
|
TECHNOLOGY
|
|
|
Minimum Trace and Space:
|
7.9
mil / 5.9 mil
|
|
Minimum
/ Maximum Holes:
|
0.4
mm / 0.4 mm
|
|
Number
of Different Holes:
|
1
|
|
Number
of Drill Holes:
|
1
|
|
Number
of Milled Slots:
|
0
|
|
Number
of Internal Cutouts:
|
0
|
|
Impedance
Control:
|
no
|
|
Number
of Gold finger:
|
0
|
|
BOARD
MATERIAL
|
|
|
Glass
Epoxy:
|
PTFE
|
|
Final
foil external:
|
3oz
|
|
Final
foil internal:
|
N/A
|
|
Final
height of PCB:
|
1.5mm
|
|
PLATING AND COATING
|
|
|
Surface Finish
|
Immersion Silver
|
|
Solder
Mask Apply To:
|
N/A
|
|
Solder
Mask Color:
|
N/A
|
|
Solder
Mask Type:
|
N/A
|
|
CONTOUR/CUTTING
|
Routing
|
|
MARKING
|
|
|
Side of
Component Legend
|
N/A
|
|
Colour
of Component Legend
|
N/A
|
|
Manufacturer
Name or Logo:
|
N/A
|
|
VIA
|
Plated
through hole(PTH), minimum size 0.4mm.
|
|
FLAMIBILITY RATING
|
UL
94-V0 Approval MIN.
|
|
DIMENSION TOLERANCE
|
|
|
Outline
dimension:
|
0.0059"
|
|
Board
plating:
|
0.0029"
|
|
Drill
tolerance:
|
0.002"
|
|
TEST
|
100%
Electrical Test prior shipment
|
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email
file, Gerber RS-274-X, PCBDOC etc
|
|
SERVICE AREA
|
Worldwide,
Globally.
|
Our PCB Capability
|
PCB
Material:
|
Fibre glass
coated PTFE
|
|
Code:
|
F4BM-1/2 (family series)
|
|
Dielectric constant:
|
2.2, 2.55, 2.65, 3.0
and 3.5
|
|
Layer count:
|
1 Layer, 2 Layers and
multi-layer
|
|
Copper
weight:
|
0.5oz (17 µm), 1oz
(35µm), 2oz (70µm), 3oz (105µm)
|
|
PCB
thickness:
|
0.25mm,
0.5mm, 0.8mm, 1.0mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm,
12.0mm
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue,
Yellow, Red etc.
|
|
Surface
finish:
|
Bare copper, HASL,
ENIG, Silver, OSP,etc.
|
Electrical properties of F4B PTFE
|
Name
|
Test condition
|
Unit
|
Value
|
|
Density
|
Normal state
|
g/ cm3
|
2.1～2.35
|
|
Moisture
Absorption
|
Dip
in the distilled water of 20±2℃ for 24 hours
|
%
|
≤0.02
|
|
Operating
Temperature
|
High-low temperature
chamber
|
℃
|
-50℃～+260℃
|
|
Thermal
Conductivity
|
|
W/m/k
|
0.8
|
|
CTE (typical)
|
0～100℃ （εr ：2.1~2.3）
|
ppm/℃
|
25（x）
|
|
34（y）
|
|
252（z）
|
|
CTE (typical)
|
0～100℃ （εr ：2.3~2.9）
|
ppm/℃
|
14（x）
|
|
21（y）
|
|
173（z）
|
|
CTE (typical)
|
0～100℃ （εr ：2.9~3.5）
|
ppm/℃
|
12（x）
|
|
15（y）
|
|
95（z）
|
|
Shrinkage
Factor
|
2 hours in boiling
water
|
%
|
0.0002
|
|
Surface Resistivity
|
500V DC
|
Normal state
|
M·Ω
|
≥1×104
|
|
Constant
humidity and temperature
|
≥1×103
|
|
Volume Resistivity
|
Normal state
|
MΩ.cm
|
≥1×106
|
|
Constant
humidity and temperature
|
≥1×105
|
|
Pin Resistance
|
500V DC
|
Normal state
|
MΩ
|
≥1×105
|
|
Constant humidity and temperature
|
≥1×103
|
|
Surface dielectric strength
|
Normal state
|
d=1mm（Kv/mm）
|
≥1.2
|
|
Constant
humidity and temperature
|
≥1.1
|
|
Dielectric Constant
|
10GHZ
|
εr
|
2.20，2.55，2.65，3.0，3.5
|
|
（±2%）
|
|
Dissipation Factor
|
10GHZ
|
tgδ
|
2.2
|
≤7×10-4
|
|
2.55~2.65
|
≤1×10-3
|
|
3.0~3.5
|
≤1.5×10-3
|
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