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Home High Frequency PCB Rogers RO3003 High Frequency Printed Circuit Board 2-Layer 0.762mm PCB with DK3.0 DF 0.001

Rogers RO3003 High Frequency Printed Circuit Board 2-Layer 0.762mm PCB with DK3.0 DF 0.001

RO3003 is a laminate that also shows a very low dielectric loss of 0.0013 at 10GHz.

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Rogers RO3003 High Frequency Printed Circuit Board 2-Layer Rogers 3003 30mil 0.762mm PCB with DK3.0 DF 0.001

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RO3003 high frequency material is PTFE composite with ceramic filler, the application of this material allows the dielectric constant of RO3003 to be extremely high temperature stability. 

When operating at 10GHz and the temperature varies from -50℃to +150℃, the thermal stability coefficient (Z direction) of its dielectric constant can reach -3ppm/(℃). PTFE glass material will not appear at room temperature a step change in dielectric constant. At the same time, RO3103 also guarantees the high dielectric constant canonical stability, can be used for a wide range of frequency library. RO3003 is a laminate that also shows a very low dielectric loss of 0.0013 at 10GHz.

Also thanks to the application of this composite material, the RO3003 PTFE ceramic material has a thermal expansion coefficient of 17ppm/℃in the X and V directions, comparable to that of copper, which enables the material to show excellent dimensional stability with a typical shrinkage due to etching (braising and baking) of less than 5mil/inch. The thermal expansion coefficient in the Z direction is 25ppm/℃, which can ensure the stability of the electroplating through hole even in the severe temperature environment. RO3003 PTFE ceramics with excellent dielectric constant temperature and frequency stability, as well as excellent time stability, RO3003 is qualified for commercial microwave and RF circuit applications


Typical applications:

1) Automotive radar

2) Cellular telecommunications systems

3) Datalink on cable systems

4) Direct broadcast satellites

5) Global positioning satellite antennas

6) Patch antenna for wireless communications

7) Power amplifiers and antennas

8) Power backplanes

9) Remote meter readers

RO3003 PCB 30mil

PCB Specifications:

PCB SIZE 81 x 45mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3003 0.762mm
copper ------- 18um(0.5oz) + plate  BOT Layer
Minimum Trace and Space: 5 mil / 5 mil
Minimum / Maximum Holes: 0.5mm / 2.0mm
Number of Different Holes: 1
Number of Drill Holes: 1
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
Glass Epoxy:  RO3003 0.762mm
Final foil external:  1oz
Final foil internal:  N/A
Final height of PCB:  0.8 mm ±0.1
Surface Finish Immersion gold (31%)
Solder Mask Apply To:  NO
Solder Mask Color:  N/A
Solder Mask Type: N/A
Side of Component Legend Top Side
Colour of Component Legend Black
Manufacturer Name or Logo:  Marked on the board in a conductor and legend FREE AREA
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Data Sheet of Rogers 3003 (RO3003):

 RO3003 Typical Value
Property RO3003 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.04 Z 10 GHz/23℃ IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 3 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.001 Z 10 GHz/23℃ IPC-TM-650
Thermal Coefficient of ε -3 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650
Dimensional Stability 0.06
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107 MΩ.cm COND A IPC
Surface Resistivity 107 COND A IPC
Tensile Modulus 930
MPa 23℃ ASTM D 638
Moisture Absorption 0.04 % D48/50 IPC-TM-650
Specific Heat 0.9 j/g/k Calculated
Thermal Conductivity 0.5 W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
ppm/℃ 23℃/50% RH IPC-TM-650
Td 500 ℃TGA ASTM D 3850
Density 2.1 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 12.7 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes




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