Rogers RO3003 High Frequency Printed Circuit
Board 2-Layer Rogers 3003 30mil 0.762mm PCB with DK3.0 DF 0.001
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
Rogers RO3003 high frequency material is PTFE
composite with ceramic filler, the application of this material allows the
dielectric constant of RO3003 to be extremely high temperature stability.
When
operating at 10GHz and the temperature varies from -50℃to
+150℃, the thermal stability coefficient (Z direction)
of its dielectric constant can reach -3ppm/(℃). PTFE glass
material will not appear at room temperature a step change in dielectric
constant. At the same time, RO3103 also guarantees the high dielectric constant
canonical stability, can be used for a wide range of frequency library. RO3003
is a laminate that also shows a very low dielectric loss of 0.0013 at 10GHz.
Also thanks to the application of this
composite material, the RO3003 PTFE ceramic material has a thermal expansion
coefficient of 17ppm/℃in the X and V directions, comparable
to that of copper, which enables the material to show excellent dimensional
stability with a typical shrinkage due to etching (braising and baking) of less
than 5mil/inch. The thermal expansion coefficient in the Z direction is 25ppm/℃, which can ensure the stability of the electroplating
through hole even in the severe temperature environment. RO3003 PTFE ceramics
with excellent dielectric constant temperature and frequency stability, as well
as excellent time stability, RO3003 is qualified for commercial microwave and RF circuit applications.
Typical applications:
1) Automotive radar
2) Cellular telecommunications systems
3) Datalink on cable systems
4) Direct broadcast satellites
5) Global positioning satellite antennas
6) Patch antenna for wireless communications
7) Power amplifiers and antennas
8) Power backplanes
9) Remote meter readers
PCB Specifications:
|
PCB SIZE
|
81 x 45mm=1PCS
|
|
BOARD TYPE
|
Double
sided PCB
|
|
Number
of Layers
|
2 layers
|
|
Surface
Mount Components
|
YES
|
|
Through
Hole Components
|
NO
|
|
LAYER STACKUP
|
copper
------- 18um(0.5 oz)+plate TOP layer
|
|
RO3003 0.762mm
|
|
copper ------- 18um(0.5oz) + plate BOT Layer
|
|
TECHNOLOGY
|
|
|
Minimum Trace and Space:
|
5
mil / 5 mil
|
|
Minimum
/ Maximum Holes:
|
0.5mm
/ 2.0mm
|
|
Number
of Different Holes:
|
1
|
|
Number
of Drill Holes:
|
1
|
|
Number
of Milled Slots:
|
0
|
|
Number
of Internal Cutouts:
|
0
|
|
Impedance
Control:
|
no
|
|
Number
of Gold finger:
|
0
|
|
BOARD
MATERIAL
|
|
|
Glass
Epoxy:
|
RO3003
0.762mm
|
|
Final
foil external:
|
1oz
|
|
Final
foil internal:
|
N/A
|
|
Final
height of PCB:
|
0.8
mm ±0.1
|
|
PLATING AND COATING
|
|
|
Surface Finish
|
Immersion gold
(31%)
|
|
Solder
Mask Apply To:
|
NO
|
|
Solder
Mask Color:
|
N/A
|
|
Solder
Mask Type:
|
N/A
|
|
CONTOUR/CUTTING
|
Routing
|
|
MARKING
|
|
|
Side of
Component Legend
|
Top
Side
|
|
Colour
of Component Legend
|
Black
|
|
Manufacturer
Name or Logo:
|
Marked on the
board in a conductor and legend FREE AREA
|
|
VIA
|
N/A
|
|
FLAMIBILITY RATING
|
UL
94-V0 Approval MIN.
|
|
DIMENSION TOLERANCE
|
|
|
Outline
dimension:
|
0.0059"
|
|
Board
plating:
|
0.0029"
|
|
Drill
tolerance:
|
0.002"
|
|
TEST
|
100%
Electrical Test prior shipment
|
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email
file, Gerber RS-274-X, PCBDOC etc
|
|
SERVICE AREA
|
Worldwide,
Globally.
|
Data Sheet of Rogers 3003 (RO3003):
|
RO3003 Typical Value
|
|
Property
|
RO3003
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric Constant,εProcess
|
3.0±0.04
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650 2.5.5.5 Clamped Stripline
|
|
Dielectric
Constant,εDesign
|
3
|
Z
|
|
8GHz to 40 GHz
|
Differential Phase
Length Method
|
|
Dissipation
Factor,tanδ
|
0.001
|
Z
|
|
10
GHz/23℃
|
IPC-TM-650 2.5.5.5
|
|
Thermal
Coefficient of ε
|
-3
|
Z
|
ppm/℃
|
10 GHz -50℃to 150℃
|
IPC-TM-650 2.5.5.5
|
|
Dimensional
Stability
|
0.06
0.07
|
X
Y
|
mm/m
|
COND A
|
IPC-TM-650 2.2.4
|
|
Volume
Resistivity
|
107
|
|
MΩ.cm
|
COND A
|
IPC 2.5.17.1
|
|
Surface
Resistivity
|
107
|
|
MΩ
|
COND A
|
IPC 2.5.17.1
|
|
Tensile
Modulus
|
930
823
|
X
Y
|
MPa
|
23℃
|
ASTM D 638
|
|
Moisture
Absorption
|
0.04
|
|
%
|
D48/50
|
IPC-TM-650 2.6.2.1
|
|
Specific Heat
|
0.9
|
|
j/g/k
|
|
Calculated
|
|
Thermal
Conductivity
|
0.5
|
|
W/M/K
|
50℃
|
ASTM D 5470
|
Coefficient of Thermal Expansion
(-55 to 288℃)
|
17
16
25
|
X
Y
Z
|
ppm/℃
|
23℃/50% RH
|
IPC-TM-650 2.4.4.1
|
|
Td
|
500
|
|
℃TGA
|
|
ASTM D 3850
|
|
Density
|
2.1
|
|
gm/cm3
|
23℃
|
ASTM D 792
|
|
Copper Peel
Stength
|
12.7
|
|
Ib/in.
|
1oz,EDC After Solder
Float
|
IPC-TM 2.4.8
|
|
Flammability
|
V-0
|
|
|
|
UL 94
|
|
Lead-free
Process Compatible
|
Yes
|
|
|
|
|
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