Rogers
RT/Duroid 5880 62mil 1.575mm High Frequency PCB for Commercial Aireline
Broadband Antennas
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
The RT/ duroid 5880 HF board is manufactured from teflon glass fiber reinforced
material. The dielectric constant of RT/ duroid 5880 is only 2.2 when measured
at 10GHz operating frequency, which is significantly lower than that of similar
materials on the market. Therefore, from the perspective of performance
parameters and production cost, the plate is compared with similar products. It
is more suitable for high-frequency design applications. Meanwhile, the
dielectric loss of the plate is measured under the same standard, which is only
0.0009, The extremely low dielectric loss makes it ideal for high frequency and
wide band design applications that require minimal dispersion and loss. It is
mainly used in point-to-point digital radio antennas, microstrip and ribbon
circuits, millimeter wave applications, missile guidance systems, military
radar systems, and high frequency circuit boards for commercial aviation
phones.
RT/ duroid
5880 HF board features:
1.
Very low dielectric constant, measured at 10GHz, dielectric constant is
2.20+0.02; 2.
2.
Very low dielectric loss, measured at 10GHz, the dielectric loss factor is
0.0009;
Typical Applications:
PCB
Specifications:
|
PCB SIZE
|
135 x 95mm=1PCS
|
|
BOARD TYPE
|
Double
sided PCB
|
|
Number
of Layers
|
2 layers
|
|
Surface
Mount Components
|
YES
|
|
Through
Hole Components
|
YES
|
|
LAYER STACKUP
|
copper
------- 35µm(1 oz)+plate TOP layer
|
|
RT/duroid 5880 1.575mm
|
|
copper ------- 35µm(1oz) + plate BOT Layer
|
|
TECHNOLOGY
|
|
|
Minimum Trace and Space:
|
8
mil / 7 mil
|
|
Minimum
/ Maximum Holes:
|
0.4
mm / 4.5 mm
|
|
Number
of Different Holes:
|
4
|
|
Number
of Drill Holes:
|
87
|
|
Number
of Milled Slots:
|
0
|
|
Number
of Internal Cutouts:
|
0
|
|
Impedance
Control:
|
no
|
|
Number
of Gold finger:
|
0
|
|
BOARD
MATERIAL
|
|
|
Glass
Epoxy:
|
RT/duroid
5880 1.575mm
|
|
Final
foil external:
|
1.0
oz
|
|
Final
foil internal:
|
N/A
|
|
Final
height of PCB:
|
1.6
mm ±0.16
|
|
PLATING AND COATING
|
|
|
Surface Finish
|
Immersion gold
|
|
Solder
Mask Apply To:
|
N/A
|
|
Solder
Mask Color:
|
N/A
|
|
Solder
Mask Type:
|
N/A
|
|
CONTOUR/CUTTING
|
Routing
|
|
MARKING
|
|
|
Side of
Component Legend
|
N/A
|
|
Colour
of Component Legend
|
N/A
|
|
Manufacturer
Name or Logo:
|
N/A
|
|
VIA
|
Plated
through hole(PTH), minimum size 0.4mm.
|
|
FLAMIBILITY RATING
|
UL
94-V0 Approval MIN.
|
|
DIMENSION TOLERANCE
|
|
|
Outline
dimension:
|
0.0059"
|
|
Board
plating:
|
0.0029"
|
|
Drill
tolerance:
|
0.002"
|
|
TEST
|
100%
Electrical Test prior shipment
|
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email
file, Gerber RS-274-X, PCBDOC etc
|
|
SERVICE AREA
|
Worldwide,
Globally.
|
Data
Sheet of Rogers 5880 (RT/duroid 5880):
|
RT/duroid 5880 Typical Value
|
|
Property
|
RT/duroid 5880
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric
Constant,εProcess
|
2.20
2.20±0.02 spec.
|
Z
|
N/A
|
C24/23/50
C24/23/50
|
1 MHz
IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
|
|
Dielectric Constant,εDesign
|
2.2
|
Z
|
N/A
|
8GHz to 40 GHz
|
Differential Phase
Length Method
|
|
Dissipation Factor,tanδ
|
0.0004
0.0009
|
Z
|
N/A
|
C24/23/50
C24/23/50
|
1
MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
|
|
Thermal Coefficient of ε
|
-125
|
Z
|
ppm/℃
|
-50℃to 150℃
|
IPC-TM-650 2.5.5.5
|
|
Volume Resistivity
|
2 x
107
|
Z
|
Mohm cm
|
C/96/35/90
|
ASTM D 257
|
|
Surface Resistivity
|
3 x 107
|
Z
|
Mohm
|
C/96/35/90
|
ASTM D 257
|
|
Specific Heat
|
0.96(0.23）
|
N/A
|
j/g/k
(cal/g/c)
|
N/A
|
Calculated
|
|
Tensile Modulus
|
Test
at 23℃
|
Test
at 100℃
|
N/A
|
MPa(kpsi)
|
A
|
ASTM D 638
|
|
1070(156)
|
450(65)
|
X
|
|
860(125)
|
380(55)
|
Y
|
|
Ultimate Stress
|
29(4.2)
|
20(2.9)
|
X
|
|
27(3.9）
|
18(2.6)
|
Y
|
|
Ultimate Strain
|
6
|
7.2
|
X
|
%
|
|
4.9
|
5.8
|
Y
|
|
Compressive Modulus
|
710(103)
|
500(73)
|
X
|
MPa(kpsi)
|
A
|
ASTM D 695
|
|
710(103)
|
500(73)
|
Y
|
|
940(136)
|
670(97)
|
Z
|
|
Ultimate Stress
|
27(3.9)
|
22(3.2)
|
X
|
|
29(5.3)
|
21(3.1)
|
Y
|
|
52(7.5)
|
43(6.3)
|
Z
|
|
Ultimate Strain
|
8.5
|
8.4
|
X
|
%
|
|
7.7
|
7.8
|
Y
|
|
12.5
|
17.6
|
Z
|
|
Moisture Absorption
|
0.02
|
N/A
|
%
|
0.62"(1.6mm)
D48/50
|
ASTM D 570
|
|
Thermal Conductivity
|
0.2
|
Z
|
W/m/k
|
80℃
|
ASTM C 518
|
|
Coefficient of Thermal Expansion
|
31
48
237
|
X
Y
Z
|
ppm/℃
|
0-100℃
|
IPC-TM-650 2.4.41
|
|
Td
|
500
|
N/A
|
℃TGA
|
N/A
|
ASTM D 3850
|
|
Density
|
2.2
|
N/A
|
gm/cm3
|
N/A
|
ASTM D 792
|
|
Copper Peel
|
31.2(5.5)
|
N/A
|
Pli(N/mm)
|
1oz(35mm)EDC
foil
after solder float
|
IPC-TM-650 2.4.8
|
|
Flammability
|
V-0
|
N/A
|
N/A
|
N/A
|
UL 94
|
|
Lead-free Process Compatible
|
Yes
|
N/A
|
N/A
|
N/A
|
N/A
|
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