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Home High Frequency PCB Rogers RT/Duroid 5880 62mil 1.575mm High Frequency PCB

Rogers RT/Duroid 5880 62mil 1.575mm High Frequency PCB


The extremely low dielectric loss makes it ideal for high frequency and wide band design applications that require minimal dispersion and loss.



  • Item NO.:

    BIC-023-v153.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$1.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Rogers RT/Duroid 5880 62mil 1.575mm High Frequency PCB for Commercial Aireline Broadband Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


The RT/ duroid 5880 HF board is manufactured from teflon glass fiber reinforced material. The dielectric constant of RT/ duroid 5880 is only 2.2 when measured at 10GHz operating frequency, which is significantly lower than that of similar materials on the market. Therefore, from the perspective of performance parameters and production cost, the plate is compared with similar products. It is more suitable for high-frequency design applications. Meanwhile, the dielectric loss of the plate is measured under the same standard, which is only 0.0009, The extremely low dielectric loss makes it ideal for high frequency and wide band design applications that require minimal dispersion and loss. It is mainly used in point-to-point digital radio antennas, microstrip and ribbon circuits, millimeter wave applications, missile guidance systems, military radar systems, and high frequency circuit boards for commercial aviation phones.


RT 5880 PCB 62mil


RT/ duroid 5880 HF board features:


1. Very low dielectric constant, measured at 10GHz, dielectric constant is 2.20+0.02; 2.

2. Very low dielectric loss, measured at 10GHz, the dielectric loss factor is 0.0009;



Typical Applications:


Rogers 5870, 5880 PCB


PCB Specifications:


PCB SIZE 135 x 95mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 35µm(1 oz)+plate TOP layer
RT/duroid 5880 1.575mm
copper ------- 35µm(1oz) + plate  BOT Layer
TECHNOLOGY
Minimum Trace and Space: 8 mil / 7 mil
Minimum / Maximum Holes: 0.4 mm / 4.5 mm
Number of Different Holes: 4
Number of Drill Holes: 87
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy:  RT/duroid 5880 1.575mm
Final foil external:  1.0 oz
Final foil internal:  N/A
Final height of PCB:  1.6 mm ±0.16
PLATING AND COATING
Surface Finish Immersion gold
Solder Mask Apply To:  N/A
Solder Mask Color:  N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo:  N/A
VIA Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


Data Sheet of Rogers 5880 (RT/duroid 5880):


RT/duroid 5880 Typical Value
Property RT/duroid 5880 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.20
2.20±0.02 spec.
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign 2.2 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0004
0.0009
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε -125 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
(cal/g/c)
N/A Calculated
Tensile Modulus Test at 23℃ Test at 100℃ N/A MPa(kpsi) A ASTM D 638
1070(156) 450(65) X
860(125) 380(55) Y
Ultimate Stress 29(4.2) 20(2.9) X
27(3.9) 18(2.6) Y
Ultimate Strain 6 7.2 X %
4.9 5.8 Y
Compressive Modulus 710(103) 500(73) X MPa(kpsi) A ASTM D 695
710(103) 500(73) Y
940(136) 670(97) Z
Ultimate Stress 27(3.9) 22(3.2) X
29(5.3) 21(3.1) Y
52(7.5) 43(6.3) Z
Ultimate Strain 8.5 8.4 X %
7.7 7.8 Y
12.5 17.6 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.2 Z W/m/k 80℃ ASTM C 518
Coefficient of Thermal Expansion 31
48
237
X
Y
Z
ppm/℃ 0-100℃ IPC-TM-650 2.4.41
Td 500 N/A ℃TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel  31.2(5.5) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float
IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A



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