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Home High Frequency PCB Rogers RT/duroid 5880LZ High Frequency PCB 10mil 20mil 50mil 100mil RT5880LZ PCB

Rogers RT/duroid 5880LZ High Frequency PCB 10mil 20mil 50mil 100mil RT5880LZ PCB

The very low dielectric constant is uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness to Ku-band and above.

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Rogers RT/duroid 5880LZ High Frequency PCB 10mil 20mil 50mil and 100mil RT5880LZ PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RT/duroid 5880LZ laminates are unique PTFE composites, which are designed for exacting stripline and microstrip circuit applications. The unique filler results in a low density, lightweight material for high performance and weight sensitive applications.


1. Lowest dielectric constant of 2.00 +/- 0.04

2. Low dissipation factor ranging from .0021 to .0027 at 10GHz

3. Low Z-axis coefficient of thermal expansion at 40 ppm/°C

4. Lightweight / low density of 1.4 gm/cm sq.

5. Uniform electrical properties over a wide frequency range

6. Resistant to all solvents and reagents, hot or cold, normally used in etching or plating

Some Typical Applications:

1. Airborne antenna system

2. Lightweight feed networks

3. Military radar systems

4. Missile guidance systems

5. Point-to-point digital radio antennas

Our PCB Capability (RT/duroid 5880LZ):

PCB Capability (RT/duroid 5880LZ) 
PCB Material: Unique PTFE Composites
Designation: RT/Duroid 5880LZ
Dielectric constant: 2
Dissipation Factor 0.0021 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm)
Laminate thickness: 10mil (0.254mm), 20mil (0.508mm), 50mil (1.270mm), 100mil (2.540mm  )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

Typical Value of RT/duroid 5880LZ:

Property Typical Value RT/duroid® 5880LZ Direction Units Condition Test Method
Dielectric Constant er,Process 2.00 ± 0.04 Z 10 GHz/23°C IPC-TM-650,
Dielectric Constant er,Design 2.00 Z 8 GHz - 40 GHz Differential Phase Length Method
Dissipation Factor, tan  Typ: 0.0021               Max: 0.0027 Z 10GHz/23°C IPC-TM-650,
Thermal Coefficient of Dielectric Constant, er +20 Z ppm/°C -50°C to 150°C 10GHz IPC-TM-650,
Volume Resistivity 1.74 X 10^7 Mohm•cm C-96/35/90 IPC-TM-650,
Surface Resistivity 2.08 X 10^6 Mohm C-96/35/90 IPC-TM-650,
Electrical Strength 40 KV D48/50 IPC-TM-650, 2.5.6
Dimensional Stability -0.38 X,Y % IPC-TM-650, 2.4.39A
Moisture Absorption 0.31 % 24 hours/23°C IPC-TM-650,
Thermal Conductivity 0.33 Z W/m/°K 80°C ASTM C518
Coefficient of Thermal Expansion 54, 47 40 X,Y Z ppm/°C 0 to 150°C  IPC-TM-650, 2.4.41
TML 0.01 % ASTM E-595
CVCM 0.01
WVR 0.01
Density 1.4 gm/cm^3 ASTM D792
Copper Peel >4.0 pli IPC-TM-650, 2.4.8
Flammability V-O UL 94
Lead-Free Process Compatible YES







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