Rogers RT/duroid 5880LZ High Frequency PCB 10mil 20mil 50mil and 100mil RT5880LZ PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers RT/duroid 5880LZ laminates are unique PTFE composites, which are designed for exacting stripline and microstrip circuit applications. The unique filler results in a low density, lightweight material for high performance and weight sensitive applications.
Features:
1. Lowest dielectric constant of 2.00 +/- 0.04
2. Low dissipation factor ranging from .0021 to .0027 at 10GHz
3. Low Z-axis coefficient of thermal expansion at 40 ppm/°C
4. Lightweight / low density of 1.4 gm/cm sq.
5. Uniform electrical properties over a wide frequency range
6. Resistant to all solvents and reagents, hot or cold, normally used in etching or plating
Some Typical Applications:
1. Airborne antenna system
2. Lightweight feed networks
3. Military radar systems
4. Missile guidance systems
5. Point-to-point digital radio antennas
Our PCB Capability (RT/duroid 5880LZ):
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PCB Capability (RT/duroid 5880LZ)
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PCB Material:
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Unique PTFE
Composites
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Designation:
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RT/Duroid 5880LZ
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Dielectric constant:
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2
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Dissipation Factor
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0.0021 10GHz
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Layer count:
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Double Sided PCB, Multilayer PCB, Hybrid PCB
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Copper
weight:
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0.5oz (17 µm), 1oz (35µm)
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Laminate
thickness:
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10mil
(0.254mm), 20mil (0.508mm), 50mil (1.270mm), 100mil (2.540mm )
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PCB size:
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≤400mm X 500mm
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Solder mask:
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Green, Black, Blue,
Yellow, Red etc.
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Surface
finish:
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Bare
copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated
etc..
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Typical Value of RT/duroid 5880LZ:
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Property
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Typical Value
RT/duroid® 5880LZ
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Direction
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Units
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Condition
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Test Method
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Dielectric Constant er,Process
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2.00
± 0.04
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Z
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10
GHz/23°C
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IPC-TM-650,
2.5.5.5
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Dielectric Constant er,Design
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2.00
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Z
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8
GHz - 40 GHz
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Differential
Phase Length Method
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Dissipation Factor, tan
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Typ:
0.0021 Max: 0.0027
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Z
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10GHz/23°C
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IPC-TM-650,
2.5.5.5
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Thermal Coefficient of Dielectric Constant, er
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+20
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Z
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ppm/°C
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-50°C
to 150°C 10GHz
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IPC-TM-650,
2.5.5.5
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Volume Resistivity
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1.74
X 10^7
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Mohm•cm
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C-96/35/90
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IPC-TM-650,
2.5.17.1
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Surface Resistivity
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2.08
X 10^6
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Mohm
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C-96/35/90
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IPC-TM-650,
2.5.17.1
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Electrical Strength
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40
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KV
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D48/50
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IPC-TM-650,
2.5.6
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Dimensional Stability
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-0.38
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X,Y
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%
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IPC-TM-650,
2.4.39A
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Moisture Absorption
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0.31
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%
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24
hours/23°C
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IPC-TM-650,
2.6.2.1
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Thermal Conductivity
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0.33
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Z
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W/m/°K
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80°C
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ASTM
C518
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Coefficient of Thermal Expansion
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54,
47 40
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X,Y
Z
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ppm/°C
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0
to 150°C
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IPC-TM-650,
2.4.41
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Outgassing
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TML
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0.01
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%
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ASTM
E-595
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CVCM
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0.01
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WVR
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0.01
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Density
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1.4
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gm/cm^3
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ASTM
D792
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Copper Peel
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>4.0
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pli
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IPC-TM-650,
2.4.8
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Flammability
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V-O
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UL
94
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Lead-Free Process Compatible
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YES
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