TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold.
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description:
This is a type of double layer high frequency PCB which is built on 20mil TMM3 substrate. It’s with immersion gold, 1oz copper(finished). Green solder mask is printed on top layer and bottom layer is open to air. This mini PCB is manufactured as per IPC class 3, every 50 boards are packed for shipment. It’s for the application of patch antennas.
PCB Specifications:
|
PCB SIZE
|
35 x 51mm=1up
|
|
BOARD TYPE
|
Double
sided PCB
|
|
Number
of Layers
|
2 layers
|
|
Surface
Mount Components
|
YES
|
|
Through
Hole Components
|
NO
|
|
LAYER STACKUP
|
copper
------- 17um(0.5 oz)+plate TOP layer
|
|
TMM3 0.508mm
|
|
copper ------- 17um(0.5 oz) + plate BOT Layer
|
|
TECHNOLOGY
|
|
|
Minimum Trace and Space:
|
5
mil / 5 mil
|
|
Minimum
/ Maximum Holes:
|
0.40
mm / 2.50 mm
|
|
Number
of Different Holes:
|
3
|
|
Number
of Drill Holes:
|
3
|
|
Number
of Milled Slots:
|
0
|
|
Number
of Internal Cutouts:
|
no
|
|
Impedance
Control:
|
no
|
|
Number
of Gold finger:
|
0
|
|
BOARD
MATERIAL
|
|
|
Glass
Epoxy:
|
TMM3
0.508mm
|
|
Final
foil external:
|
1.0
oz
|
|
Final
foil internal:
|
N/A
|
|
Final
height of PCB:
|
0.68
mm ±0.1
|
|
PLATING AND COATING
|
|
|
Surface Finish
|
Immersion gold,
99%
|
|
Solder
Mask Apply To:
|
Top Layer
|
|
Solder
Mask Color:
|
Green
|
|
Solder
Mask Type:
|
N/A
|
|
CONTOUR/CUTTING
|
Routing
|
|
MARKING
|
|
|
Side of
Component Legend
|
N/A
|
|
Colour
of Component Legend
|
N/A
|
|
Manufacturer
Name or Logo:
|
N/A
|
|
VIA
|
Plated
through hole(PTH), minimum size 0.40mm.
|
|
FLAMIBILITY RATING
|
94V-0
|
|
DIMENSION TOLERANCE
|
|
|
Outline
dimension:
|
0.0059"
|
|
Board
plating:
|
0.0029"
|
|
Drill
tolerance:
|
0.002"
|
|
TEST
|
100%
Electrical Test prior shipment
|
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email
file, Gerber RS-274-X, PCBDOC etc
|
|
SERVICE AREA
|
Worldwide,
Globally.
|
Typical Applications:
1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems
Our PCB Capability(TMM3):
|
PCB Capability (TMM3)
|
|
PCB Material:
|
Ceramic,
Hydrocarbon, Thermoset Polymer Composites
|
|
Designation:
|
TMM3
|
|
Dielectric constant:
|
3.27
|
|
Layer count:
|
Double Layer, Multilayer, Hybrid PCB
|
|
Copper
weight:
|
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
|
|
PCB thickness:
|
15mil (0.381mm), 20mil (0.508mm), 25mil
(0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm),
100mil (2.54mm), 125mil (3.175mm),
150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm),
300mil (7.62mm), 500mil (12.7mm)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue,
Yellow, Red etc.
|
|
Surface
finish:
|
Bare
copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated
etc..
|
Data Sheet of TMM3:
|
TMM3
Typical Value
|
|
Property
|
TMM3
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric Constant,εProcess
|
3.27±0.032
|
Z
|
|
10 GHz
|
IPC-TM-650
2.5.5.5
|
|
Dielectric Constant,εDesign
|
3.45
|
-
|
-
|
8GHz to 40 GHz
|
Differential
Phase Length Method
|
|
Dissipation Factor (process)
|
0.002
|
Z
|
-
|
10
GHz
|
IPC-TM-650
2.5.5.5
|
|
Thermal Coefficient of dielectric constant
|
+37
|
-
|
ppm/°K
|
-55℃-125℃
|
IPC-TM-650
2.5.5.5
|
|
Insulation Resistance
|
>2000
|
-
|
Gohm
|
C/96/60/95
|
ASTM
D257
|
|
Volume Resistivity
|
2
x 109
|
-
|
Mohm.cm
|
-
|
ASTM
D257
|
|
Surface Resistivity
|
>9x 10^9
|
-
|
Mohm
|
-
|
ASTM
D257
|
|
Electrical
Strength(dielectric strength)
|
441
|
Z
|
V/mil
|
-
|
IPC-TM-650
method 2.5.6.2
|
|
Thermal Properties
|
|
Decompositioin Temperature(Td)
|
425
|
425
|
℃TGA
|
-
|
ASTM D3850
|
|
Coefficient of Thermal Expansion - x
|
15
|
X
|
ppm/K
|
0 to 140℃
|
ASTM E 831
IPC-TM-650, 2.4.41
|
|
Coefficient of Thermal Expansion - Y
|
15
|
Y
|
ppm/K
|
0
to 140℃
|
ASTM
E 831 IPC-TM-650, 2.4.41
|
|
Coefficient of Thermal Expansion - Z
|
23
|
Z
|
ppm/K
|
0
to 140℃
|
ASTM
E 831 IPC-TM-650, 2.4.41
|
|
Thermal Conductivity
|
0.7
|
Z
|
W/m/K
|
80℃
|
ASTM
C518
|
|
Mechanical Properties
|
|
Copper Peel Strength after Thermal Stress
|
5.7 (1.0)
|
X,Y
|
lb/inch (N/mm)
|
after solder float 1 oz. EDC
|
IPC-TM-650
Method 2.4.8
|
|
Flexural Strength (MD/CMD)
|
16.53
|
X,Y
|
kpsi
|
A
|
ASTM
D790
|
|
Flexural Modulus (MD/CMD)
|
1.72
|
X,Y
|
Mpsi
|
A
|
ASTM
D790
|
|
Physical Properties
|
|
Moisture Absorption (2X2)
|
1.27mm
(0.050")
|
0.06
|
-
|
%
|
D/24/23
|
ASTM D570
|
|
3.18mm (0.125")
|
0.12
|
|
Specific Gravity
|
1.78
|
-
|
-
|
A
|
ASTM
D792
|
|
Specific Heat Capacity
|
0.87
|
-
|
J/g/K
|
A
|
Calculated
|
|
Lead-Free Process Compatible
|
YES
|
-
|
-
|
-
|
-
|
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