Rogers 6006
High Frequency PCB on 25mil, 50mil and 75mil Coating Immersion Gold and Green
Mask for Ground Radar Warning
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
For electronic and microwave circuit
applications needing a high dielectric constant, RT/duroid® 6006 microwave
laminates are ceramic-PTFE composites. The dielectric constant for RT/duroid
6006 laminate is 6.15, whereas the dielectric constant for RT/duroid 6010LM
laminate is 10.2.
Microwave laminates made of RT/duroid 6006 are
stable and simple to fabricate. They offer strong thermal mechanical stability,
tight control over thickness and dielectric constant, and little moisture
absorption.
Both sides of RT/duroid 6006 laminates are
delivered covered in 14 oz. to 2 oz./ft2 (8.5 to 70 m) copper foil
electrodeposited. There are also options for copper foil cladding. It is
possible to specify thick aluminum, brass, or copper plate on one side.
Rogers RT/duroid 6006 microwave laminates are
ceramic-PTFE composites which are designed for electronic and microwave circuit
applications requiring a high dielectric constant. RT/duroid 6006 laminate is
available with a dielectric constant value of 6.15.
PCB Capability (RT/duroid 6006)
|
PCB Material:
|
Ceramic-PTFE
composite
|
|
Designator:
|
RT/duroid 6006
|
|
Dielectric
constant:
|
6.15 ±0.15 (process)
|
|
6.45 (design)
|
|
Layer count:
|
1 Layer, 2 Layer
|
|
Copper weight:
|
0.5oz (17 µm),
1oz (35µm), 2oz (70µm)
|
|
PCB thickness:
|
10mil (0.254mm),
25mil (0.635mm)
|
|
50mil (1.27mm),
75mil (1.90mm)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black,
Blue, Yellow, Red etc.
|
|
Surface finish:
|
Bare copper,
HASL, ENIG, Immersion Tin, Immersion Silver and OSP.
|
RT/duroid 6006 microwave laminates feature ease
of fabrication and stability in use. This property results in the possibility
of mass production and reducing the cost of goods. It has tight dielectric constant and
thickness control, low moisture absorption, and good thermal mechanical
stability.
Features and Benefits
|
1. High
dielectric constant for circuit size reduction
|
|
2. Low loss.
Ideal for operating at X-bank or below
|
|
3. Tight DK and
thickness control for repeatable circuit performance
|
The typical applications are aircraft collision
avoidance systems, ground radar warning systems, patch antennas, satellite
communications systems etc.
Appendix: Properties of RT/duroid 6006
laminates.
|
RT/duroid
6006 Typical Value
|
|
Property
|
RT/duroid 6006
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric
Constant,εProcess
|
6.15±0.15
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650
2.5.5.5 Clamped stripline
|
|
Dielectric Constant,εDesign
|
6.45
|
Z
|
|
8GHz to 40 GHz
|
Differential
Phase Length Method
|
|
Dissipation Factor,tanδ
|
0.0027
|
Z
|
|
10
GHz/A
|
IPC-TM-650
2.5.5.5
|
|
Thermal Coefficient of ε
|
-410
|
Z
|
ppm/℃
|
-50℃-170℃
|
IPC-TM-650
2.5.5.5
|
|
Volume Resistivity
|
7 x 107
|
|
Mohm.cm
|
A
|
IPC
2.5.17.1
|
|
Surface Resistivity
|
2 x 107
|
|
Mohm
|
A
|
IPC
2.5.17.1
|
|
Tensile Properties
|
ASTM D638 (0.1/min. strain rate)
|
|
Young's Modulus
|
627(91) 517(75)
|
X Y
|
MPa(kpsi)
|
A
|
|
Ultimate Stress
|
20(2.8) 17(2.5)
|
X Y
|
MPa(kpsi)
|
A
|
|
Ultimate Strain
|
12
to 13 4 to 6
|
X Y
|
%
|
A
|
|
Compressive Properties
|
|
ASTM D695 (0.05/min. strain rate)
|
|
Young's Modulus
|
1069
(115)
|
Z
|
MPa(kpsi)
|
A
|
|
Ultimate Stress
|
54(7.9)
|
Z
|
MPa(kpsi)
|
A
|
|
Ultimate Strain
|
33
|
Z
|
%
|
|
|
Flexural Modulus
|
2634
(382) 1951 (283)
|
X
|
MPa(kpsi)
|
A
|
ASTM D790
|
|
Ultimate Stress
|
38
(5.5)
|
X Y
|
MPa(kpsi)
|
A
|
|
Deformation under load
|
0.33 2.1
|
Z Z
|
%
|
24hr/50℃/7MPa 24hr/150℃/7MPa
|
ASTM
D261
|
|
Moisture Absorption
|
0.05
|
|
%
|
D48/50℃0.050"(1.27mm) thick
|
IPC-TM-650
2.6.2.1
|
|
Thermal Conductivity
|
0.49
|
|
W/m/k
|
80℃
|
ASTM
C518
|
Coefficient of Thermal Expansion
|
47
34
117
|
X
Y
Z
|
ppm/℃
|
23℃/50% RH
|
IPC-TM-650
2.4.41
|
|
Td
|
500
|
|
℃TGA
|
|
ASTM
D3850
|
|
Density
|
2.7
|
|
g/cm3
|
|
ASTM
D792
|
|
Specific Heat
|
0.97(0.231)
|
|
j/g/k
(BTU/ib/OF)
|
|
Calculated
|
|
Copper Peel
|
14.3 (2.5)
|
|
pli (N/mm)
|
after solder float
|
IPC-TM-650
2.4.8
|
|
Flammability
|
V-0
|
|
|
|
UL
94
|
|
Lead-free Process Compatible
|
Yes
|
|
|
|
|
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