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Home High Frequency PCB Rogers RT/Duroid 6006 Material PCB 25mil 50mil 75mil High Frequency Printed Circuit Board

Rogers RT/Duroid 6006 Material PCB 25mil 50mil 75mil High Frequency Printed Circuit Board

Microwave laminates made of RT/duroid 6006 are stable and simple to fabricate. 

  • Item NO.:

    BIC-062-v185.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Rogers 6006 High Frequency PCB on 25mil, 50mil and 75mil Coating Immersion Gold and Green Mask for Ground Radar Warning

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


For electronic and microwave circuit applications needing a high dielectric constant, RT/duroid® 6006 microwave laminates are ceramic-PTFE composites. The dielectric constant for RT/duroid 6006 laminate is 6.15, whereas the dielectric constant for RT/duroid 6010LM laminate is 10.2.


Microwave laminates made of RT/duroid 6006 are stable and simple to fabricate. They offer strong thermal mechanical stability, tight control over thickness and dielectric constant, and little moisture absorption.


Rogers 6006 PCB


Both sides of RT/duroid 6006 laminates are delivered covered in 14 oz. to 2 oz./ft2 (8.5 to 70 m) copper foil electrodeposited. There are also options for copper foil cladding. It is possible to specify thick aluminum, brass, or copper plate on one side.


Rogers RT/duroid 6006 microwave laminates are ceramic-PTFE composites which are designed for electronic and microwave circuit applications requiring a high dielectric constant. RT/duroid 6006 laminate is available with a dielectric constant value of 6.15.


PCB Capability (RT/duroid 6006)

PCB Material:

Ceramic-PTFE composite

Designator:

RT/duroid 6006

Dielectric constant:

6.15 ±0.15 (process)

6.45 (design)

Layer count:

1 Layer, 2 Layer

Copper weight:

0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

PCB thickness:

10mil (0.254mm), 25mil (0.635mm)

50mil (1.27mm), 75mil (1.90mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, Immersion Tin, Immersion Silver and OSP.


RT/duroid 6006 microwave laminates feature ease of fabrication and stability in use. This property results in the possibility of mass production and reducing the cost of goods.  It has tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.


\RT-duroid 6006 PCB Patch Antenna


Features and Benefits

1. High dielectric constant for circuit size reduction

2. Low loss. Ideal for operating at X-bank or below

3. Tight DK and thickness control for repeatable circuit performance


The typical applications are aircraft collision avoidance systems, ground radar warning systems, patch antennas, satellite communications systems etc.


Appendix: Properties of RT/duroid 6006 laminates.

RT/duroid 6006 Typical Value
Property RT/duroid 6006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.15 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped stripline
Dielectric Constant,εDesign 6.45 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0027 Z 10 GHz/A IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -410 Z ppm/℃ -50℃-170℃ IPC-TM-650 2.5.5.5
Volume Resistivity 7 x 107 Mohm.cm A IPC 2.5.17.1
Surface Resistivity 2 x 107 Mohm A IPC 2.5.17.1
Tensile Properties ASTM D638 (0.1/min. strain rate)
Young's Modulus 627(91)        517(75) X                           Y MPa(kpsi) A
Ultimate Stress 20(2.8)         17(2.5) X                    Y MPa(kpsi) A
Ultimate Strain 12 to 13                   4 to 6 X                    Y % A
Compressive Properties ASTM D695 (0.05/min. strain rate)
Young's Modulus 1069 (115) Z MPa(kpsi) A
Ultimate Stress 54(7.9) Z MPa(kpsi) A
Ultimate Strain 33 Z %
Flexural Modulus 2634 (382)      1951 (283) X MPa(kpsi) A ASTM D790
Ultimate Stress 38 (5.5)                X                    Y                MPa(kpsi) A
Deformation under load 0.33                     2.1 Z                    Z % 24hr/50℃/7MPa   24hr/150℃/7MPa ASTM D261
Moisture Absorption 0.05 % D48/50℃0.050"(1.27mm) thick IPC-TM-650 2.6.2.1
Thermal Conductivity 0.49 W/m/k 80℃ ASTM C518
Coefficient of Thermal Expansion
47
34
117
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.41
Td 500 ℃TGA ASTM D3850
Density 2.7 g/cm3 ASTM D792
Specific Heat 0.97(0.231) j/g/k
(BTU/ib/OF)
Calculated
Copper Peel 14.3 (2.5) pli (N/mm) after solder float IPC-TM-650 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes



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