RT/duroid 6035HTC PCB 2-layer 30mil 0.762mm ENIG No Solder Mask Black Silkscreen

RT/duroid 6035HTC PCB 2-layer 30mil0.762mmENIG No Solder Mask Black Silkscreen

For high-power RF and microwave systems—where thermal management and signal integrity make or break performance—the RT/duroid 6035HTC 2-Layer 30 mil PCB delivers purpose-built excellence. Engineered with Rogers RT/duroid 6035HTC ceramic-filled PTFE composite, this double-sided rigid PCB combines exceptional thermal conductivity, ultra-low dielectric loss, and IPC-Class 2 compliance, making it ideal for power amplifiers, couplers, and filters. It balances precision with cost-effectiveness, solving the most critical pain points of modern high-power design.

Core Material: Rogers RT/duroid 6035HTC

At its core, Rogers RT/duroid 6035HTC stands out as a premium laminate for high-power use. Unlike alumina-filled alternatives (which complicate drilling and raise costs), its advanced ceramic filler system enables easy drill-ability—cutting manufacturing expenses by 15–20%. Key material advantages include:

• 2.4x Higher Thermal Conductivity: 1.44 W/m/K (80°C) vs. standard RT/duroid 6000 series, ensuring rapid heat dissipation.
• Long-Term Thermal Stability: Paired with ED/reverse-treat copper foil, it resists degradation in continuous high-power operation.

PCB Construction

Every detail of the Rogers 6035HTC PCB’s construction is optimized for high-performance use, validated via 100% electrical testing pre-shipment.

PCB Stackup

The 2-layer stackup ensures even heat distribution and minimal warpage—critical for lead-free soldering and high-temperature use.

PCB Statistics

The 6035HTC PCB ’s component configuration supports dense, high-power designs while simplifying assembly.

Key Features & Benefits

• Stable High-Frequency Performance:  DK of 3.5±0.05 (10 GHz) and dissipation factor of 0.0013 minimize signal loss, critical for filters/couplers.
• Thermal Efficiency:  1.44 W/m/K conductivity lowers component temps by up to 20%, extending lifespan and reducing maintenance.
• Reliability:  0.06% moisture absorption, UL 94-V0 flammability, and lead-free compatibility ensure performance in harsh/regulated environments.
• Cost Savings:  Improved drill-ability cuts manufacturing costs, while 100% testing eliminates rework.

Typical Applications

This RT/duroid 6035HTC high frequency PCB excels in high-power scenarios, including:

• -High-power RF/microwave amplifiers (5G base stations, radar).
• -Power amplifiers, couplers, filters, and power dividers for aerospace, defense, and telecom.

Global Compliance & Availability

Adhering to IPC-Class 2 standards and using Gerber RS-274-X artwork, the PCB integrates seamlessly into global workflows. It is available worldwide, with fast delivery supported by a global supply chain.

Conclusion

The RT/duroid 6035HTC 30mil substrate PCB is a high-performance solution for engineers needing to balance power, thermal management, and cost. Its premium material, precision design, and global availability make it the trusted choice for high-power RF/microwave systems where failure is not an option.

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