Shengyi FR-4 S1000-2M Tg170°C Panasonic R-F777 Polyimide 4-Layer Rigid-Flex PCB
The 4-Layer Rigid-Flex PCB is constructed using the finest materials to ensure durability and optimal performance. The board comprises of Shengyi FR-4 S1000-2M Tg170°C and Panasonic R-F777 Polyimide, enabling it to operate flawlessly within a temperature range of -40℃ to +85℃.
Stackup:
The stackup of our 4-Layer Rigid-Flex PCB is carefully designed to deliver superior functionality and reliability. It consists of four layers with varying materials and copper thicknesses, ensuring efficient signal transmission and minimizing signal interference. The detailed stackup is as follows:
|
Layer
|
Material
|
Thickness (mm)
|
Copper Weight (μm)
|
|
Top
|
Copper Layer 1
|
0.035
|
35
|
|
Layer 2
|
S1000-2M FR-4 Core Dk4.4
|
0.565
|
-
|
|
Prepreg 106 Coverlay
|
0.025
|
-
|
|
|
Prepreg 1080 adhesive
|
0.025
|
-
|
|
|
Layer 3
|
Copper Layer 2
|
0.035
|
35
|
|
Polyimide adhesiveless
|
0.075
|
-
|
|
|
Layer 4
|
Copper Layer 3
|
0.035
|
35
|
|
Prepreg 1080 adhesive
|
0.025
|
-
|
|
|
Prepreg 106 coverlay
|
0.025
|
-
|
|
|
Layer 5
|
S1000-2M FR-4 Core Dk4.4
|
0.56
|
-
|
|
Bottom
|
Copper Layer 4
|
0.035
|
35
|
Construction Details:
The 4-Layer Rigid-Flex PCB is designed with meticulous attention to detail to meet the most demanding requirements of your projects. Here are the key features and specifications:
|
Construction Details
|
Specifications
|
|
Board Dimensions
|
63.3mm x 72.92mm
|
|
+/- 0.15mm
|
|
|
Minimum Trace/Space
|
4/5 mils
|
|
Minimum Hole Size
|
0.35mm
|
|
Blind Vias
|
None
|
|
Finished Board Thickness
|
Rigid Part: 1.6mm
|
|
Flexible Part: 0.243mm
|
|
|
Finished Cu Weight
|
Outer Layers: 1 oz
|
|
(1.4 mils)
|
|
|
Via Plating Thickness
|
20μm
|
|
Surface Finish
|
Immersion Gold
|
|
Top Silkscreen Color
|
White
|
|
Bottom Silkscreen Color
|
White
|
|
Top Solder Mask Color
|
Green
|
|
Bottom Solder Mask Color
|
Green
|
|
Impedance Requirement
|
50 ohm
|
|
Additional Features
|
EMI Film
|
|
Electrical Testing
|
100% prior to shipment
|
PCB Statistics:
The 4-Layer Rigid-Flex PCB offers ample space and connectivity for your electronic components. Here are some key statistics:
|
Construction Details
|
Specifications
|
|
Components
|
54
|
|
Total Pads
|
88
|
|
Thru Hole Pads
|
70
|
|
Top SMT Pads
|
18
|
|
Bottom SMT Pads
|
0
|
|
Vias
|
68
|
|
Nets
|
12
|
The combination of Shengyi FR-4 S1000-2M Tg170°C and Panasonic R-F777 Polyimide in our PCB ensures excellent thermal stability and reliability. The FR-4 High TG material provides superior mechanical strength and dimensional stability, while the polyimide offers flexibility and resistance to high temperatures and harsh environments. This combination of materials makes our PCB suitable for a wide range of applications, including automotive, aerospace, medical devices, and more.
The rigid sections provide stability and support for components and connectors, while the flexible sections allow for bending and folding, making it easier to fit the PCB into tight spaces or curved surfaces. This flexibility eliminates the need for additional connectors and cables, reducing assembly time, and enhancing the overall durability of your electronic devices.
High-Density Interconnects:
With a minimum trace/space width of 4/5 mils, our 4-Layer Rigid-Flex PCB allows for high-density routing and interconnection. This means you can pack more components onto the board, resulting in compact and space-efficient designs. The precise routing also helps maintain signal integrity and reduces the risk of crosstalk or noise interference.
By choosing 4-Layer Rigid-Flex PCB, you can expect a high-quality, durable, and versatile solution that meets your specific requirements. Whether you're working on consumer electronics, industrial applications, or any other electronic project, our PCB will deliver exceptional performance and reliability. Place your order today and experience the benefits of our advanced PCB
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