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Home High Frequency PCB TMM13i High Frequency 60mil 1.524mm Rogers Higher DK12.85 PCB With Immersion Gold

TMM13i High Frequency 60mil 1.524mm Rogers Higher DK12.85 PCB With Immersion Gold


The boards are manufactured as per IPC class 2 standard and 100% electrical tested before shipment. Every 25 boards are vacuum-packed for delivery.


  • Item NO.:

    BIC-160-v129.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Color:

    White
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

TMM13i High Frequency Printed Circuit Board 60mil 1.524mm Rogers Higher DK12.85 RF PCB With Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


General Description:


This type of high frequency PCB is made on Rogers TMM13i 60mil substrate. It’s a double sided board with immersion gold on pads, half ounces copper starts ending with 1oz copper. Green solder mask is printed on top side. 


PCB Specifications:


PCB SIZE 100 x 100mm=1up
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 17um(0.5 oz)+plate TOP layer
TMM13i 1.524mm
copper ------- 17um(0.5 oz) + plate  BOT Layer
TECHNOLOGY
Minimum Trace and Space: 4 mil / 5 mil
Minimum / Maximum Holes: 0.35 mm / 2.0 mm
Number of Different Holes: 8
Number of Drill Holes: 1525
Number of Milled Slots: 3
Number of Internal Cutouts: no
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy:  TMM13i 1.524mm
Final foil external:  1.0 oz
Final foil internal:  N/A
Final height of PCB:  1.6mm ±0.1
PLATING AND COATING
Surface Finish Immersion gold, 67%
Solder Mask Apply To:  Top Layer
Solder Mask Color:  Green
Solder Mask Type: LPI
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend Component Side
Colour of Component Legend White
Manufacturer Name or Logo:  Kuangshun
VIA Plated through hole(PTH), minimum size 0.35mm.
FLAMIBILITY RATING 94V-0
DIMENSION TOLERANCE
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


MM13i PCB bichengpcb


Typical Applications:


1. Chip testers

2. Dielectric polarizers and lenses

3. Filters and coupler

4. Global Positioning Systems Antennas

5. Patch Antennas

6. Power amplifiers and combiners

7. RF and microwave circuitry

8. Satellite communication systems


Our PCB Capability(TMM13i):


PCB Capability (TMM13i) 
PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation: TMM13i
Dielectric constant: 12.85
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm),  150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersin tin, Immersion silver, Pure gold plated etc..


Data Sheet of TMM13i:


TMM13i Typical Value
Property TMM13i Direction Units Condition Test Method
Dielectric Constant,εProcess 12.85±0.35 Z 10 GHz IPC-TM-650 2.5.5.5 
Dielectric Constant,εDesign 12.2 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.0019 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant -70 - ppm/°K -55℃-125℃ IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity - - Mohm.cm - ASTM D257
Surface Resistivity - - Mohm - ASTM D257
Electrical Strength(dielectric strength) 213 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850
Coefficient of Thermal Expansion - x 19 X ppm/K 0 to 140℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 19 Y ppm/K 0 to 140℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 20 Z ppm/K 0 to 140℃ ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity - Z W/m/K 80℃ ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 4.0 (0.7) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) - X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) - X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.16 - % D/24/23 ASTM D570
3.18mm (0.125") 0.13
Specific Gravity 3 - - A ASTM D792
Specific Heat Capacity - - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -



BICHNEG PCB WORKSHOP:


BICHNEG PCB WORKSHOP


BICHNEG PCB CERTIFICATION: 


BICHNEG PCB CERTIFICATION


BICHENG PCB MAIN COURIERS:


BICHENG PCB MAIN COURIERS



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