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This 12-Layer Megtron6 High-Speed PCB delivers the precision, reliability, and performance needed to push the boundaries of electronic innovation.
Item NO.:
BIC-432-v515.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
12-Layer Megtron6 -M6 High Speed PCB Panasonic R-5775G 2.0mm ENIG Resin-filled Capped Plating Via
Introducing the 12-Layer Megtron6 (M6) High-Speed PCB—an advanced rigid circuit board designed to redefine performance in high-frequency, low-loss electronic systems. Built with Panasonic’s premium M6 R-5775 laminate, this 2.12mm-thick PCB delivers exceptional signal integrity, thermal reliability, and mechanical stability, making it the ideal choice for 5G communication, automotive ADAS, data centers, and aerospace applications. Below is a comprehensive breakdown of its technical specifications, design optimizations, and core advantages.
PCB Construction Details
The High Speed PCB’s construction is precision-calibrated to support high-speed signal transmission, featuring industry-leading materials and manufacturing processes to ensure consistency and reliability.
|
Parameter |
Specification |
|
Layer Count |
12 layers |
|
Base Material |
Megtron6 (Panasonic R-5775G) |
|
Board Dimensions |
220mm x 60mm (1PCS) ±0.15mm |
|
Minimum Trace/Space |
3/3 mils |
|
Minimum Hole Size |
0.2mm |
|
Blind Vias |
None |
|
Finished Board Thickness |
2.12mm |
|
Finished Cu Weight |
Outer layers: 1oz (1.4 mils/35μm); Inner layers: 0.5oz (17μm) / 1oz (35μm) |
|
Via Plating Thickness |
25μm |
|
Surface Finish |
Electroless Nickle Immersion Gold (ENIG) |
|
Top Silkscreen |
White |
|
Bottom Silkscreen |
White |
|
Top Solder Mask |
Blue |
|
Bottom Solder Mask |
Blue |
|
Via Treatment |
0.2mm/0.4mm vias (resin-filled + capped plating) |
|
Quality Assurance |
100% Electrical test prior to shipment |
PCB Stackup
The 12-layer PCB stackup is meticulously engineered with M6 cores and R-5670 prepregs, optimizing dielectric thickness and copper distribution to enhance signal integrity and impedance control.
|
Layer Number |
Layer Type |
Material Specification |
Thickness |
|
L1 |
Copper Layer |
- |
35μm |
|
- |
Prepreg |
R-5670(G) 1080 (68%) X 1 |
81.4μm |
|
L2 |
Copper Layer |
- |
35μm |
|
- |
Core |
M6 R5775G(HVLP) |
75μm |
|
L3 |
Copper Layer |
- |
17μm |
|
- |
Prepreg |
R-5670(G) 3313 (59%) X 2 |
219.9μm |
|
L4 |
Copper Layer |
- |
17μm |
|
- |
Core |
M6 R5775G(HVLP) |
75μm |
|
L5 |
Copper Layer |
- |
17μm |
|
- |
Prepreg |
R-5670(G) 3313 (59%) X 2 |
216.5μm |
|
L6 |
Copper Layer |
- |
35μm |
|
- |
Core |
M6 R5775G(HVLP) |
400μm |
|
L7 |
Copper Layer |
- |
35μm |
|
- |
Prepreg |
R-5670(G) 3313 (59%) X 2 |
215.6μm |
|
L8 |
Copper Layer |
- |
17μm |
|
- |
Core |
M6 R5775G(HVLP) |
75μm |
|
L9 |
Copper Layer |
- |
17μm |
|
- |
Prepreg |
R-5670(G) 3313 (59%) X 2 |
219.8μm |
|
L10 |
Copper Layer |
- |
17μm |
|
- |
Core |
M6 R5775G(HVLP) |
75μm |
|
L11 |
Copper Layer |
- |
35μm |
|
- |
Prepreg |
R-5670(G) 1080 (68%) X 1 |
81.4μm |
|
L12 |
Copper Layer |
- |
35μm |
Precision Impedance Control
Consistent impedance is critical for high-speed signal integrity—this 12-layer M6 High Speed PCB features five tailored single-ended impedance configurations (50 ohm) to minimize signal reflection and attenuation:
Impedance-1: L1, 5.71mil trace, down reference to L2
Impedance-2: L3, 4.31mil trace, upper reference to L2 + down reference to L4
Impedance-3: L5, 4.71mil trace, upper reference to L4 + down reference to L7
Impedance-4: L8, 4.51mil trace, upper reference to L7 + down reference to L9
Impedance-5: L10, 4.31mil trace, upper reference to L9 + down reference to L11
PCB Statistics
The Megtron M6 PCB’s compact design accommodates a robust component layout, balancing density with assembly flexibility for diverse application needs.
|
Parameter |
Value |
|
Components |
159 |
|
Total Pads |
433 |
|
Thru Hole Pads |
145 |
|
Top SMT Pads |
137 |
|
Bottom SMT Pads |
151 |
|
Vias |
459 |
|
Nets |
12 |
Core Advantages: Megtron6 (M6) Material
At the heart of this PCB is Panasonic Megtron 6 R-5775 laminate—a high-performance copper-clad laminate (CCL) engineered for high-frequency reliability. Key material benefits include:
Typical Applications
This Panasonic Megtron6 PCB is purpose-built for industries demanding high-speed, low-loss performance:
Quality & Availability
Manufactured to IPC-Class-3 standards (the highest grade for electronic assemblies), this PCB supports Gerber RS-274-X artwork and is available for worldwide shipping. It undergoes rigorous testing to ensure compliance with industry benchmarks, making it a trusted choice for global OEMs and contract manufacturers.
Whether you’re designing next-gen 5G infrastructure, automotive safety systems, or high-performance computing hardware, the 12-Layer Megtron6 High-Speed PCB delivers the precision, reliability, and performance needed to push the boundaries of electronic innovation.
Would you like to adjust specific sections (e.g., emphasize certain applications, add technical drawings references, or refine impedance details)? Or need support with customizing the description for target markets (e.g., automotive vs. data centers)?
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