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Home Newly Shipped RF PCB 12-Layer Megtron6 -M6 High Speed PCB Panasonic R-5775G 2.0mm ENIG Resin-filled Capped Plating Via

12-Layer Megtron6 -M6 High Speed PCB Panasonic R-5775G 2.0mm ENIG Resin-filled Capped Plating Via

This 12-Layer Megtron6 High-Speed PCB delivers the precision, reliability, and performance needed to push the boundaries of electronic innovation.

  • Item NO.:

    BIC-432-v515.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


12-Layer Megtron6 -M6 High Speed PCB Panasonic R-5775G 2.0mm ENIG Resin-filled Capped Plating Via

 

Introducing the 12-Layer Megtron6 (M6) High-Speed PCB—an advanced rigid circuit board designed to redefine performance in high-frequency, low-loss electronic systems. Built with Panasonic’s premium M6 R-5775 laminate, this 2.12mm-thick PCB delivers exceptional signal integrity, thermal reliability, and mechanical stability, making it the ideal choice for 5G communication, automotive ADAS, data centers, and aerospace applications. Below is a comprehensive breakdown of its technical specifications, design optimizations, and core advantages.

 

PCB Construction Details

The High Speed PCB’s construction is precision-calibrated to support high-speed signal transmission, featuring industry-leading materials and manufacturing processes to ensure consistency and reliability.

 

Parameter

Specification

Layer Count

12 layers

Base Material

Megtron6 (Panasonic R-5775G)

Board Dimensions

220mm x 60mm (1PCS) ±0.15mm

Minimum Trace/Space

3/3 mils

Minimum Hole Size

0.2mm

Blind Vias

None

Finished Board Thickness

2.12mm

Finished Cu Weight

Outer layers: 1oz (1.4 mils/35μm); Inner layers: 0.5oz (17μm) / 1oz (35μm)

Via Plating Thickness

25μm

Surface Finish

Electroless Nickle Immersion Gold (ENIG)

Top Silkscreen

White

Bottom Silkscreen

White

Top Solder Mask

Blue

Bottom Solder Mask

Blue

Via Treatment

0.2mm/0.4mm vias (resin-filled + capped plating)

Quality Assurance

100% Electrical test prior to shipment

 

 

PCB Stackup

The 12-layer PCB stackup is meticulously engineered with M6 cores and R-5670 prepregs, optimizing dielectric thickness and copper distribution to enhance signal integrity and impedance control.

 

Layer Number

Layer Type

Material Specification

Thickness

L1

Copper Layer

-

35μm

-

Prepreg

R-5670(G) 1080 (68%) X 1

81.4μm

L2

Copper Layer

-

35μm

-

Core

M6 R5775G(HVLP)

75μm

L3

Copper Layer

-

17μm

-

Prepreg

R-5670(G) 3313 (59%) X 2

219.9μm

L4

Copper Layer

-

17μm

-

Core

M6 R5775G(HVLP)

75μm

L5

Copper Layer

-

17μm

-

Prepreg

R-5670(G) 3313 (59%) X 2

216.5μm

L6

Copper Layer

-

35μm

-

Core

M6 R5775G(HVLP)

400μm

L7

Copper Layer

-

35μm

-

Prepreg

R-5670(G) 3313 (59%) X 2

215.6μm

L8

Copper Layer

-

17μm

-

Core

M6 R5775G(HVLP)

75μm

L9

Copper Layer

-

17μm

-

Prepreg

R-5670(G) 3313 (59%) X 2

219.8μm

L10

Copper Layer

-

17μm

-

Core

M6 R5775G(HVLP)

75μm

L11

Copper Layer

-

35μm

-

Prepreg

R-5670(G) 1080 (68%) X 1

81.4μm

L12

Copper Layer

-

35μm

 

 

Precision Impedance Control

Consistent impedance is critical for high-speed signal integrity—this 12-layer M6 High Speed PCB features five tailored single-ended impedance configurations (50 ohm) to minimize signal reflection and attenuation:

 

Impedance-1: L1, 5.71mil trace, down reference to L2

Impedance-2: L3, 4.31mil trace, upper reference to L2 + down reference to L4

Impedance-3: L5, 4.71mil trace, upper reference to L4 + down reference to L7

Impedance-4: L8, 4.51mil trace, upper reference to L7 + down reference to L9

Impedance-5: L10, 4.31mil trace, upper reference to L9 + down reference to L11

 

 

PCB Statistics

The Megtron M6 PCB’s compact design accommodates a robust component layout, balancing density with assembly flexibility for diverse application needs.

 

Parameter

Value

Components

159

Total Pads

433

Thru Hole Pads

145

Top SMT Pads

137

Bottom SMT Pads

151

Vias

459

Nets

12

 

 12-Layer Megtron6 -M6 High Speed PCB 2.0mm Thick


Core Advantages: Megtron6 (M6) Material

At the heart of this PCB is Panasonic Megtron 6 R-5775 laminate—a high-performance copper-clad laminate (CCL) engineered for high-frequency reliability. Key material benefits include:


  • Stable dielectric constant (Dk): 3.4 at 1GHz/23°C, 3.34 at 13GHz
  • Ultra-low dissipation factor (Df): 0.002 at 1GHz/23°C, 0.0037 at 13GHz
  • Excellent thermal stability: Tg >185°C (DSC), 210°C (DMA); Td = 410°C (TGA)
  • Low coefficient of thermal expansion (CTE): X/Y = 16 ppm/°C, Z = 45 ppm/°C
  • RoHS/halogen-free compliance (green manufacturing)
  • Compatibility with standard FR-4 processing (no special equipment required)
  • UL 94V-0 flammability rating
  • Support for 4–30 layer designs (scalable for complex circuits)


 

Typical Applications

This Panasonic Megtron6 PCB is purpose-built for industries demanding high-speed, low-loss performance:

 


  • 5G Communication: Millimeter-wave antennas, AAU (Active Antenna Unit) RF front-ends
  • Automotive Electronics: 77GHz millimeter-wave radar, ADAS (Advanced Driver-Assistance Systems)
  • Data Centers: 400G/800G optical modules, high-speed server motherboards
  • Aerospace: Satellite communication, radar system high-frequency circuits
  • Consumer Electronics: Wi-Fi 6E/7 routers, AR/VR devices


  

Quality & Availability

Manufactured to IPC-Class-3 standards (the highest grade for electronic assemblies), this PCB supports Gerber RS-274-X artwork and is available for worldwide shipping. It undergoes rigorous testing to ensure compliance with industry benchmarks, making it a trusted choice for global OEMs and contract manufacturers.

 

 

Whether you’re designing next-gen 5G infrastructure, automotive safety systems, or high-performance computing hardware, the 12-Layer Megtron6 High-Speed PCB delivers the precision, reliability, and performance needed to push the boundaries of electronic innovation.

 

Would you like to adjust specific sections (e.g., emphasize certain applications, add technical drawings references, or refine impedance details)? Or need support with customizing the description for target markets (e.g., automotive vs. data centers)?

 

 




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