4-Layer F4BTMS450 PCB 1.4mm ENIG Wangling F4BTMS Series High Frequency PTFE Substrate

4-Layer F4BTMS450 PCB 1.4mm ENIG Wangling F4BTMS Series High Frequency PTFE Substrate

Introducing the 4-Layer F4BTMS450 PCB—an engineering breakthrough designed for mission-critical systems requiring uncompromised performance, dimensional stability, and thermal resilience. Built on the advanced F4BTMS450 material (an upgraded iteration of theF4BTM series), this 1.4mm-thick rigid PCB combines aerospace-grade reliability with precision manufacturing, making it a direct replacement for premium foreign alternatives. Ideal for microwave, RF, radar, and satellite communication systems, it delivers exceptional signal integrity across extreme temperatures and high-frequency ranges. Below is a comprehensive breakdown of its technical specifications, material advantages, and application capabilities.

PCB Construction Details

The F4B DK4.5 PCB ’s construction is optimized for high-reliability scenarios, with tight tolerances and performance-focused parameters outlined in the table below:

PCB Stackup

The 4-layer F4BTMS450 PCB stackup is engineered to minimize signal loss and enhance thermal conductivity, utilizing F4BTMS450 cores and RO4450F prepregs for optimal performance:

PCB Statistics

The streamlined design balances functionality and precision, with key connectivity and component metrics summarized below:

Core Material: F4BTMS450 Advantage

The F4BTMS450 PCB substrate represents a leap forward in composite technology, building on theF4BTM series with enhanced formulation and manufacturing processes. Infused with high concentrations of special nano-ceramics and reinforced with ultra-thin, ultra-fine glass fiber cloth, it minimizes the negative impact of glass fiber on electromagnetic wave propagation—reducing dielectric loss, improving dimensional stability, and lowering X/Y/Z anisotropy. This innovation expands the usable frequency range, boosts electrical strength, and enhances thermal conductivity, while delivering a low thermal expansion coefficient and stable dielectric temperature characteristics. Standard-equipped RTF low-roughness copper foil reduces conductor loss and ensures excellent peel strength, compatible with both copper and aluminum bases.

Key Performance Features

1) Dielectric Stability: Dk of 4.5±0.09 at 10GHz, with ultra-low dissipation factors (0.0015 at 10GHz, 0.0019 at 20GHz) for minimal signal attenuation.

2) Thermal Resilience: CTE of 12 ppm/°C (x/y-axis) and 45 ppm/°C (z-axis) across -55°C to 288°C, paired with a low Dk thermal coefficient (-58 ppm/°C) for consistent performance in extreme temperatures.

3) Reliability: UL-94 V0 flammability rating, 0.64 W/MK thermal conductivity, and 0.08% moisture absorption—ideal for harsh aerospace and military environments.

4) Precision Manufacturing: Tight dimensional tolerance (±0.15mm), 4/5 mils trace/space, and 0.3mm minimum hole size ensure compatibility with high-density assemblies.

Typical Applications

This F4BTMS450 High Frequency PTFE PCB is purpose-built for demanding industries, including:

• Aerospace and cabin equipment
• Microwave and RF systems
• Military radar and phased array antennas
• Satellite communications and feed networks
• Mission-critical high-frequency devices

 Quality & Availability

Manufactured to IPC-Class-2 standards, each PCB undergoes 100% electrical testing to ensure zero defects. Supported by Gerber RS-274-X artwork files for seamless manufacturing integration, it is available worldwide—offering a cost-effective, high-performance alternative to foreign-sourced PCBs.

Whether you’re designing next-generation radar systems or satellite communication hardware, the 4-Layer F4BTMS450 PTFE ENIG PCB delivers the reliability, signal integrity, and thermal stability required for mission-critical operations. For customized quotes, technical support, or sample requests, please contact our sales team to discuss your specific application needs.