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Home Newly Shipped RF PCB 16-layer S1000-2M TG180 FR-4 Material 3oz Heavy Copper PCB With HASL LF

16-layer S1000-2M TG180 FR-4 Material 3oz Heavy Copper PCB With HASL LF

The 16-layer Heavy Copper PCB is not a standard circuit board; it is a robust electromechanical platform.

  • Item NO.:

    BIC-486-v572.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


16-layer S1000-2M TG180 FR-4 Material 3oz Heavy Copper PCB With HASL LF

 

This 16-layer Printed Circuit Board engineered for mission-critical applications requiring exceptional current-handling capacity, robust thermal management, and unwavering structural integrity in harsh operating environments. Fabricated on the high-performance S1000-2M TG180 substrate and featuring a uniform 3oz (105µm) copper weight on all layers, this board represents the pinnacle of power distribution and dense interconnection design.

 

Designed to exceed the demands of next-generation computing, high-power communication infrastructure, and ruggedized automotive systems, this PCB integrates the durability of heavy copper with the dimensional stability ofadvanced FR-4 materials. Its construction ensures reliable operation under sustained thermal load and mechanical stress, making it perfectly suited for lead-free assembly processes and long-lifecycle products.

 

PCB Construction

The following table summarizes the core physical and manufacturing parameters that define the board's construction and quality assurance standards.

 

Parameter

Specification

Base Material

S1000-2M TG180

Layer Count

16 layers

Board Dimensions

72mm × 93mm per PCS, tolerance ±0.15mm

Minimum Trace/Space

4/6 mils

Minimum Hole Size

0.3mm

Blind/Buried Vias

No blind vias

Finished Board Thickness

6.7mm

Finished Copper Weight

3oz per layer (all layers)

Via Plating Thickness

20 μm

Surface Finish

Lead-Free HASL (HASL LF)

Top Silkscreen

White

Bottom Silkscreen

White

Top Solder Mask

Green

Bottom Solder Mask

Green

Electrical Test

100% electrical test prior to shipment

 

 

16-Layer Heavy Copper PCB Stackup

The stackup is engineered for optimal signal integrity, power plane decoupling, and mechanical symmetry to prevent warpage. The uniform3oz copper cladding is a defining feature across all conductive layers.

 

 16-layer Heavy Copper PCB Stackup

 

Core Material: S1000-2M TG180 High-Performance Laminate

The foundation of this PCB is the Shengyi S1000-2M material, a multi-functional epoxy resin system reinforced with glass fabric. This material is specifically formulated for high-layer-count and high-reliability applications.

 


Key Features of S1000-2M Material: 


  • Superior Thermo-Mechanical Reliability: Its lower Z-axis Coefficient of Thermal Expansion (CTE) minimizes stress on plated through-holes during thermal cycling, ensuring excellent through-hole reliability and preventing barrel cracking.
  • Exceptional Environmental Resistance: Demonstrates excellent Pressure Cooker Test (PCT) performance and low water absorption, leading to high resistance to heat, humidity, and long-term exposure to harsh conditions.
  • Enhanced Processibility & Lead-Free Compatibility: Offers excellent mechanical processibility (drilling, routing) and high thermal resistance, making it fully compatible with demanding lead-free (RoHS) assembly processes that involve higher reflow temperatures. 



S1000-2M Data Sheet

 

Test Items

Test Method

Test Condition

Unit

Typical Value

Tg

IPC-TM-650 2.4.24.4

DMA

185

IPC-TM-650 2.4.25D

DSC

180

 

Td

IPC-TM-650 2.4.24.6

TGA (5% W.L)

355

T260

IPC-TM-650 2.4.24.1

TMA

min

>60

T288

IPC-TM-650 2.4.24.1

TMA

min

30

T300

IPC-TM-650 2.4.24.1

TMA

min

15

Thermal Stress

IPC-TM-650 2.4.13.1

288℃, solder dip

s

>100

CTE (Z-axis)

IPC-TM-650 2.4.24

Before Tg

ppm/℃

41

IPC-TM-650 2.4.24

After Tg

ppm/℃

208

 

IPC-TM-650 2.4.24

50-260℃

%

2.4

 

Permittivity (1GHz)

IPC-TM-650 2.5.5.9

C-24/23/50

-

4.6

Loss Tangent (1GHz)

IPC-TM-650 2.5.5.9

C-24/23/50

-

0.018

Volume Resistivity

IPC-TM-650 2.5.17.1

C-96/35/90

MΩ-cm

8.7×108

Surface Resistivity

IPC-TM-650 2.5.17.1

C-96/35/90

2.2×107

Arc Resistance

IPC-TM-650 2.5.1

D-48/50+D-0.5/23

s

133

Dielectric Breakdown

IPC-TM-650 2.5.6

D-48/50+D-0.5/23

kV

>45

Peel Strength (1oz)

IPC-TM-650 2.4.8

288℃/10s

N/mm [lb/in]

1.3 [7.43]

Flexural Strength (LW/CW)

IPC-TM-650 2.4.4

A

Mpa

567/442

Water Absorption

IPC-TM-650 2.6.2.1

D-24/23

%

0.08

Flammability

UL94

C-48/23/50

Rating

V-0

CTI

IEC60112

A

Rating

PLC 3

 

 

Typical Applications for S1000-2M

This material is the substrate of choice for high-layer-count PCBs where reliability is non-negotiable. It is widely deployed in:


  • Computing: High-end servers, routers, and data storage systems.
  • Communication: Base station power amplifiers, network switching backplanes.
  • Automotive Electronics: Under-the-hood control units, power inverters for EVs, and ADAS systems.
  • Industrial & Power Electronics: Motor drives, UPS systems, and power converters.


 

 

The Advantage of Heavy Copper Construction

What is Heavy Copper?

Traditionally, PCBs use 1oz (35µm) or 2oz (70µm) copper. Heavy Copper technically refers to copper weights of 3oz (105µm) and above per square foot. This board utilizes a significant 3oz weight on every layer.

 


Functions and Benefits:

1) High Current Carrying Capacity: The primary function. Cross-sectional area increases linearly with copper weight, drastically reducing trace resistance. This allows the board to conduct tens or hundreds of amperes without overheating or excessive voltage drop.

 

2) Enhanced Thermal Management: The thick copper layers act as an embedded heat spreader, conducting heat away from hot components (like MOSFETs, regulators) and distributing it across the board, reducing hotspot temperatures and improving system reliability.

 

3) Increased Mechanical Strength: Heavy copper adds structural rigidity to the PCB, particularly at connector points and in through-hole pads, increasing durability in high-vibration environments.

 

4) Space Efficiency: Instead of using wide, thin traces or external bus bars for high-power paths, heavy copper allows for more compact, efficient routing of power traces, saving valuable board space.

 


Application Domains for Heavy Copper PCBs:


  • Power Conversion & Distribution
  • Automotive & Electric Vehicles
  • Renewable Energy
  • Industrial Equipment
  • Aerospace & Defense


 

Conclusion

The 16-layer Heavy Copper PCB is not a standard circuit board; it is a robust electromechanical platform. By marrying the exceptional stability and reliability of S1000-2M TG180 material with the formidable current and thermal performance of all-layer 3oz heavy copper, this product is engineered to empower the most demanding power-dense and reliability-critical electronic systems on the market today.

 





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