2-layer F4BM220 0.8mm Thick PCB DK2.2 F4BM Series Substrates Immersion Gold with White Legend Blue Mask

2-layer F4BM220 0.8mm Thick PCB DK2.2 F4BM Series Substrates Immersion Gold with White Legend Blue Mask

1. Introduction

In the rapidly evolving field of high-frequency electronics, the demand for reliable, low-loss printed circuit boards (PCBs) is critical. The F4BM220 PCB (0.8mm thickness, double-sided) is engineered to meet the stringent requirements of RF, microwave, and high-speed digital applications. With its ultra-low dielectric constant (Dk 2.2 PCB) and minimal dissipation factor (Df = 0.001), this F4B PCB ensures superior signal integrity, reduced insertion loss, and enhanced thermal stability.

Manufactured using Wangling F4BM220 laminate, this board is an advanced PTFE-based material optimized for high-frequency performance, low passive intermodulation (PIM), and excellent dimensional stability. It is an ideal choice for 5G infrastructure, satellite communications, radar systems, and aerospace applications.

2. PCB Construction & Technical Specifications

Quality Standard: IPC-Class-2 (Reliable for commercial & industrial applications)

Artwork Format: Gerber RS-274-X (Industry-standard for PCB fabrication)

3. F4BM220 Laminate–Key Features & Benefits

3.1 Advanced Material Properties

The F4BM220 substrate is a high-performance PTFE composite engineered for low-loss, high-frequency applications. Key characteristics include:

3.2 Comparison with Standard PTFE Materials

Unlike conventional FR4 or standard PTFE laminates, F4BM220 offers:

✔Lower dielectric loss–Minimizes signal attenuation in high-frequency circuits

✔Better thermal stability–Reduced CTE mismatch prevents warping & delamination

✔Superior PIM performance (when paired with RTF copper in F4BME220 variant)

✔Optimized for high-power RF applications–Handles high-frequency signals with minimal distortion

4. PCB Stackup & Design Considerations

4.1 Layer Stackup (2-Layer Configuration)

4.2 Key Design Recommendations

-Impedance Control: Due to the stable Dk, impedance matching is highly predictable.

-Thermal Management: The low CTE ensures minimal expansion under thermal cycling.

-High-Frequency Optimization: Ideal for microstrip/stripline RF designs.

5. Applications of F4BM220 PCB

This F4BM220 F4B high frequency PCB is optimized for high-frequency, low-loss applications, including:

✅5G & mmWave Infrastructure (Antennas, Beamforming Networks)

✅Satellite Communication (SATCOM) Systems

✅Radar & Defense Electronics (Phased Array Antennas, Radar Modules)

✅RF Power Amplifiers & Couplers

✅Microwave Filters & Phase Shifters

✅Base Station Antennas & Feed Networks

6. Why Choose This PCB?

6.1 Performance Advantages

✔Ultra-Low Loss: Minimizes signal degradation in RF/microwave circuits

✔High Thermal Stability: Reliable operation in extreme environments

✔Precision Manufacturing: Tight tolerances ensure consistency

✔Global Availability: Shipped worldwide with strict quality control

6.2 Competitive Edge Over Alternatives

7. Conclusion

The F4BM220 0.8mm PCB double-sided is a high-performance RF/microwave circuit board designed for low-loss, high-frequency applications. With its ultra-stable dielectric properties, excellent thermal resistance, and precision manufacturing, it is an optimal choice for 5G, aerospace, defense, and satellite communications.

For engineers and designers seeking reliable, high-frequency PCBs with minimal signal loss, this F4BM Series board delivers superior electrical performance, durability, and design flexibility.

Available for immediate order–Contact us for pricing & lead times!