High
Frequency PCB Built on Shengyi SCGA-500 GF265 PTFE with Glass Reinforced RF
Circuit Materials
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
Brief Introduction
SCGA-500
GF265 from Shengyi Technology Co., Ltd (SYTECH) is low loss PTFE woven glass UL
94 V-0 high frequency circuit material. It has been designed for use in many of
today’s demanding and highly challenging RF/Microwave design platforms.
Its
controlled dielectric constant provides excellent electrical and mechanical
properties with a consistent and stable DK (2.55Dk +/- 0.04) and dissipation factor
(0.0014) over a wide range of frequencies (1GHz to 20 GHz) and Temperatures
(-40 °C to +125 °C).
It
exhibits exceptional dimensional stability, chemical resistance, low moisture
absorption and copper peel strength. Passive Inter-Modulation (PIM) performance
values -163 dBc are typical (RTF and VLP type copper foils).
Features
1.Consistent and Stable Dk/Df over
Frequency and Temperature
2.Low Dielectric Loss Tangent
3.Excellent Price Performance Value
Typical
applications
1.Base Station Antennas
2.Power Amplifiers
3.Satellite Communications
4.DAS and CPE Antenna
5.Automotive Radar and Wireless
Communications.
PCB
Capability
|
PCB Capability (SCGA-500 GF265)
|
|
PCB Material:
|
PTFE Woven
Glass
|
|
Designation:
|
SCGA-500 GF265
|
|
Dielectric constant:
|
2.65 (10 GHz)
|
|
Dissipation factor
|
0.0017 (10 GHz)
|
|
Layer count:
|
Double Sided PCB, Multilayer PCB, Hybrid PCB
|
|
Copper
weight:
|
1oz (35µm), 2oz (70µm)
|
|
Dielectric thickness
|
10mil
(0.254mm), 20mil (0.508mm), 30mil (0.762mm),
40mil (1.016mm), 50mil (1.270mm), 60mil (1.524mm)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue,
Yellow, Red etc.
|
|
Surface
finish:
|
Bare
copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated
etc..
|
Our
Advantages
1.ISO9001, ISO14001, ISO13485, UL
certified manufacturing factory;
2.Powerful PCB capabilities support your
research and development, sales and marketing;
3.Any Layer HDI PCBs;
4.16000㎡workshop; 30000㎡output capability per month; 8000 types of PCB's per
month;
5.More than 19+ years of high frequency
PCB experience;
6.No MOQ, low cost for prototypes and
small runs quantity;
7.Prototype PCB capability to Volume
Production capability;
8.Delivery on time: >98% ; Customer
complaint rate: <1%
9.IPC Class 2 / IPC Class 3;
Appendix:
General Properties of SCGA-500
|
SCGA-500
General Properties
|
|
Items
|
Typical Value
GF220
|
Typical Value
GF255
|
Typical Value
GF265
|
Typical Value
GF300
|
Unit
|
Method
|
Test Condition
|
|
Dielectric Constant
|
2.2±0.02
|
2.55±0.04
|
2.65±0.04
|
3.00±0.04
|
-
|
IPC-TM-650
2.5.5.5
|
10GHz/23℃
|
|
Process Dk
|
|
Dissipation factor (Loss Tangent)
|
0.0009
|
0.0014
|
0.0017
|
0.0023
|
-
|
IPC-TM-650
2.5.5.5
|
10GHz/23℃
|
|
TcDK
|
-110
|
-70
|
-60
|
-25
|
ppm/℃
|
IEC
61189-2-721
|
10GHz (-40-150℃)
|
|
CTE (X/Y/Z-axis)
|
41/30/217
|
8.2/7.9/145
|
9.2/8.8/118
|
6.2/8.6/95
|
ppm/℃
|
IPC-TM-650
2.4.24
|
TMA (30-260℃)
|
|
Volume Resistivity
|
1.5*108
|
1.5*108
|
1.2*108
|
1.3*108
|
MΩ·cm
|
IPC-TM-650
2.5.17.1
|
A
|
|
Surface Resistivity
|
8.8*107
|
1.6*108
|
1.3*108
|
1.4*108
|
MΩ
|
IPC-TM-650
2.5.17.1
|
A
|
|
Peel Strength
|
1.2
[6.86]
|
1.2
[6.86]
|
1.2
[6.86]
|
1.2
[6.86]
|
N/mm
[lb/in]
|
IPC-TM-650
2.4.8
|
288℃/10s
|
|
Water Absorption
|
0.007
|
0.007
|
0.007
|
0.01
|
%
|
IPC-TM-650
2.6.2.1
|
D-24/23
|
|
Thermal Conductivity
|
0.27
|
0.29
|
0.28
|
0.28
|
W/(m·K)
|
ASTM
C518
|
100℃
|
|
Tensile Modulus (LW/CW)
|
1.9/2.6
|
1.27/7.8
|
1.9/6.8
|
7.9/8.8
|
GPa
|
IPC-TM-650
2.4.4
|
A
|
|
Tensile Strength (LW/CW)
|
60/76
|
64/214
|
60/212
|
254/279
|
MPa
|
IPC-TM-650
2.4.4
|
A
|
|
Density
|
2.18
|
2.25
|
2.22
|
2.27
|
g/cm3
|
ASTM
D792
|
-
|
|
Flammability
|
V-0
|
V-0
|
V-0
|
V-0
|
Rating
|
UL-94
|
C-48/23/50
|
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