30mil RT/Duroid 6002 Double Sided Rogers PCB Immersion Silver Finish Bare Copper

30mil RT/Duroid 6002Double Sided Rogers PCB Immersion Silver Finish Bare Copper

This is 2-layer rigid high-frequency PCB built on 30mil Rogers RT/duroid 6002 ceramic-filled PTFE laminate withimmersion silver surface finish. Designed for mission-critical microwave, RF, aerospace, and radar applications, this 30mil Rogers PCB combines ultra-stable electrical performance, tight mechanical tolerances, and robust thermal reliability. It is manufactured to IPC-Class-2 standards, fully electrically tested, and optimized for high-frequency signal integrity across wide temperature ranges. The description is structured into two distinct sections: PCB Product Overview (with tabulated specifications) and RT/duroid 6002 CCL Technical Deep Dive (with detailed material knowledge, tables, and image notes).

1. PCB Product Overview

This high-performance PCB is purpose-built for applications demanding minimal signal loss, stable dielectric properties, and excellent dimensional stability under thermal cycling. It uses Rogers RT/duroid 6002 as the core substrate, a industry-leading low-loss microwave laminate, and features immersion silver surface finish for consistent solderability and conductivity without solder mask or silkscreen layers. The Rogers 6002 board supports high-density component mounting with fine features and reliable plated through-holes, making it ideal for phased array antennas, radar systems, GPS antennas, beamforming networks, and high-reliability aerospace circuits.

1.1 PCB Construction

The following table lists all critical mechanical, fabrication, and surface finish parameters that define theRogersboard’s build quality and process consistency.

1.2 PCB Stackup

The symmetrical stackup ensures balanced electrical performance, minimal warpage, and reliable interlayer connection.

1.3 PCB Layout & Circuit Statistics

This table summarizes component, pad, via, and net data for assembly and design verification.

1.4 PCB Functional Advantages

1)Ultra-Low High-Frequency Loss: RT/duroid 6002 delivers a dissipation factor of only 0.0012 at 10 GHz, preserving signal strength and efficiency in GHz-range circuits.

2)Stable Dielectric Performance: Dielectric constant Dk = 2.94±0.04 with an extremely low thermal coefficient of 12 ppm/°C, ensuring consistent impedance and phase stability over temperature.

3)Superior Thermal Reliability: In-plane CTE closely matched to copper minimizes thermally induced stress; low Z-axis CTE preserves via integrity during thousands of thermal cycles.

4)High Reliability Vias: Plated through-holes with 20μm copper plating withstand extreme thermal cycling without cracking or delamination.

5)Optimized for Microwave Assemblies: No solder mask or silkscreen eliminates unwanted dielectric loading and parasitic effects in high-frequency routing.

6)Immersion Silver Finish: Provides flat, uniform, and solder-friendly surfaces with excellent conductivity and corrosion resistance.

7)Tight Manufacturing Control: Precise substrate thickness control, fine 6/7 mil line/space capability, and 0.3 mm minimum holes support compact, high-density layouts.

1.5 Target Applications

This RT/duroid 6002 high frequency PCB is engineered for the most demanding high-frequency systems:

• Phased Array Antennas
• Ground-Based & Airborne Radar Systems
• GPS & Satellite Communication Antennas
• Beamforming Networks
• Avionics & Collision Avoidance Systems
• High-Reliability Power Backplanes
• Military & Aerospace Microwave Assemblies

2. RT/duroid 6002 Copper Clad Laminate (CCL)–Technical Deep Dive

This section provides detailed, professional knowledge about Rogers RT/duroid 6002 high-frequency CCL, including material composition, key properties, performance benefits, manufacturing compatibility, and typical use cases. Content is separated from PCB design and focuses on laminate fundamentals for engineers, buyers, and quality teams.

2.1 Material Introduction

RT/duroid 6002 is a flagship high-frequency laminate developed by Rogers Corporation, USA. It is a ceramic-filled PTFE-based composite engineered specifically for microwave and RF applications where low loss, stable Dk, and robust mechanical performance are non-negotiable. As one of the industry’s first fully optimized low-Dk,low-loss laminates, it set benchmarks for electrical stability and mechanical reliability in complex multilayer and high-frequency structures.

2.2 Core Material Composition

• Matrix: High-purity PTFE (Teflon)
• Reinforcement: Ceramic filler for improved dimensional stability, thermal conductivity, and mechanical strength
• Cladding: Electrodeposited copper foil (standard½oz to 2 oz); optional rolled copper, aluminum, brass, or resistive foils
• Structure: Non-woven composite for uniform electrical properties across the panel

2.3 Key Electrical & Mechanical Properties (Full Table)

2.4 Material Performance Benefits

1)Ultra-Low Loss at High Frequencies

Dissipation factor as low as 0.0012 @10 GHz enables efficient power delivery, minimal insertion loss, and extended operating range in radar, satellite, and 5G/mmWave systems.

2)Exceptional Temperature Stability

Extremely low Dk thermal coefficient ensures consistent electrical performance from-55°C to +150°C, critical for filters, oscillators, and delay lines in harsh environments.

3)Excellent Dimensional Stability

X/Y-axis CTE closely matched to copper reduces thermal stress, warpage, and registration shift during processing and operation, eliminating the need for double etching in high-precision designs.

4)Superior Plated Via Reliability

Low Z-axis CTE minimizes via barrel stress during thermal cycling. Tested to >5000 cycles between-55°C and 125°C with zero via failures Rogers Corporation.

5)Low Outgassing & Space Compatibility

Very low volatile content makes it suitable for high-vacuum and space applications where contamination must be avoided.

6)Low Moisture Absorption

At only 0.02%, the material remains electrically stable even in high humidity, preventing signal drift and insulation degradation.

7)High Thermal Stability & Robustness

Decomposition temperature above 500°C supports lead-free soldering and high-power operation; UL94 V-0 flammability ensures safety in commercial and aerospace electronics.

2.5 Standard Specifications for RT/duroid 6002 CCL

• Standard Thicknesses: 10, 20, 30, 60 mil (0.254, 0.508, 0.762, 1.524 mm)
• Custom Thickness: 0.005” to 0.250” in 0.005” increments
• Standard Panel Sizes: 18”x12”, 18”x24” (custom sizes available)
• Standard Copper Cladding:
• Electrodeposited:½oz (18μm), 1 oz (35μm)
• Rolled Annealed:½oz, 1 oz
• Optional: heavy copper, aluminum, brass, resistive foils

2.6 Why RT/duroid 6002 Is Superior to General-Purpose Substrates

• Compared to standard FR-4 or lower-grade RF materials, RT/duroid 6002 provides:
• Stable Dk over frequency and temperature (vs. significant drift in FR-4)
• 10–20 x lower dissipation factor (minimizes signal attenuation)
• Far better thermal cycle reliability for aerospace and defense
• Ultra-low moisture absorption for outdoor and harsh environments
• Optimized for microwave designs from 8 GHz to 40 GHz and above

2.8 Typical End Uses for RT/duroid 6002 CCL

• Military & Commercial Radar Systems
• Phased Array & Satellite Antennas
• GPS & GNSS Guidance Systems
• Avionics & Flight-Critical Electronics
• High-Power RF Amplifiers
• Beamforming Networks
• Space & Satellite Communications
• High-Frequency Test Instruments

Conclusion

This 30mil RT/duroid 6002 immersion silver PCB represents a high-reliability, high-performance solution engineered for the most demanding microwave and RF applications. Backed by Rogers’industry-proven laminate technology and strict IPC-Class-2 manufacturing, it delivers unrivaled signal integrity, thermal stability, and mechanical robustness. The separation between PCB design and CCL material knowledge ensures clarity for design, procurement, and quality teams alike. Whether used in radar, avionics, satellite communications, or aerospace systems, thisRT/duroid 6002 PCB provides consistent, long-term performance in mission-critical environments